System information

•Ateverypointintheprocess,besurenottodroporstackthesystemboard.
•Ifyouputasystemboarddown,besuretoputitonlyonapaddedsurfacesuchasanESDmator
conductivecorrugatedmaterial.
Note:Thefanassemblyandthebackupbatteryareattachedtothesystemboard.
Foraccess,removetheseFRUsinorder:
•“1010Batterypack”onpage50
•“1020Bottomdoor”onpage51
•“1030Harddiskdrive(HDD)”onpage54
•“1080Keyboard”onpage61
•“1090Palmrestassembly,power-onboardassembly(withcable),andmicrophone”onpage64
•“1100CRTboardassembly(withcable)”onpage68
•“1110Speakerassembly”onpage69
•“1120I/Oboard(forThinkPadX120e)”onpage70
Table22.Locationofmajorsensitivecomponentsonthesystemboard
Followingcomponentssolderedonthetopsideofthesystemboardareextremelysensitive.Whenyouservice
thesystemboard,avoidanykindofroughhandling.
ForThinkPadX100e
a
AccelerometerchipfortheHDDActiveProtectionSystem™
b
NorthBridge
c
CPU
d
SouthBridge
c
b
a
d
72ThinkPadX100eandX120eHardwareMaintenanceManual