User Manual

Boxed Processor Specifications
174 Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
Figure 9-6. Top Side Baseboard Mounting-Hole Keep-Out Zones
13
4
5678
B C D
A
123
4
5678
B C D
A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
2X 0.00
0.000[]
2X 0.00
0.000[]
2X 7.50
0.295[]
9.60
0.378[]
12.30
0.484[]
67.70
2.665[]
2X 72.50
2.854[]
32.85
1.293[]
47.15
1.856[]
BALL 1 4
19.17
0.755[]
3.30
0.130[]
29.90
1.177[]
BALL 1 4
62.39
2.456[]
77.90
3.067[]
30.600
1.205[]
49.40
1.945[]
4X NPTH THERMAL RETENTION MOUNTING HOLES
4.03
+0.06 -0.03
0.159
+0.002 -0.001
[]
4X NPTH
SOCKET ILM MOUNTING HOLES
3.80
+0.06 -0.03
0.150
+0.002 -0.001
[]
4X
NO ROUTE
COPPER PAD ON SURFACE
6.00
0.236[]
4X 6.00
0.236[]
2X 9.400
0.3701[]
9.900
0.3898[]
2X 70.600
2.7795[]
22.000
0.8661[]
58.000
2.2835[]
2X 7.50
0.295[]
2X 72.50
2.854[]
85.00
3.346[]
5.00
0.197[]
5.00
0.197[]
85.00
3.346[]
2X 80.00
3.150[]
3X 80.00
3.150[]
D77712 2 02
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
SHEET 2 OF 4DO NOT SCALE DRAWINGSCALE: 3.000
EASD / PTMI
02D77712D
REVDRAWING NUMBERSIZEDEPARTMENT
AS VIEWED FROM PRIMARY SIDE
OF THE MOTHERBOARD
(DETAILS)
SEE DETAIL A
DETAIL A SCALE 6.000
LEGEND, THIS SHEET ONLY
ZONE 1: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE ZONE 2: 7.0 MM MAX COMPONENT HEIGHT 7 ZONE 3: 3.0 MM MAX COMPONENT HEIGHT 7 ZONE 4: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT RETENTION MODULE OR HEAT SINK TOUCH ZONE ZONE 5: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, NO ROUTE ZONE ZONE 6: 1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY 7