Specifications

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Page 14
5.3 Production
precautions
Figure 5 Map of the clearance area of the PCB antenna
 The LF-WM03 module must be sliced by an SMT machine and baked before the patch.
 The instrument required for the SMT patch
 Reflow welding patch machine
 AOI tester
 Caliber 6-8mm nozzle
 Bake the required equipment
 Cabinet oven
 Anti-static, high temperature tray
 Anti-static high temperature gloves
 In the production process of the operators of each station must wear static gloves;
 After baking, wait for the module to naturally cool down to the temperature of 36℃, before wearing
static gloves to take out, so as not to burn;