Datasheet

S P E C I F I C A T I O N
PAGE :
DOCUMENT No :
REG. DATE : 10. 12. 16
MODEL : LEMWS37Q75HZ00
REV. DATE :
REV.NO :
(30)-4022
LGIT Confidential and Proprietary
©2010 LGIT. All rights reserved.
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PRELIMINARY
( O ) ( X )
11-3. Soldering Iron
Basic spec is ≤5sec when 260℃. If temperature is higher, time shorter
(+10℃  -1sec). Power dissipation of Iron should be smaller than 15W,
and temperature should be controllable. Surface temperature of the device
should be under 230℃.
11-4. Rework
1) Customer must finish rework within 5sec under 245℃.
2) The head of Iron can not touch copper foil.
3) Twin-head type is preferred.
11-2. Lead-free Solder
11. Others
11-1. Lead Solder
60~120 sec
10 sec. Max
Soldering Time
SMD Surface
Temp (℃)
120
160
240
Preheat
Rising
+4℃/sec
Cooling
-5℃/sec
60~120 sec
10 sec. Max
Soldering Time
SMD Surface
Temp (℃)
180
200
Preheat
Rising
+4℃/sec
Cooling
-5℃/sec
within 60 sec.
Above200℃
within 60 sec.
Above220℃
260
240℃ Max
260℃ Max