FCC ID : BEJLEO3-BAND13 ATTACHMENT E. - User Manual - HCT CO., LTD. SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL:+82 31 639 8517 FAX:+82 31 639 8525 www.hct.co.kr Report No.
Updated File Rev. BAND13 RF board manual Written by Reviewed by Granted by Title Type LEO3 RF (Band13) Hardware Manual 1 2 3 4 Managed by Manual ABSTRACT This document is a hardware RF board manual for LTE user equipment platform. Contents of this document are the description of each blocks and usage directions. It is recommended to peruse this manual before operating RF Board.
Updated File Rev. BAND13 RF board manual 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 [Notice] 1. The product described in this manual may be modified without prior notice for reliability, functionality or design improvement. 2.
Updated File Rev. BAND13 RF board manual 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 CONTENTS 1 Introduction................................................................................................................................ 1 1.1 Scope ..................................................................................................................................... 1 1.2 Terminology....................................................................................................
Updated File Rev. BAND13 RF board manual 1 2 3 4 5 6 7 8 FIGURES Figure 1: Photograph of LEO3 RF ................................................................................................... 3 Figure 2: RF Block Diagram (For RX/TX) ........................................................................................ 4 Figure 3: Diagrams of Power supply................................................................................................
Updated File Rev. BAND13 RF board manual 1 1 Introduction 2 3 1.1 Scope 4 5 6 7 8 This RF board is intended for radio frequency part of LTE user equipment platform to develop and verify LTE user equipment modem. This RF board is connected to 3rd version of LTE user equipment platform (LEO3) as the form of daughter board. This document intends to describe the brief architecture and usages of the board designed as RF part of LEO3 platform. 9 10 11 1.
Updated File Rev. BAND13 RF board manual 1 2 2 Features and Photograph 3 4 2.1 Features 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 2.2 Supporting RF band: BAND-13 Transmitting Frequency band: 777 ~ 787 MHz (10MHz) Receiving Frequency band: 746 ~ 756 MHz (10MHz) 2-Receive path and 1-Transmit path (MISO) +6V dc main power supply 19.
Updated File Rev. BAND13 RF board manual 1 2 Figure 1: Photograph of LEO3 RF 3 4 - Mechanical size of board is 170 (W) X 170 (H) mm 5 LGE Proprietary 3 MCTR Lab.
Updated File Rev. BAND13 RF board manual 1 2 3 Block Diagram and Description 3 4 3.1 Block Diagram 5 1.4-1.6V 1.71-3.0V 2.7-3.0V 2.7-3.0V 1.4-1.6V 1.71-3.0V 2.7-3.0V 2.7-3.0V 6 7 8 Figure 2: RF Block Diagram (For RX/TX) 9 10 11 3.2 Block Description 12 13 3.2.1 RX Blocks 14 15 16 17 Two receive paths, RX0 path and RX1 path, are designed for MISO technology to increase the receiving data throughput.
Updated File Rev. BAND13 RF board manual 1 2 3 4 5 Gain switching time: under 6 us LNA2 Gain: 0/-6/-12 dB Gain deviation: +/-3 dB NFDSB:12dB – 42dB IP1dB: -15dBm 6 7 8 9 10 11 12 ADC - Dual 10-bit, 150MSPS analog-to-digital converter - 10-bit dedicated for each I/Q data - A/D clock speed: 61.
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Updated File Rev. BAND13 RF board manual 1 2 4 Interface 3 4 5 6 7 The RF board for interfacing with LEO3 platform has 3 units of high speed 120pin connector. One of them has the role for main power supply, 6V. The others make the interface between RF to baseband (LEO3 platform) such as data transmitting and receiving, programming the SPI device, transmitting control signals, supplying A/D or D/A clock, monitoring the status and etc. 8 9 4.
Updated File Rev. BAND13 RF board manual 1 2 4.2 Digital I/Q Data & Sampling Cock 3 4 5 6 Figure 4: Diagrams of Data & Clock Signal Interface 7 8 9 10 4.3 SPI 11 12 13 14 15 16 17 18 There are 3 programmable devices on RF board by using 3 wire SPI interface. 3 units SPI blocks exist on the interface with baseband platform. They are listed at Table 1 (Also refer to block diagram at Figure 5). st nd At this list, 1 transceiver and 2 transceiver consist of each SPI0 and SPI1.
Updated File Rev. BAND13 RF board manual 1 2 3 4 5 Figure 5: Diagram of SPI interface 6 7 8 9 4.4 Control signals (GPIO’s) 10 11 For control the RF blocks, the control signals from LEO3 platform are connected as the below.
Updated File Rev. BAND13 RF board manual 1 2 5 Placement Map 3 4 5 Figure 6: Top placement map of LEO3 RF (Band13) 6 7 LGE Proprietary 10 MCTR Lab.
Updated 1 File BAND13 RF board manual Notice 2 3 OEM integrators and installers are instructed that the phrase. This device contains 4 Warning: Exposure to Radio Frequency Radiation The radiated output power of this device is far below the FCC radio frequency exposure limits. Nevertheless, the device should be used in such a manner that the potential for human contact during normal operation is minimized.
Updated File Written by Rev. LEO3 Platform Board Manual.doc 2009/05/08 Reviewed by Granted by Title Type LEO3 Platform Board Manual 1 1.0 Managed by Manual ABSTRACT 2 3 4 HISTORY Rev Status Date Author Contents 5 6 KEY WORDS 7 8 ©Copyright, 2009 By LG Electronics Inc. All rights reserved. No part of this document may be reproduced in any way, or by any means, without the express written permission of LG Electronics Inc LGE Proprietary i MCTR Lab.
Updated File 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Rev. LEO3 Platform Board Manual.doc 2009/05/08 1.0 CONTENTS 1 Introduction................................................................................................................................ 1 1.1 Scope ..................................................................................................................................... 1 1.2 Terms and Definitions .................................................................
Updated File Rev. LEO3 Platform Board Manual.doc 2009/05/08 1.0 1 2 3 4 5 FIGURES Figure 1. LEO3 Platform (Top Side) ................................................................................................ 2 Figure 2. LEO3 Platform (Bottom Side)........................................................................................... 3 Figure 3. LEO3 Platform Board Layout............................................................................................
Updated File Rev. LEO3 Platform Board Manual.doc 2009/05/08 1.0 1 2 3 4 5 6 7 TABLES Table 1. DIP switch setting for L1000 boot configuration ................................................................. 5 Table 2. DIP switch setting for manual IRQ generation.................................................................... 5 Table 3. DIP switch setting for LED_DEBUG................................................................................... 6 Table 4. DIP switch setting for Ethernet PHY.
Updated File 2009/05/08 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Rev. LEO3 Platform Board Manual.doc 1.0 1 Introduction 1.1 Scope This document describes briefly the board level operations, key features and the environment of the LEO3 Platform Rev.A / Rev.B. The purpose of this platform is the verification of LG LTE ASIC, namely ‘L1000’, and the evaluation of LG UE system performance. The further details about the characteristics and functions of L1000 are available on other documents.
Updated File · 1 Rev. LEO3 Platform Board Manual.doc 2009/05/08 1.0 Debugger port (JTAG + ETM11) 2 3 4 5 2.1.2 · · Memory MCP with 2Gb 8bit NAND flash / DDR333 1Gb 32bit M-DDR 64Mb Serial NOR flash (4wire SPI) 2.1.
Updated File 2009/05/08 Rev. LEO3 Platform Board Manual.doc 1.0 1 Rx1 ANT Rx0/ Tx ANT 2 Figure 2. LEO3 Platform (Bottom Side) 3 4 5 2.2.2 Placement Map 6 Figure 3. LEO3 Platform Board Layout 7 LGE Proprietary 3 MCTR Lab.
Updated File 2009/05/08 Rev. LEO3 Platform Board Manual.doc 1.0 1 2 3 Power Supplies 3 4 5 6 7 3.1 Main Board Power Main external power is supplied from DC input jack on the upper left corner of the baseband platform board. The regular input voltage is 12V. For this platform, an external power adaptor ‘CLG-60-12’ from Mean Well is provided with maximum current rating of 5A. 8 9 10 11 12 13 3.2 RF Board Power The RF board power is supplied from the mian board RF connector.
Updated File 2009/05/08 Rev. LEO3 Platform Board Manual.doc 1.0 1 SW7 No. Name 1 JTAG_CFG(0) Defaul t ON 2 JTAG_CFG(1) OFF 3 EPI_MODE ON 4 USB_MODE OFF 5 PWR_CUT_MODE OFF 6 REFCLK_SEL OFF 7 NAND_CFG(0) OFF 8 NAND_CFG(1) OFF No.
Updated File 2009/05/08 Rev. LEO3 Platform Board Manual.doc 1.0 SW6 No. Name 1 IRQ(0) Defaul t OFF 2 IRQ(1) OFF 3 IRQ(2) OFF 4 IRQ(3) OFF Description [OFF] Low level [ON] High level *ON: High, OFF: Low [OFF] High level (Rev.A), Low level (Rev.B) [ON] Low level (Rev.A), High level (Rev.B) *ON: High, OFF: Low (Rev.A) *ON: Low, OFF: High (Rev.B) [OFF] High level [ON] Low level *ON: Low, OFF: High [OFF] High level [ON] Low level *ON: Low, OFF: High Table 2.
Updated File 2009/05/08 Rev. LEO3 Platform Board Manual.doc 1.0 1 2 3 4 * Caution) Please, be careful to switch ‘ON” for the SW5. Switching ‘ON’ should be done only when the corresponding GPIO directions have defined as ‘Input’. Otherwise (if defined as ‘Output’), it would be possible for the L1000 to have a damage. SW5 No.
Updated File 2009/05/08 Rev. LEO3 Platform Board Manual.doc 1.0 SW4 No.
Updated File Rev. LEO3 Platform Board Manual.doc 2009/05/08 1.0 1 Jumper No. J3 J4 Name UART_CTS/ UART_RTS UART_RXD/ UART_TXD Default 1-2 connection 3-4 connection 1-2 connection 3-4 connection [1-2, [1-3, [1-2, [1-3, 3-4] 2-4] 3-4] 2-4] Description for the cross UART cable for the straight UART cable for the cross UART cable for the straight UART cable Table 5.