Datasheet

Debug Tools Specifications
134 Intel® Xeon® Processor 7400 Series Datasheet
different requirements from the space normally occupied by the heatsink. If this is the
case, the logic analyzer vendor will provide either a cooling solution as part of the LAI
or additional hardware to mount the existing cooling solution.
8.2.2 Electrical Considerations
The LAI will also affect the electrical performance of the FSB, therefore it is critical to
obtain electrical load models from each of the logic analyzer vendors to be able to run
system level simulations to prove that their tool will work in the system. Contact the
logic analyzer vendor for electrical specifications and load models for the LAI solution
they provide.
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