User Manual

Thermal Specifications
122 Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. Power specifications are defined at all VIDs found in Table 2-2. The processor may be delivered under
multiple VIDs for each frequency.
4. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 7-8. Advanced Server/Workstation Thermal Profile B (4 Core)
Power (W) Maximum T
CASE
(C)
0 57.1
10 59.8
20 62.5
30 65.3
40 68.0
50 70.7
60 73.4
70 76.1
80 78.8
90 81.6
95 82.9
Table 7-9. Standard Server/Workstation Platform Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE (°C)
Maximum
TCASE (°C)
Notes
Launch to FMB 80 5 See Figure 7-5; Table 7-10,
Figure 7-6, Table 7-11
1, 2, 3, 4