Data Sheet
Table Of Contents
- Table of Contents
- List of Figures
- List of Tables
- 1: Functional Description
- 2: Hardware and Software Description
- xPico 200 Block Diagram
- Software Features
- Network Co-Processor Mode
- Wireless Microcontroller Mode
- TruPort Serial
- TruPort Socket
- Ethernet to Wi-Fi Bridge
- Concurrent Soft AP and Client Mode
- Enterprise Wi-Fi Security (802.11i, 802.1X/EAP)
- InfiniShield Security
- Wi-Fi Connection Profiles
- Configuration and Management Interface
- Reliable Firmware Over-The-Air (FOTA) Updates
- Power Management
- Pre-integration with MACH10 Platform
- Remote Gateway Management with Lantronix Gateway Central
- Integrated Bluetooth Classic and Bluetooth Low Energy Stacks (xPico 250)
- 3: Pin and Pad Definitions
- Note1: The current module supports an external 10/100 Mbps Ethernet PHY via the RMII interface.
- Note2: The logic IO pins are 3.3V tolerant.
- Note3: SMT Pins 67 to 75 are the ground pads under the module. These pads must be connected to ground. These pads also provide thermal relief for the module. It is recommended that multiple vias for each pad be used to connect the ground pads to t...
- Note 4: All unused IO pins may be left floating, except for the required straps on pins 17, 26, and 29.
- Note 5: Asterisk (*) indicates feature available in a future release. Contact your local sales representative for availability.
- Signal
- Pin
- Signal
- Pin
- Driver Strength
- Edge Connector Pin
- xPico 200 SMT Pin
- Primary Function
- Signal Name
- 4: Interfaces
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Type A USB Host Conn. Pin
- Signal Requirement
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Reset State
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Description
- Pin Name
- 5: IEEE 802.11 Wireless Lan Specifications
- Description
- Feature
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- 6: Bluetooth Specifications
- Description
- Feature
- 7: Antenna Connection Options
- Approved Region
- Vendor Part Number
- Vendor
- Lantronix Part Number
- Peak Gain Typical
- Antenna Type
- Peak Gain Typical
- Antenna Type
- 8: Electrical Characteristics
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- TypicalxPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- Typical xPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Peak Current Typical
- Average Current
- Soft AP/Wi-Fi Client
- Power Mgmt
- Parameter
- Unit
- Tolerance
- TYP.
- Rate
- Mode
- Unit
- Max
- TYP.
- Min.
- Rate
- Mode
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Max
- Rate
- Mode
- Typical
- Receiver Characteristics
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- 9: Package Description and Mechanical Footprint
- Description
- Category
- 10: Product Information Label
- Example
- Description
- Field
- 11: Compliance
- Labeling of the End Product
- Federal Communication Commission Interference Statement (xPico 240/250)
- Industry Canada Statement (xPico 240/250):
- Radiation Exposure Statement:
- Déclaration d'exposition aux radiations:
- This device is intended only for OEM integrators under the following conditions: (For module device use)
- Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositive module)
- IMPORTANT NOTE:
- NOTE IMPORTANTE:
- Plaque signalétique du produit final
- Manual Information To the End User
- Manuel d'information à l'utilisateur final
- Caution :
- Avertissement:
- RoHS, REACH, and WEEE Compliance Statement
- 12: Ordering Information
- Description
- Part Number
- Description
- Part Number
- Description
- Part Number
xPico
®
200 Series Embedded Wi-Fi
®
Gateway Data Sheet 7
regulated industries where the constant change in Wi-Fi technologies and certification would
typically make it difficult or cost prohibitive to incorporate a wireless solution.
Product Features
♦
Dual-band (802.11 a/b/g/n) for high performance industrial Wi-Fi
♦
xPico 270 adds 802.11ac
♦
2.4 GHz and 5 GHz bands supported
♦
IEEE 802.3 10/100 Mbps Ethernet (RMII)
♦
Compliant with Bluetooth Core Specification version 4.2 including BLE - xPico 250/270
♦
Support for Bluetooth Generic Access Profile (GAP), Generic Attribute Profile (GATT),
Device ID Profile - xPico 250/270
♦
On-module antenna or Dual U.FL
♦
UART (x1), SPI Master (x1), SPI Slave (x1), USB Host/Device and GPIO
♦
Ethernet MAC (RMII), USB, UART – host interfaces
♦
Simultaneous AP and client (STA), AP only, client (STA) only modes
♦
Support for up to 5 simultaneous client connections to Soft AP interface
♦
TruPort
®
Serial and TruPort Socket providing industry’s most compatible device data
access technology
♦
InfiniShield Security – adding integrated root of trust security and data-at-rest and data-
in-motion encryption, authentication and identification
♦
Direct mobile to device service interface via SoftAP technology (xPico 240/250/270) or
Bluetooth (xPico 250/270)
♦
WPA/WPA2 – Personal and Enterprise Wi-Fi Security
♦
SSL/TLS 1.2 with X.509 Certificate Management
♦
Dual Network Support
♦
Embedded Ethernet to Wi-Fi STA or Ethernet to Wi-Fi Soft AP bridge
♦
Integrated Cloud Based Device Management via MACH10
®
platform
♦
Web Service API, XML Configuration, Serial Command API
♦
Modular RF Certification (FCC, IC, ETSI, Japan, AU/NZS, China)
♦
Compact SMT (LGA) Footprint (17mm x 25 mm) or Edge Connector Card Footprint (22
mm x 35.5 mm)
♦
Operating temperature range: -40⁰C to +85⁰C
♦
5-year limited warranty