Service Manual Service Manual U250/KU250 Model : U250/KU250 Date: June, 2007 / Issue 1.
Table Of Contents 1. INTRODUCTION .............................. 5 1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 2. PERFORMANCE...............................7 2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radio Performance ..................................8 2.4 Current Consumption.............................14 2.5 RSSI BAR ................................
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1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G.
2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Shape Size Specification GSM900/1800/1900 and WCDMA2100 - Bar type Handset 110.9 X 46.7 X 15.6 mm Weight Under 83 g (with 950mAh Battery) Power 3.7 V normal, 950 mAh Li-Ion Talk Time Over 200 min (WCDMA, Tx=12 dBm, Voice) (with 950mAh) Over 180 min (GSM, Max Tx Power, Voice) Standby Time Over 350 Hrs (WCDMA, DRX=1.28) (with 950mAh) Over 450 Hrs (GSM, Paging period=9) Antenna LCD LCD Backlight Internal type Main 1.
2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Min Typ. Max Unit TA Power Available power 100 220 240 Vac * CLA : 12 ~ 24 V(DC) 2.3 Radio Performance 1) Transmitter - GSM Mode No Item GSM 100k~1GHz DCS & PCS MS allocated Channel 1G~12.
2. PERFORMANCE No Item GSM 30M ~ 1GHz DCS & PCS MS allocated Channel 1G ~ 4GHz -36dBm 1G~[A]MHz -30dBm [A]M~[B]MHz -36dBm [B]M~4GHz -30dBm -30dBm Radiated 2 30M~1GHz -36dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz -57dBm 1G~[A]MHz -47dBm 1G~[A]MHz -47dBm [A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm [B]M~4GHz -47dBm [B]M~4GHz -47dBm Idle Mode 3 Frequency Error 4 Phase Error ±0.1ppm ±0.
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2. PERFORMANCE 2) Transmitter - WCDMA Mode No Item Specification 1 Maximum Output Power Class 3 : +24dBm(+1/-3dB) 2 Frequency Error ±0.1ppm 3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) 4 Inner Loop Power control in uplink cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4.5 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4.5 Group (10 equel command group) +1 5 Minimum Output Power +8/+12 +16/+24 -50dBm(3.
2. PERFORMANCE No Item Specification 33dB@5MHz, ACP>-50dBm 13 Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.
2. PERFORMANCE 4) Receiver - WCDMA Mode No 1 Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB 3 Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4 In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.
2. PERFORMANCE 2.4 Current Consumption 1) U250/KU250 Current Consumption WCDMA GSM Stand by Voice Call VT Under 2.80 mA Under 290 mA Under 410mA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 2.12 mA Under 320 mA Paging=9 period (Max Tx Power) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On) 2.
2. PERFORMANCE 2.6 Battery BAR Indication Standby Bar 4 Over 3.83 ± 0.05V Bar 4 → 3 3.82 ± 0.05V Bar 3 → 2 3.73 ± 0.05V Bar 2 → 1 3.68 ± 0.05V Bar 1 → Empty 3.58 ± 0.05V Low Voltage, 3.58± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk) Warning message+ Blinking [Interval : 3min(Stand-by) / 1min(Talk)] Power Off 3.20 ± 0.
2. PERFORMANCE 2.
3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quadband GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
3. TECHNICAL BRIEF A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF technique.
3. TECHNICAL BRIEF 3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows: • GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters.
3. TECHNICAL BRIEF The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance.
3. TECHNICAL BRIEF [Fig 1.
3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.3. 6pF 51Ω 91Ω 12pF 100 Ω 91Ω 39 Ω 100 Ω [Fig 1.
3. TECHNICAL BRIEF 3.3 UMTS Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance.
3. TECHNICAL BRIEF WCDMA_2100_TX WCDMA_2100_RX [Figure 1.
3. TECHNICAL BRIEF 3.4 LO generation and distribution circuits The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF.
3. TECHNICAL BRIEF 3.5.2 VCTCXO (X100 : DSA321SCE-19.2M) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC. TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.
3. TECHNICAL BRIEF 3.5.
3. TECHNICAL BRIEF • Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.
3. TECHNICAL BRIEF [Figure1.
3. TECHNICAL BRIEF 3.5.5 GSM PAM (U101 : SKY77318) GSM_PA_RA The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability GaAs HBT technology. With 50Ω and output, no external matching or bias components are required.
3. TECHNICAL BRIEF 3.5.6 UMTS Duplexer(FL104:ACMD-7602) A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; • Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB • Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two.
3. TECHNICAL BRIEF 3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1) • Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA.
3. TECHNICAL BRIEF 3.5.8 Bluetooth (M100 : LBRQ-2B43A) The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250. MSM6245 Bluetooth baseband [Figure1.
3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6245) 3.6.1 General Description A. Features(MSM6245) • Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE • Support for WCDMA (UMTS) uplink data rate up to 384 kbps • High-performance ARM926EJ-S running at up to 225 MHz • ARM Jazelle Java hardware acceleration for faster Java-based games and other applets • QDSP4000 high-performance DSP cores • Integrated Bluetooth 1.
3. TECHNICAL BRIEF USB PM6650 -2M Bluetooth RF Module SPK/RCV VCTCXO GSM Block MIC GSM PAM GSM TX SAW GSM900 Tx GSM1800/1900 Tx GSM900 Rx GSM VCO MAIN LCD GSM1800 Rx GSM1900 Rx MSM6245 Front End Module WCDMA Block 1.3M CAM VGA CAM RTR6275 COUPLER WCDMA PAM WCDMA TX SAW U-SIM HDET WCDMA2100 Tx Duplexer WCDMA2100 Rx WCDMA VCO WCDMA RX SAW NAND, SDRAM FLASH KEYPAD AntSW Logic Figure 1.
3. TECHNICAL BRIEF 3.7 Block Diagram(MSM6245) NAND Flash 512Mbit SDRAM 512Mbit MSM6245 UMTS, WCDMA Modem QDSP 4000 Open GL ES 3D, 2D BT 1.2 processor PLL VIDEO ARM 926ejs With Jazelle QDSP 4000 I/O Conn UART2 / RUIM1 UART1 MP3, AAC, EVRC, QCELP AMR, CMX, MIDI USB AUDIO Keypad I/F CONNECTIVITY PM6650 US B Figure 1.11 Simplified Block Diagram of MSM6245 - 36 - UART3 / PMIC SBI MPEG-4 H.263, H.264 GSM/GPRS/EDGE processor DUAL MEMORY BUS GRAPHICS VGA camera EBI 2 JTAG Camera 1.
3. TECHNICAL BRIEF 3.8 Subsystem(MSM6245) 3.8.1. ARM Microprocessor Subsystem The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices. 3.8.2.
3. TECHNICAL BRIEF 3.8.3. GSM features The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature. ■ Voice features ❏ FR ❏ EFR ❏ AMR ❏ HR ❏ A5/1, A5/2, and A5/3 ciphering ■ Circuit-switched data features ❏ 9.6k ❏ 14.4k ❏ Fax ❏ Transparent and non-transparent modes for CS data and fax ❏ No sub-rates are supported. 3.8.4.
3. TECHNICAL BRIEF 3.8.6. MSM6245 device audio processing features ■ Integrated wideband stereo CODEC ❏ 16-bit DAC with typical 88 dB dynamic range ❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path ■ VR- Voice mail + voice memo ■ Acoustic echo cancellation ■ Audio AGC ■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8 (G2) ■ Internal vocoder supporting AMR, FR, EFR, and HR 3.8.7.
3. TECHNICAL BRIEF 3.8.9. Supported multimedia features ■ Provide additional general purpose MIPS by using: ❏ Two QDSP4000s ❏ Dedicated hardware accelerators and compression engines ■ Improve Java, BREW, and game performance ❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine ■ Enable various accessories via USB host connectivity. ❏ Integrated USB host controller functionality ■ Enable compelling visual and audio applications.
3. TECHNICAL BRIEF ■ PNG decoder ■ Pitch bend range support ■ LED/vibrate support ■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) ■ MLZ decoder ■ Integrated PNG/SAF A.T. Table 1-1 Summary of MSM6245 device features Note: 1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS issues when running Bluetooth and video telephony concurrently with any other memory configuration.
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3. TECHNICAL BRIEF 3.8.10. Stereo Wideband CODEC The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components.
3. TECHNICAL BRIEF 3.8.14. General-Purpose Input/Output Interface The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases. 3.8.15. UART The MSM6245 device employs three UARTs.
3. TECHNICAL BRIEF 3.9 Power Block 3.9.1. General MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are : 3.9.2. PM6650 The PM6650 device (Figure 1-1) integrates all wireless handset power management.
3. TECHNICAL BRIEF Figure 1.
3. TECHNICAL BRIEF 3.9.3. Charging control A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer.
3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current.
3. TECHNICAL BRIEF 3.10 External memory interface The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc.
3. TECHNICAL BRIEF EBI1 EBI2 ADDRESS[14:0] NAND_CS* DATA[31:0] NAND_RE* NAND_WE* WE* SDRAM CS* 512Mb CAS* NAND_CLE NAND NAND_WP* 512Mb RAS* NAND_ALE (64MB) CLK_EN NAND_READY CLK DATA[7:0] MSM6245 DQM[3:0] Figure 1.
3. TECHNICAL BRIEF 3.11 H/W Sub System 3.11.1. RF Interface A. RTR6275(WCDMA_Tx, GSM_Tx/Rx) MSM6245 controls RF part(RTR6275) using these signals.
3. TECHNICAL BRIEF B. the others • TRK_LO_ADJ : TCXO(19.
3. TECHNICAL BRIEF 3.11.2. MSM Sub System 3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx VREG_UIM 2.85V USIM CLK USIM Reset MSM6245 USIM CLK PM6650 USIM Data USIM Reset USIM USIM Data Figure 1.16 SIM Interface 3.11.2.2. UART Interface UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
3. TECHNICAL BRIEF 3.11.2.3. USB The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.
3. TECHNICAL BRIEF 3.11.3 HKADC(House Keeping ADC) The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure 1.
3. TECHNICAL BRIEF 3.11.4. Key Pad There are 23 main key buttons in Figure. Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650). COL0 COL1 ROW(0) COL2 COL3 COL4 - CLR MENU ROW(1) 1 2 3 LEFT UP ROW(2) 4 5 6 OK RIGHT ROW(3) 7 8 9 SEND SEARCH ROW(4) * 0 # DOWN BACK Table. Key Matrix Mapping Table VREG_MSMP_2.
3. TECHNICAL BRIEF 3.11.5 Camera Interface U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal. CAMERA PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 32 31 30 29 28 27 26 25 MEGA CAMERA CONNECTOR 22 23 24 1 2 3 4 5 D0 D1 D2 D3 D4 D5 D6 D7 REV_1.
3. TECHNICAL BRIEF The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.
3. TECHNICAL BRIEF The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245. No Name Port 1 VREG_CAM_DVDD_1.8V I DVDD 2 CAM_MCLK I Master Clock(24.
3. TECHNICAL BRIEF 3.11.6 Keypad Light There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from PM6650. KEY_BACK_LIGHT LED(8EA) +VPWR LD400 LEBB-S14H LD403 LEBB-S14H LD406 LEBB-S14H R411 100ohm R414 100ohm R417 LD404 LEBB-S14H LD407 LEBB-S14H 100ohm R418 R415 LD402 LEBB-S14H LD405 LEBB-S14H R413 100ohm LD408 LEBB-S14H R416 100ohm 100ohm 100ohm REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT Figure 1.
3. TECHNICAL BRIEF 3.11.7. LCD Module (NM176CN1 : Tovis) - The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors. - LCD Driver IC: NT3916 (NOVATEK). - 16 bit CPU interface Parallel 3.11.8.
3. TECHNICAL BRIEF 3.11.8.1. Audio Signal Processing & Interface Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to receiver (or speaker).
3. TECHNICAL BRIEF 36 RCVRCV+ MSM6245 CODEC pins Near to MSM 47p C201 MIC2N MIC2P MIC1N MIC1P HPH_R HPH_L C200 47p 22n C210 MSM pin W18 (CODEC VSS) AE20 AA20 AF20 C211 AF21 AE19 AF19 AC20 AC19 AC21 AA19 AC22 AA18 T15 AF18 AE18 W17 AA17 AC17 Place near C212 0.
3. TECHNICAL BRIEF AUDIO SELECT_SPK&RCV U401 NLAS5223BMNR2G 1 C410 0.01u 10 VCC NO2 NO1 COM2 2 SPK- 3 SPK_RCV- COM1 10 RCV_EN_N IN2 10 7 IN1 NC2 NC1 GND 5 R421 6 RCV+ EVL14K02200 EVL14K02200 VA414 R422 SPK_RCV+ 8 4 RCV- SPK+ 9 VA412 +VPWR REV_B MIC MICBIAS C417 47p C416 10u REV_B : SUMY0010301 --> SUMY0003802 R424 2.2K MIC400 OB4-15L42-C33L 39p 39p 2.2K C420 C421 R425 INSTPAR C418 0.1u C419 0.
3. TECHNICAL BRIEF Audio AMP NCP2890DMR2 C422 C423 C4275600p 1K 1K C4265600p LINE_N LINE_P R427 R429 0.1u 0.1u R428 5.6K 2 20K _SD OUTB BYPASSU402 3 INP 4 INM R430 5.
3. TECHNICAL BRIEF 3.11.8.2. Audio Mode There are three audio modes (Voice call, speaker phone, MIDI/MP3). MODE Voice Call Speaker phone Device Description Receiver Mode Receiver Voice Call Loud Mode Speaker Phone Headset Headset Voice Call Loud Mode Speaker Phone Loud Mode Speaker MIDI Bell Headset Headset MIDI Bell Loud Mode Speaker MP3 Headset Headset MP3 MIDI MP3 Table. Audio Mode Audio & Sound Main Component There are 6 main components in U250/KU250. Component Design No.
3. TECHNICAL BRIEF 3.12 Main Features 1. LG-U250/KU250 Main features - Bar Type - WCDMA(2100) + GSM Tri-Band (900/1800/1900) - Color LCD (Main:262K TFT, 1.76”) - Dual Camera (1.3Mega + VGA(0.
3. TECHNICAL BRIEF 2.
3. TECHNICAL BRIEF RF SW100 U101 U500 FL101 U100 FL104 U103 X100 Reference Description Reference Description SW100 Ant.
3. TECHNICAL BRIEF Logic / Audio BAT300 U303 CN403 CN401 U402 Reference Description Reference Description BAT300 Backup Battery CN401 MMI connector (18pin) U303 1.3M Cam. LDO CN403 1.3M Cam.
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4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.
4. TROUBLE SHOOTING Block Diagram Block Ref.
4. TROUBLE SHOOTING 4.
4. TROUBLE SHOOTING 4.
4. TROUBLE SHOOTING 4.4 Checking VC-TCXO Block The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and BB part. TCXO X100 DSA321SCE-19.2M NC3 7 NC4 8 NC2 NC1 6 5 VREG_TCXO_2.85V 3 OUTPUT GND 2 100ohm VCONT 1 TRK_LO_ADJ 0.01u 0.1u C182 1000p 19.2MHz C181 R124 VREG_BT_2.85V 4 VCC C183 TP1 TP4 R128 C185 100K 100p C186 TCXO_PM 1000p VCC C187 1000p TP2 C188 5 0.
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4. TROUBLE SHOOTING 4.5 Checking Front-End Module Block TP1 11 19 15nH C117 10p Rev.B 7 8 10 12 13 15 17 20 21 23 VDD GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 ANT VREG_RF_SMPS Rev.C U500 Rev.
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4. TROUBLE SHOOTING 4.6 Checking UMTS Block 4.6.1 Checking Tx level TP1 TP2 TP3 TP4 ANT101 ANT102 TP1 C450 22p 1p C437 C101 56p SW100 ANT G2 G1 KMS-507 C102 NA L101 NA RF L102 100nH TP2 U500 11 Rev.D WCDMA Rev_1.0 C154 1.5p Rev.D +VPWR 9 L123 1nH Rev_1.0 C162 8 GND4 RFOUT L122 NA C157 10nH RFIN GND1 IN 3 U103 VCC1 FL102 5 EFCH1950TDF1 O1 G3 1 G2 G1 2 1 2 3 2 3.
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4. TROUBLE SHOOTING 4.6.2 Checking UMTS PAM Control Block • PAM control signal 1. PWR_DET : UMTS Tx Power Detected value (Check R120) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V) 4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V) 5. PA_ON : Turns the PA on and off 6. PA_R0 : Control signals that step the active PA mode and bias VREG_TCXO_2.
4. TROUBLE SHOOTING 4.6.3 Checking RF Rx Level TP1 TP2 TP4 Vbias TP3 ANT101 ANT102 TP1 C450 22p 1p C437 C101 56p SW100 ANT G2 G1 KMS-507 C102 NA L101 NA RF L102 100nH R U500 D Vbias TP2 TP4 WCDMA Rev_1.0 +VPWR +VPWR C155 4.7u L404 1.8nH C158 15p 9 L123 1nH Rev_1.0 C162 8 GND4 RFOUT C157 10nH L122 NA RFIN O1 G3 IN L121 1nH 1 G2 G1 3 U103 VCC1 GND1 C156 100p FL102 5 EFCH1950TDF1 2 Rev.D 1 2 Rev.D L409 4.7nH C161 C444 2.2p 2.2p 3 C164 0.
4.
4. TROUBLE SHOOTING 4.
4. TROUBLE SHOOTING 4.7.1 Checking RF Tx level TP1 TP3 TP2 4.7.2 Schematic of RF Tx level C101 56p SW100 ANT G1 RF KMS-507 C102 NA L102 100nH 11 1K 1K 18 CTRL1 22 CTRL2 C110 33p Rev.D L116 10nH C138 NA 15 TP2 11 19 TP3 21 VBATT DCS_PCS_OUT EGSM_OUT DCS_PCS_IN U101 RSVD_GND P_GND 2 C139 68p 20 C137 NA C134 0.01u C438 100p 6 C441 5.6p R107 100ohm L115 18nH C121 33u C123 0.01u VCC1A L403 1.
4. TROUBLE SHOOTING 4.7.
4. TROUBLE SHOOTING 4.7.4 Checking PAM Block TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3. GSM_PA_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V) TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V TP1 TP4 TP2 TP3 GSM_PA_RAMP TP4 Rev.D L116 10nH TP1 C134 0.01u C438 100p C138 NA C121 33u C123 0.
4. TROUBLE SHOOTING 4.7.5 Checking RF Rx Block TP1. DCS RX INPUT TP1 TP3 TP2. PCS RX INPUT TP3. GSM RX INPUT TP2 L102 100nH Rev.C Rev.C C439 5p C440 5p 7 8 10 12 13 15 17 20 21 23 VDD GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 5 6 1 2 3 4 9 TP1 DCS C105 NA 0.5p C190 C442 5.
4.
4. TROUBLE SHOOTING 4.8 Checking Bluetooth Block Test Point of the Bluetooth Block TP2 TP1. VREG_BT_2.85V TP2. VREG_MSMP_2.7V TP1 TP3. TCXO_BT TP3 TP4. BT ANT Output TP4 Test Point of the Bluetooth Block TP4 BLUETOOTH ACS2450HBAXX NC1 R118 FEED M100 9 C172 1u 3 C173 2.2u 2 R123 10 VREG_MSMP_2.7V 0 0.1uF 2.
4. TROUBLE SHOOTING Start TP1,TP2 Signals exits? NO Change the Main board YES TP3 Is clock ok? 19.
4. TROUBLE SHOOTING 4.9 Power ON Troubleshooting Power On sequence of U250/KU250 is : PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up → VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V, VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and PS_HOLD assert to PMIC Start NO Change or charging the Battery voltage. higher than 3.20V? Battery YES NO Check the Key Dome Key press? YES NO VREG_MSMC_1.2V,VREG_MSMP_2.7V, VREG_MSME_1.
4. TROUBLE SHOOTING VREG_MSMC VREG_MSME VREG_MSMP X300 : 32.768Khz VREG_MSMA [U250/KU250 Main PCB BOTTOM] - 95 - R306 : 19.
4. TROUBLE SHOOTING 4.10 Charger Troubleshooting CHARGER ICHARGEOUT SI3493DV-E3 Q301 R313 USB_VBUS 0.
4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector NO Connection OK? Change I/O connector Yes NO Change TA (or USB Cable) Is the TA (or USB Cable) voltage 5.1V (or 5.
4.
4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.11 USB Troubleshooting USB Initial sequence of U250/KU250 is : USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V → USB_DAT is triggered → USB work. Start Power is on? NO Go to power on trouble shooting YES Cable is inserted? NO Insert cable YES Q400 pin 4 is 5V? NO Check Q300 (pin 4) YES USB_D+ is 3.
4. TROUBLE SHOOTING 4.12 SIM Detect Troubleshooting USIM Initial sequence of U250/KU250 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work Start Re-insert the SIM card Work well? Yes End No VREG_UIM_2.85V is 2.
4. TROUBLE SHOOTING 2 R317 2 USIM_P_RST_N 3 USIM_P_CLK 7 USIM_P_DATA J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12 VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK Figure. USIM part schematics - 101 - EVLC18S02003 VA302 smd_1005h_5_r L302 56nH C353 GND3 GND4 33p EVLC18S02003 VA300 USIM_P_DATA VREG_USIM_2.85V 15K 0.
4. TROUBLE SHOOTING 4.13 Camera Troubleshooting Camera control signals are generated by MSM6245. 4.13.
4. TROUBLE SHOOTING 4.13.
4. TROUBLE SHOOTING C350 C447 C347 U501 C348 U303 C349 CAMERA LDO +VPWR CAM_LDO_EN C447 1u PGND C347 1u U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND 9 +VPWR CAM_LDO_EN VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV REV_D - 104 - VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C348 1u C349 1u VREG_CAM_DVDD_1.
4. TROUBLE SHOOTING 4.14 Keypad Backlight Troubleshooting Key Pad Back Light is on as below : Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On Start Key press NO Check battery +VPWR is above 3.
4. TROUBLE SHOOTING 4.15 Main LCD Troubleshooting Main LCD control signals are generated by MSM6245.
4. TROUBLE SHOOTING 4.
4.
4. TROUBLE SHOOTING 4.17 Headset path MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector) Start Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset.
4.
4. TROUBLE SHOOTING 4.18 Speaker phone path MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog Switch(U401) → Speaker Start Connect the phone to network equipment and setup call Setup 1KHz tone out YES END Can you hear the tone? NO Sine wave appears at NO Change the Main board R429/R427 and C423/C422 And R431/R426 ? YES SPK_AMP_EN is2.
4.
4. TROUBLE SHOOTING 4.19 Main microphone MIC400 → MIC1P, MIC1N (MSM6245) Start Make a call MIC_BIAS(C416) is 1.
4.
4. TROUBLE SHOOTING 4.20 Headset microphone Headset → C210/C211 → MIC2P, MIC2N (MSM6245) Start Make a call OK Change the headset and retry END NO YES NO Change the MAIN board HOOK_KEY is detected? Yes NO MICBIAS is biased by 1.8V? Change the MAIN board Yes NO Sine wave appears at C210/C211 ? Yes Change the Main board - 115 - Change the headset or Main board and retry.
4.
4. TROUBLE SHOOTING 4.21 Vibrator The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin). The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.
4.
5. DOWNLOAD 5. DOWNLOAD 5.1 U250/KU250 DOWNLOAD 5.1.1 Introduction LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
5. DOWNLOAD 5.1.2.1 Connecting to PC • Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.) • The status Ready is displayed when the application is ready for downloading.
5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse… button to select image files to be downloaded on the handset. 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.
5. DOWNLOAD 5.1.2.2 Choosing image files • Select the image folder, where all the image files are located, by clicking on the Browse…. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.
5. DOWNLOAD • Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.
5. DOWNLOAD • If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse… button. U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 • Click on the START button to start downloading.
5. DOWNLOAD 5.1.2.3 Downloading • This message box informs that a new file for NV backup will be created in the displayed NV_U250/KU250 file name in the LGMDP installation directory. • Backing up NV data and backed up NV data U250/KU250 will be stored in the LGMDP installation directory. • Erasing the existing directories and files U250/KU250 before the Module image is downloaded.
5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the U250/KU250 Backing up process. User can also restore NV data using NV Default image selection.
5.
5. DOWNLOAD 5.1.2.4 Tools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu.
5. DOWNLOAD 5.1.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.1.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image. The phone supports a special mode called emergency mode.
5. DOWNLOAD • The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the Connect button to continue. U250/KU250 • Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC.
5. DOWNLOAD 5.1.3.2 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. U250/KU250 • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.
5. DOWNLOAD • Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.
5. DOWNLOAD 5.1.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format. D:\LGMDP\004400-01-429926\_COM14_ LGMDP folder name IMEI number Port number 4) Recommended that the Module and Media Image have to be downloaded at the same time.
6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & UMTS RF Block [Fig 2.
6. BLOCK DIAGRAM [Table 2.
6. BLOCK DIAGRAM 6.2 Interface Diagram 6.2.1 RTR6275 & MSM6245 Interface Diagram [Fig 2.
6. BLOCK DIAGRAM 6.2.2 Memory Interface ADDRESS[14:0] [Fig 2.
6. BLOCK DIAGRAM 6.2.3 USB,UART,SIM,JTAG Interface [Fig 2.
6.
6. BLOCK DIAGRAM 6.2.
6.
- 142 -
7. CIRCUIT DIAGRAM 1 3 2 4 5 14 ANT_SEL0 ANT101 ANT102 C450 22p G1 HIGH LOW GSM 850/GSM 900 TX/ WCDMA LOW HIGH LOW GSM 1800/GSM 1900 TX HIGH HIGH A RF KMS-507 C102 NA L101 NA G2 LOW GSM 850/ GSM 900 RX L102 100nH TX_IP C103 180p Rev.C Rev.C U500 5p Rev.C 5 6 1 2 3 4 9 C105 NA DCS 0.5p C190 C106 5p C440 DCS_PCS_TX GSM_TX 55 8.
7. CIRCUIT DIAGRAM 1 2 3 4 6 5 7 8 10 9 12 11 13 14 16 15 RCVRCV+ HPH_R HPH_L MIC2N MIC2P MIC1N MIC1P MICBIAS BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20 2200p cap => place between D12(VDDA1) and F12(DAC_REF) H11 D5 J21 C231 2200p CAM_MCLK LCD_IF_MODE_0 A6 N19 W15 C232 1000p VGA_CAM_RESET_N AA15 AE13 LCD_LDO_EN LCD_RESET_N HOOK_KEY H9 B6 F8 C233 1000p C234 1000p C235 1000p C236 0.
7. CIRCUIT DIAGRAM 6 7 8 9 10 11 12 VREG_TCXO_2.85V A HYC0UEH0MF3P-6SS0E VDD_MSM : 0.1uF VDD_ANA : 0.1uF VDD_RUIM : 0.1uF VDD_RF : 0.1uF VDD_WLAN : 0.1uF VDD_MAIN : 0.1uF VDD_SPKR : 0.1uF C305 C307 C308 C310 0.1u 4.7u 4.7u C304 C306 0.1u 0.1u C303 0.1u 0.1u 0.1u C301 C302 0.1u 1u C316 +VPWR +VPWR +VPWR 2.2u C311 1u 64 1u 59 53 51 52 R306 51 51K 50 R307 49 51K R308 48 47 TP308 45 44 43 SLEEP_CLK LCD_LDO_EN 1 USIM_P_RST_N VREG_MSMP_2.
7. CIRCUIT DIAGRAM 1 2 3 4 5 7 6 9 8 10 11 LCD CONNECTOR 12 14 13 16 I/O CONNECTOR 2.2K VREG_MSMP_2.7V 15 MICBIAS R400 3 4 C400 0.1u FL400 L400 56nH TP401 5 MOTOR_PWR- 5 3 2 8 7 6 R410 VREG_MSMP_2.7V FL405 80.6K 1 LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR 0.1u C409 PLW0501H-LF D402 D VBAT 20 22 C REV_1.
LGMC - 147 - U250/KU250 8.
LGMC - 148 - U250/KU250 8.
9. Calibration & RF Auto Test Program (Hot Kimchi) 9. Calibration & RF Auto Test Program (Hot Kimchi) 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory C: Cm_Grut Common dll_serialat LG_CL_009.dll Log At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV.dll DLL_E5515CD.DLL DLL_PwrControlD.dll Dll_SerialATD.dll LG_CL_011.dll PwrSupply_Cmd.
9. Calibration & RF Auto Test Program (Hot Kimchi) Hot_Kimchi Debug image Log ComLMPLib_11.dll Dll_EzLooksMQ_004.dll GuiTk115d.dll HK_25.exe ijl11.dll SBCmd.xml ShieldBox_DllD.dll Model KU250 Log LG_RfTest_E5515C_211.dll AutoSetup_110.xml QMSL_MSVC6R.dll Cal_Setup_Test.xml Ezlooks.xml LG_RfCal_Q3G6280N_Polar_006.dll Procedure_KU250_103.xml script_auto_001.xml : Directory script_cal_003.xml : File Spec_3GPP_030.
9. Calibration & RF Auto Test Program (Hot Kimchi) dll,ocx (Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat Result UI Auto KU250 Cal KU250 CalAuto KU250 image result.bmp LG_UI_Ad6500_002.dll LG_UI_EmKU250_001.dll : Directory LG_UI_Qu6250_003.dll : File LG_UI_Qu6275_004.dll 1. _New_HK_0808.
9. Calibration & RF Auto Test Program (Hot Kimchi) 9.2 How to use HOT KIMCHI ➀ ➁ ➂ * Procedure 1. Click “Logic Operation” of “SETTING” menu bar 2. Select “UART Port” that PC can communicate with the phone 3.
9. Calibration & RF Auto Test Program (Hot Kimchi) KU250 ➄ Click "Start" ➃ Select "U250/KU250" * Procedure 4. Select the model name “U250/KU250” 5.
10. Factory Test Mode 10. Factory Test Mode 10.1.
10. Factory Test Mode 10.2. WCDMA Test Mode 1) Click “Tools >> FTM GUI WCDMA” 2) Select “FTM” Mode 3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is written at Rx UHF automatically. 4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is decided. 5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power mode. 6) Depending on a situation, Click “Tx On” or “Tx Off”. Channel Select Tx Control 7) Set Rx mode.
10. Factory Test Mode 10.3. GSM Test Mode 1) To switch GSM Mode, Select Mode -> GSM mode at menu commands 2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900” 3) Write wanted channel. We usually set “1” 4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value 5) Click “Tx On” or “Tx Off”. 6) SET RX mode. Click LNA Range, 0~4.
11. EXPLODED VIEW & REPLACEMENT PART LIST 11.
- 158 -
11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts Level Location No.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number 4 MTAB01 TAPE,PROTECTION MTAB0178301 4 MTAD00 TAPE,WINDOW 4 Spec Color Remark COMPLEX, (empty), , , , , Without Color 32 MTAD0065901 COMPLEX, (empty), 0.2, , , , Without Color 30 MWAE00 WINDOW,CAMERA MWAE0024501 COMPLEX, (empty), 1.0, , , , Without Color 31 4 SJMY00 VIBRATOR,MOTOR SJMY0007903 3 V,0.85 A,4*8 ,Height 5.
11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Location No. 3 GMEY00 SCREW MACHINE,BIND GMEY0011201 3 SAFY00 PCB ASSY,MAIN SAFY0196602 4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0072901 5 ACKA00 CAN ASSY,SHIELD ACKA0002101 5 SUMY00 MICROPHONE SUMY0010301 FPCB ,-42 dB,4*1.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C123 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C124 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C126 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C127 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C128 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C173 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 6 C174 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C176 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C177 CAP,CHIP,MAKER ECZH0004402 0.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C319 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C320 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C321 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C322 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C323 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C357 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C358 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 6 C389 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 6 C400 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C401 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 6 C402 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C436 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 6 C437 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C438 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C439 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C440 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C441 CAP,CERAMIC,CHIP ECCH0000185 5.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 FL405 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL406 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL407 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL408 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 Q301 TR,FET,P-CHANNEL EQFP0004701 TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S) MOSFET, Pb free 6 Q302 TR,BJT,PNP EQBP0009901 TSMT6 ,0.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 R429 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R430 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP 6 R431 RES,CHIP,MAKER ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP 6 R433 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP 6 R434 RES,CHIP ERHY0013101 2.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 R417 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R418 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R419 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R423 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 SPFY00 PCB,MAIN SPFY0147601 FR-4 ,1.
11. EXPLODED VIEW & REPLACEMENT PART LIST Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC 11.3 Accessory Level Location No. Description Part Number Spec 3 SBPL00 BATTERY PACK,LI-ION SBPL0090501 3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC ,50x34x55 , ,BLACK ,Innerpack ,Europe Label 3 SSAD00 ADAPTOR,AC-DC SSAD0024501 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V +0.15V, -0.
Note
Note
