User Manual

Thermal Specifications
126 Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. Power specifications are defined at all VIDs found in Table 2-2. The processor may be shipped under
multiple VIDs for each frequency.
4. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1. The Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 7-15 for
discrete points that constitute the thermal profile.
2. Implementation of the Thermal Profile should result in virtually no TCC activation. Utilization of thermal
solutions that do not meet the Thermal Profile will result in increased probability of TCC activation and may
incur measurable performance loss.
30 60.2
40 63.2
50 66.3
60 69.4
Table 7-14. Low Power Platform 40W Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE (°C)
Maximum
TCASE (°C)
Notes
Launch to FMB 40 5 See Figure 7-8; Table 7-15 1, 2, 3, 4
Table 7-13. Low Power Platform 60W Thermal Profile (6 Core) (Sheet 2 of 2)
Power (W) Maximum T
CASE
(C)
Figure 7-8. Low Power Platform 40W Thermal Profile (4 Core)
45
50
55
60
65
0 10203040
Power [W]
Temperature [C]
Y = 0.318*x + 50.4
45
50
55
60
65
0 10203040
Power [W]
Temperature [C]
Y = 0.318*x + 50.4