Datasheet

S P E C I F I C A T I O N
PAGE :
DOCUMENT No :
REG. DATE : 10. 12. 16
MODEL : LEMWS37Q75HZ00
REV. DATE :
REV.NO :
(30)-4022
LGIT Confidential and Proprietary
©2010 LGIT. All rights reserved.
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PRELIMINARY
2. Outline Dimensions
1. Features
( Unit : mm )
◆Tolerances Unless Dimension ±0.2mm
- Lighting Color : White (High CRI)
- Lead Frame type PKG : 3.5×2.8×0.7 mm (L×W×H)
- Chip Material : InGaN
- Viewing angle : extremely wide(120˚)
- Compatible to Pb-free IR reflow soldering
- ESD-withstand voltage : up to 2kV acc. to JESD22-A 114-B
- Taping : 8 mm conductive black carrier tape & antistatic clear cover tape.
2000pcs/reel, Φ180 mm wheel
①
②
I
n
t
e
r
n
a
l
C
i
r
c
u
i
t
Anode
Cathode
-
+
①
②
Item Materials
Package Heat-resistance PPA
Encapsulating resin Silicon resin
Electrodes Ag plating copper alloy
Anode Mark
Recommendable soldering pattern
(For reflow soldering)
Exposed Cu for soldering
Cu area with solder mask
for heat dissipation
PC-Board
FR 4 1.6t
Copper foil 35um