Data Sheet
Table Of Contents
- Table of Contents
- List of Figures
- List of Tables
- 1: Functional Description
- 2: Hardware and Software Description
- xPico 200 Block Diagram
- Software Features
- Network Co-Processor Mode
- Wireless Microcontroller Mode
- TruPort Serial
- TruPort Socket
- Ethernet to Wi-Fi Bridge
- Concurrent Soft AP and Client Mode
- Enterprise Wi-Fi Security (802.11i, 802.1X/EAP)
- InfiniShield Security
- Wi-Fi Connection Profiles
- Configuration and Management Interface
- Reliable Firmware Over-The-Air (FOTA) Updates
- Power Management
- Pre-integration with MACH10 Platform
- Remote Gateway Management with Lantronix Gateway Central
- Integrated Bluetooth Classic and Bluetooth Low Energy Stacks (xPico 250)
- 3: Pin and Pad Definitions
- Note1: The current module supports an external 10/100 Mbps Ethernet PHY via the RMII interface.
- Note2: The logic IO pins are 3.3V tolerant.
- Note3: SMT Pins 67 to 75 are the ground pads under the module. These pads must be connected to ground. These pads also provide thermal relief for the module. It is recommended that multiple vias for each pad be used to connect the ground pads to t...
- Note 4: All unused IO pins may be left floating, except for the required straps on pins 17, 26, and 29.
- Note 5: Asterisk (*) indicates feature available in a future release. Contact your local sales representative for availability.
- Signal
- Pin
- Signal
- Pin
- Driver Strength
- Edge Connector Pin
- xPico 200 SMT Pin
- Primary Function
- Signal Name
- 4: Interfaces
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Type A USB Host Conn. Pin
- Signal Requirement
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Reset State
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Description
- Pin Name
- 5: IEEE 802.11 Wireless Lan Specifications
- Description
- Feature
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- 6: Bluetooth Specifications
- Description
- Feature
- 7: Antenna Connection Options
- Approved Region
- Vendor Part Number
- Vendor
- Lantronix Part Number
- Peak Gain Typical
- Antenna Type
- Peak Gain Typical
- Antenna Type
- 8: Electrical Characteristics
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- TypicalxPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- Typical xPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Peak Current Typical
- Average Current
- Soft AP/Wi-Fi Client
- Power Mgmt
- Parameter
- Unit
- Tolerance
- TYP.
- Rate
- Mode
- Unit
- Max
- TYP.
- Min.
- Rate
- Mode
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Max
- Rate
- Mode
- Typical
- Receiver Characteristics
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- 9: Package Description and Mechanical Footprint
- Description
- Category
- 10: Product Information Label
- Example
- Description
- Field
- 11: Compliance
- Labeling of the End Product
- Federal Communication Commission Interference Statement (xPico 240/250)
- Industry Canada Statement (xPico 240/250):
- Radiation Exposure Statement:
- Déclaration d'exposition aux radiations:
- This device is intended only for OEM integrators under the following conditions: (For module device use)
- Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositive module)
- IMPORTANT NOTE:
- NOTE IMPORTANTE:
- Plaque signalétique du produit final
- Manual Information To the End User
- Manuel d'information à l'utilisateur final
- Caution :
- Avertissement:
- RoHS, REACH, and WEEE Compliance Statement
- 12: Ordering Information
- Description
- Part Number
- Description
- Part Number
- Description
- Part Number
xPico
®
200 Series Embedded Wi-Fi
®
Gateway Data Sheet 41
9: Package Description and Mechanical Footprint
The xPico 200 module comes in two different mechanical packages. The first is an SMT module
with an LGA footprint. The LGA footprint version is for SMT applications. The second
mechanical package is the xPico 200 module mounted on an edge card. The mechanical
dimensions for both options are shown below. Both mechanical packages also come with options
for two U.FL connectors for connection to external antennas or a single on-module antenna.
Note, Bluetooth is not available for the options with on-module antenna.
Dimensions
The size and thickness of the xPico 200 module is 25 mm (L) x 17 mm (W) x 2.53 mm (H) +/-
0.3 mm (including shielding). The PCB footprint is shown in the figure on the next page.
Figure 9-1 xPico 200 Embedded Wi-Fi Gateway (On-Module Antenna)
Figure 9-2 xPico 200 Embedded Wi-Fi Gateway (Dual U.FL)
Note: Wi-Fi Diversity not available on units with Bluetooth.