Service manual

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Internal Use Only

Service Manual

LG-P705

Date: September, 2012 / Issue 1.0

Summary of content (221 pages)

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Internal Use Only Service Manual LG-P705 Date: September, 2012 / Issue 1.
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Table Of Contents 1. INTRODUCTION �� 3 1.1 Purpose ��3 1.2 Regulatory Information ��3 2. PERFORMANCE �� 5 9. PCB LAYOUT........................................................................148 10.
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1. INTRODUCTION 1.1. INTRODUCTION INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A.
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1. INTRODUCTION G. Interference and Attenuation A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H. Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling: • Service personnel should ground themselves by using a wrist strap when exchange system boards.
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2. PERFORMANCE 2. PERFORMANCE 2.1 Product Name P705 : WCDMA900/2100+EGSM/GSM850/DCS/PCS (HSDPA 7.2Mbps GPRS Class 12 / EDGE Class 12) 2.
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2. PERFORMANCE 2.4 HW Features Item Form Factor Feature Comment DOP type 1) Capacity Battery Standard : Li-Ion , 1700mAh 2) Packing Type : Soft Pack Size Standard : 125.5 x 67 x 8.8 mm Weight 122g Volume 73994.8cc PCB Stand by time Charging time Talk time With Battery L1F2 10 Layers , 0.
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2. PERFORMANCE Built-in Camera 5M AF Status Indicator No Function Key: Function key : 1 Keypad Home, Back, Menu, Side Key : 2 Side Key : Power key : 1 ANT System connector Ear Phone Jack PC synchronization Memory Speech coding Data & Fax Vibrator Blue Tooth MIDI(for Buzzer Function) Music Player Volume up/down Main : Internal Fixed Type 5 Pin 3.5Phi, 4 Pole, Stereo Yes eMMC : 4GByte DRAM : 4Gbit FR, EFR, HR, AMR Built in Data & Fax support Built in Vibrator V3.
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2. PERFORMANCE 2.
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2. PERFORMANCE Call Reminder No Network Selection Automatic Mute Yes Call Divert Yes Call Barring Yes Call Charge (AoC) Yes Call Duration Yes There is no limitation on the SMS (EMS) number of items. It depends on available memory EMS does not support. amount.
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2. PERFORMANCE event" is not supported Partially support Class C MMS Yes EONS No CPHS Yes ENS No Camera V4.2 Yes - 5MP AF + VGA VT - VGA recording No JAVA Voice Dial No IrDa No Bluetooth Yes FM radio Yes GPRS Yes Class 12 EDGE Yes Class 12 Hold / Retrieve Yes Conference Call Yes DTMF Yes Memo pad Yes TTY No AMR Yes SyncML Yes IM No Email Yes LGE Internal Use Only LGE Internal Use Only Ver. 3.0 Max. 6 - 10 - Copyright © 2012 LG Electronics. Inc.
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2. PERFORMANCE 2.6 HW SPEC. 1) GSM transceiver specification Item Phase Error Frequency Error EMC(Radiated Spurious Emission Disturbance) Specification Rms : 5° Peak : 20 ° GSM : 0.1 ppm DCS/PCS : 0.1 ppm GSM/DCS : < -28dBm Transmitter Output power and Burst GSM : 5dBm – 33dBm ± 3dB Timing DCS/PCS : 0dBm – 30dBm ± 3dB Burst Timing <3.
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2. PERFORMANCE 2) WCDMA transmitter specification Item Transmit Frequency Specification Band1 : 1920 MHz ~ 1980 MHz Band8 : 880MHz ~ 915MHz Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB Frequency Error within ±0.1 PPM Open Loop Power Control Normal Conditions : within ±9 dB, Extreme Conditions : within ±12 dB Minimum Transmit Power < -50 dBm /3.84 MHz Occupied Bandwidth < 5 MHz at 3.
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2. PERFORMANCE 3) WCDMA receiver specification Item Receive Frequency Specification Band1 : 2110 ~ 2170 MHz Band8 : 925~960MHz Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz Band8 : BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz Adjacent Channel Selectivity ACS > 33 dB where BER < 0.001 when (ACS) Îor = -92.7dBm / 3.84 MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz(Band1) Îor = -89.7dBm / 3.
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2. PERFORMANCE 4) HSDPA transmitter specification Item Transmit Frequency Specification Band1 : 1920 MHz ~ 1980 MHz Band8 : 880MHz ~ 915MHz Maximum Output Power Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz Sub-test in table C.10.1.4 HS-DPCCH Power Power step slot step boundary 1 Start of Power step size, P [dB] Transmitter power step tolerance [dB] 6 +/- 2.3 Ack/Nack 5 2 Start of CQI 1 +/- 0.
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2. PERFORMANCE 5) HSDPA receiver specification Item Receive Frequency Specification Band1 : 2110 MHz ~ 2170 MHz Band8 : 925 MHz ~ 960 MHz Maximum Input Level Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 (BLER or R), 16QAM Only BLER < 10% or R >= 700kbps 6) WLAN 802.11b transceiver specification Item Specification Transmit Frequency 2400 MHz ~ 2483.
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2. PERFORMANCE 7) WLAN 802.11g transceiver specification Item Specification Transmit Frequency 2400 MHz ~ 2483.
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2. PERFORMANCE 8) WLAN 802.11n transceiver specification Item Specification Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 ) Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA) Frequency Tolerance within ±25 PPM Chip clock Frequency within ±25 PPM Tolerance Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz) ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -45 @ ±30MHz offset (20MHz ~ 30Mhz) Transmitter constellation error (rms EVM) ≤ -5dB@6.5Mbps, -10dB@13Mbps, -13dB@19.
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2. PERFORMANCE 10) GPS receiver specification Item Specification Receive Frequency 1574.42 MHz ~ 1576.42 MHz Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding LGE Internal Use Only LGE Internal Use Only - 18 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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3.CIC AND SERVICE CENTER 3. CIC AND SERVICE CENTER 3.1 CIC FAQ No FAQ 1 Q A Development requests Q&A I can’t remember the PhoneLock password. 1. When you forget the pattern (password),and enter wrong patterns five times on Android phones, you can create a new pattern by logging in on your Gmail account as long as the account is activated on your phone. Unless your Gmail account is not activated, you can visit the sevice center to get the factory reset for the patten(password). 2.
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3.CIC AND SERVICE CENTER No FAQ Q 2 Q&A How do I put in and take out files from the SD card? USING USB YES A 1 NO 2 3 On the ‘USB in Use’ screen as above, go to My Computer>p705F>select SD Card Development requests Q 3 A Development requests 1.PC<-> SD CARD 2.PHONE<-> SD CARD I use it abroad, but 3G connection doesn’t work. 1. Press the Menu, go to the SetUp, and press More on Wireless and Network 2. Press Mobile Network under the Wireless and Network, and press the Network Administrator.
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3.CIC AND SERVICE CENTER No FAQ 4 Q Q&A The GPS location isn’t right, what should I do? 1.Make sure GPS, Wi-Fi and 3G networks are ticked off (or checked) for availability. A * Select the Wireless Network, GPS Satellite and GPS Help (allowing access to the GPS Help server). GPS(outdoors), WiFi and 3G Network(indoors/outdoors) are all available indoors and outdoors. You should select the GPS Satellite for precise positioning.
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3.CIC AND SERVICE CENTER No FAQ 5 6 Q&A Q The downloaded application isn’t compatible? A You need to check out if the application is interoperable with the current OS version on your smartphone. Go to SetUp>check out the Android version in use on the smartphone under the Phone Info. Check out the OS version supported on the Download Page for apps downloaded. Download the version interoperable with the OS. Some applications may not be interoperable due to resolution issues, e.g. Pad/ Optimus View.
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3.CIC AND SERVICE CENTER No FAQ 8 9 Q&A Q Unused application shows up as a using program even though it is all killed. What should I do? A On Android OS system, default apps keep working automatically in the background in favor of OS stability and better system performance. Such apps are displayed in the process list even after the user ends apps with the Task Killer. 1. Task Killer will end an application. 2.
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3.CIC AND SERVICE CENTER No FAQ 10 11 12 13 Q&A Q How do you install the PC Sync Program? A Connect the phone to USB-> ‘USB Connection Type’ screen appears->select PC Software->Screen for LG PC Suite Installation Guide appears>download and install. Q How do you install the Phone driver? A Go to www.lgmobile.co.kr. Download Center at the top->search the Model Name>download the Driver. Q How to connect internet/data network A 1.Press the Menu and go to Setup. 2.
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3.CIC AND SERVICE CENTER No FAQ Q&A My Computer->click right side for Attributes->Hardware->run ‘Device Manager’ In Win 7, Control Panel->System->run ‘Device Manager’ Click Modem under the Device Manager and see the Tree. A Check out if LGE Android Platform USB Modem is there as in the blue section above. Or, if there is one, check out if the icon has a yellow exclamation mark(!). Unless the modem above is there, or if the icon has the ! mark, disconnect the cable and reconnect it.
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3.CIC AND SERVICE CENTER No FAQ 15 16 17 Q How do you Reset and Factory Reset? A Select Setup App in the Menu. Then, Backup and Factory Reset->Factory Reset>select Factory Reset for the phone Q I want to change the bell sound. A Select the Setup App from the Menu. Then, select Sound->Bell Sound Q Is it compatible with other devices? A 1. Bluetooth 2. Wifi-direct Development requests 18 19 20 Q&A ex) 1. Bluetooth 2.
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3.CIC AND SERVICE CENTER No FAQ 21 Q&A A Your phone can share the media content on the network with other players. 1. Press Menu -> select SmartShare. - Wi-Fi network connection should work. If not, a screen for Wi-Fi connection will appear. 2. At ‘From,’ set up the library to view the content list. - The content list on the device will be displayed, if any devices were connected previously. 3.Set up a content player at ‘To.’ - Only applicable devices (e.g. DLNA-supported TV, PC etc.) can be set up.
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3.CIC AND SERVICE CENTER No FAQ 22 Q Q&A Battery consumption is too fast. * Checklist for battery use 1) Where few antenna bars are displayed(shadow zones), the phone is considered to be located far from the network. To send and receive the phone’s positioning information, more power is needed. Thus, batter power is consumed faster. 2) When the screen(LCD Back Light) is turned on, battery power runs out faster.
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3.CIC AND SERVICE CENTER No FAQ 23 24 25 26 27 Q&A Q How is the distribution schedule of OS or SW new version known? A Refer to the announcement under the Customer Support on www.lgmobile.co.kr. Q How do you update the SW? A 1. Press the Menu and select the Software Update button 2. Select the item you want - Update Check: Check new software updates and update software items. - Last Update Date: View the latest date of software updates.
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4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.
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4. TROUBLE SHOOTING 4.2 SIGNAL PATH WCDMA / GSM Tx PATH WCDMA 2100 TX PATH WCDMA 900 TX PATH GSM Low Band Tx PATH GSM Hign Band Tx PATH Common Rx/Tx PATH LGE Internal Use Only - 31 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING WCDMA / GSM Rx PATH WCDMA 2100 RX PATH WCDMA 900/EGSM TX PATH EGSM Band RX PATH GSM 850 Band Rx PATH Common Rx/Tx PATH DCS Band Rx PATH PCS Band Rx PATH LGE Internal Use Only - 32 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.3Checking Checking TCXO 4.3 TCXOBlock Block The output frequency (19.2MHz) of TCXO (X2001) is used as the reference one of RTR6285 and PM7540 internal The output frequency (19.2MHz) of TCXO (X2001) is used as the reference one of RTR6285 and PM7540 internal VCO. VCO. TP2 TP3 TP1 VREG_TCXO_2.85V C215 C214 1n 0.1u TP1 X200 KT2520F19200DCW28RAK Clesed to TCXO 1 R203 2 TRK_LO_ADJ VCONTROL VCC NC1 NC2 GND OUT 6 5 100 3 C222 10n 4 19.
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4. TROUBLE SHOOTING Check TP1 VCC of TCXO VCC ≥ 2.8V No Check the PM8029 Yes Check TP2 2.4V ≥ Voltage ≥ 0.4V No Check the MSM7227A Yes Check TP3 19.2 MHz Signal No Check soldering and components Yes TCXO is OK LGE Internal Use Only - 34 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.4 Checking GSM TX Module(GSM PAM + FEM) Block 4.4 Checking GSM TX Module(GSM PAM + FEM) Block VBAT(TP1) VBAT(TP1) SW1000 SW1001 C1106 G1 G2 ANT 1 2.7n ANT COMMON G3 3 2 C1094 1.8n G4 4 WCDMA_HB_RTX L1042 DNI WCDMA_LB_RTX L1043 DNI C1009 100p L1001 DNI 0603 R1000 GSM_PA_RAMP 3.
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A N T_SEL[3] A N T_SEL[2] A N T_SEL[0] A N T_SEL[1] DNI L1009 4.
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4. TROUBLE SHOOTING Checking Switch Block Power Source Check ANT_SEL 0,1,2,3 High Level No 1.2V < Voltage < 3V Check the TP1(VBATT) Yes Check the Logic In each mode LGE Internal Use Only - 37 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.5 Checking WCDMA Block START 1. Check TCXO 19.2MHz 2. Check FEM Block Refer to 4.4 3. Check RF Tx Level 4. Check PAM Block Refer to 4.5.4 5. Check RF Level 6. Ro-download SW & Cal. LGE Internal Use Only - 38 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.5.1Checking TCXO Block Refer to 4.3 4.5.2. Checking FEM Block 4.5.3. Checking RF TX Level Refer to 4.4 TP4 TP3 TP2 TP1 Test Point (TX Level) LGE Internal Use Only - 39 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING SW1000 G2 ANT 1 2.7n COMMON ANT G3 3 L1042 DNI 2 C1094 1.8n G4 4 TP1 WCDMA_HB_RTX WCDMA_LB_RTX L1043 DNI C1009 100p L1001 DNI L1000 DNI L1002 100n C1013 0603 R1000 GSM_PA_RAMP C1018 28 27 26 25 24 23 G N D 11 G N D 10 G ND9 G ND8 G ND7 G ND6 29 TP3 PGND1 897.5MHz,942.5MHz BAND8(2520) : SAYRJ897MCA0B0A BAND5(2520) : B7671 30 31 32 33 34 2mm 1950MHz, 2140MHz FL1005 L1027 WCDMA_HB_RTX C1033 10u 0603 C1034 47p L1029 15n 1.5n 6 L1030 6.
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4. TROUBLE SHOOTING Check ANT_SEL 0,1,2 (High, Low, Low) Yes RF Tx Level is OK No Check TP1 Over 21dBm? Yes Check TX Module No Check TP2 Over 21dBm? Yes Check Duplexer No Check TP3 Over 21dBm? Yes Check RTR6285A No Check TP4 Over 7dBm? Check PAM Block Refer to 4.5.4 RTR6285 Maximum output Power = 7 dBm RTR6285 minimum output Power = -80 dBm PAM(ACPM-5281) = Maximum input Power = 10 dBm LGE Internal Use Only - 41 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.5.4. Checking PAM Block PAM control signal PA_ON0 (C1079), PA_ON1(C1078) : PAM Enable PA_R0: PAM Gain Control PA_ON must be HIGH (over 2.6V) PAM IN/OUT Signal When PAM is under the operation of high power mode (PA_R0(C1076) : Low), PAM OUT power must be over 21 dBm PAM IN power must be under 10 dBm TP1 TP3 TP2 TP1 LGE Internal Use Only - 42 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING TP3 Near to 4 Pin Near to 12 Pin 1mm C1065 1n VBAT C1067 C1066 330p 10u TP2 18p L1016 DNI U1002 2.2n L1024 DNI C1071 L1020 100p 5.6n 100p FL1003 4 OUT IN C1072 C1073 12n 6.
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4. TROUBLE SHOOTING Set the phone Tx is ON and PDM is 210 Check TP3 Over 21dBm? Yes RF Tx Level is OK No Check TP2 PA_RO ≥ 2.6V Yes Check MSM7227A No Check TP1 Over 10 dBm? Yes Check RTR6285A No Change the board LGE Internal Use Only - 44 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.5.5. Checking RF Rx Level TP3 TP2 Bias TP5 TP1 TP4 Test Point (RF Rx Level) SW1000 ANT G3 2 C1094 TP1 1.8n G4 4 WCDMA_HB_RTX L1042 DNI WCDMA_LB_RTX L1043 DNI C1009 100p L1001 DNI L1000 DNI L1002 100n C1013 0603 R1000 C1018 100p 3.9n FL1000 4 1 2.2K 2 G N D 11 G N D 10 G ND9 G ND8 G ND7 G ND6 R1003 130 7dB R 1005 130 R 1004 47 LGE Internal Use Only R1006 1 2 3 4 5 6 7 8 HB_IN GND1 LB_IN VAPC VBATT BS2 BS1 TXEN_ 91 91 R 1008 33 7.
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4. TROUBLE SHOOTING FL1002 C1068 6 WCDMA_LB_RTX ANT RX 15p L1017 DNI TX L1018 4.7n 2 4 5 GND1 GND6 GND2 GND5 GND3 GND4 1 L1031 1.2n 3 L1033 39n 9 8 7 897.5MHz,942.5MHz BAND8(2520) : SAYRJ897MCA0B0A BAND5(2520) : B7671 TP2 FL1005 L1027 1.5n 6 WCDMA_HB_RTX L1029 15n 1950MHz, 2140MHz ANT RX TX L1030 6.8n 2 4 5 GND1 GND2 GND3 GND4 GND5 GND6 1 L1038 2.2n 3 7 8 9 DNI C1102 BAND1(2520):B7697 BAND2(2520):ACMD-7407 VREG_RF_2.7V Bias C1104 C1097 1 2 3 4 2.
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L1040 1 2 3 4. TROUBLE SHOOTING 2.7n L1041 2.7n NC VGS WCDMA_HB_RX C1099 17 PGND 2.7p 16 RFOUTM U1003 15 RFOUTH RREF 13 12 VEN1 11 TP4 14 RFOUTL 27K R 1020 C1 L1035 22n C1107 2 33p 1 FL1007 3 G1 O1 IN G2 O2 5 4 C11 DNI 942.5MHz C1100 C DNI C1095 2 1 FL1007 3 G2 O2 5 WCDMA_LB_RX_M C1101 G1 O1 IN 1.8p L1037 10n DNI 942.5MHz 4 C1096 1.8p WCDMA_LB_RX_P TP5 L1028 C1086 1.2n 3.9p 2 1 3 G1 O1 IN FL1006 C1087 DNI G2 O2 5 4 C1093 2140MHz 3.
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4. TROUBLE SHOOTING Set the phone Rx is On Check BIAS over 2.1 V? No Check bias block soldering Yes Check TP1 Signal exist? No Check RF Switch (M/S) Yes Check TP2 Signal exist? No Check TX Module Refer 1.4 Yes Check TP3 Signal exist? No Check Duplexer Yes Check TP4 Signal exist? No Check LNA Yes Check TP5 Signal exist? No Check RTR6285 and Rx SAW filter Yes Change the board LGE Internal Use Only - 48 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TCXO Block 2. Check ANT.SW Module 3. Check RF TRX Level 4. Re-download SW & Cal. LGE Internal Use Only - 49 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 1 2 4.6.1 Checking TCXO Block Refer to 4.3 4.6.2 Checking FEM Block Refer to 4.4 4.6.3 Checking RF TX level TP1 TP3 LGE Internal Use Only TP2 - 50 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING SW1000 SW1001 C1106 G1 G2 ANT 1 2.7n COMMON ANT G3 3 C1094 2 1.8n G4 4 WCDMA L1042 DNI WCDM L1043 DNI TP1 C1009 100p L1001 DNI L1000 DNI L1002 100n C1013 0603 R1000 GSM_PA_RAMP G N D 11 G N D 10 G ND9 G ND8 G ND7 G ND6 R1006 GSM_LB_TX 91 0603 C1034 47p 0603 C1049 1n C1050 1n C1051 1n C1052 1n PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 FEM 9 10 11 12 13 14 10u 29 30 31 32 33 34 TP2 2mm C1033 7.
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4. TROUBLE SHOOTING Schematic of GSM/DCS/PCS Tx Block START Check TCXO Block Refer to 1.3 No Check TP1 If GSM over 31 dBm? If DCS/PCS over 28 dBm? Yes GSM/DCS/PCS Tx is OK Check other part No Check TP2, 3 If GSM(TP2) under 6 dBm? If DCS/PCS(TP3) over 6 dBm? Yes Check Tx Module (ASM+EDGE PAM) Refer to 4.4 No Check RTR & PAD No Problem Check soldering and components Still exist Problem Change the board LGE Internal Use Only - 52 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.6.4 Checking RF Rx Block TP2 TP1 SW1000 G2 SW1001 C1106 G1 ANT 1 2.7n COMMON ANT G3 3 C1094 2 1.8n G4 4 WCDMA_H L1042 DNI WCDMA_L L1043 DNI C1009 TP1 100p L1001 DNI L1000 DNI L1002 100n C1013 0603 R1000 GSM_PA_RAMP C1018 2.
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4. TROUBLE SHOOTING WCDMA_HB_RTX WCDMA_LB_RTX C1012 L1000 DNI 100p FL1000 4 IN_881_5 3.9n 1 OUT_881_5_1 6 2 3 L1005 DNI C1014 3.3p GSM(869-894 MHz) GSM850_RX_P 9 OUT_942_5_1 IN_942_5 L1004 8.2n 7 OUT_881_5_2 C1018 GSM850_RX_M L1003 82n 881.5MHz,942.5MHz C1013 3.3p 8 OUT_942_5_2 C1023 GND1 GND3 GND2 GND4 GSM900_RX_M 5 12n 10 L1006 L1007 10n 0.5p GSM(925-960 MHz) C1025 GSM900_RX_P 12n TP2 GSM Quad C1053 DCS_RX_M 2.2n DNI L1009 C1056 2.
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4. TROUBLE SHOOTING Set the phone Rx is On Check TP1 Signal exist ? No Check RF Switch (M/S) Yes Check TP2 Signal exist ? No Check Tx Module Refer to 4.4 Yes Change the board LGE Internal Use Only - 55 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.7 GPS/WIFI/BT/FMR RF Component FL800 U802 FL801 RF Component(GPS) Reference LGE Internal Use Only Description U802 GPS LNA FL801 GPS SAW Filter FL800 BT/WIFI/GPS diplexer - 56 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING FL802 FL800 U802 U800 RF Component(BT/WiFi/FMR) Reference LGE Internal Use Only Description U800 BT/FMR Chip (WCN2243) U802 WIFI Chip (WCN1314) FL800 BT/WIFI/GPS diplexer FL802 BT/WIFI FEM - 57 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING FM via is connected to Upper FPCB 3.5phi Ear-Jack WIFI RF TX WIFI RF RX BT RF TX RX BT/WIFI TX RX FMR RF TX WiFi / BT / FMR Signal PATH WiFi / BT Tx and Rx PATH LGE Internal Use Only - 59 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.9 GPS/WIFI/BT Trouble shooting 4.9.1 A-GPS Block TP2 TP1 GPS GPS_ANT FL801 C816 1 IN 47p OUT TP1 L803 4 4.7n G1 G2 G3 L805 L804 DNI DNI 2 3 5 1574.42 - 1576.42 MHz Near To LNA C817 C818 DNI DNI L806 R807 3.3n 18p 1575.42 MHz GPS_MODE 3 12 2 GND R F _I N R808 C820 0.1u 1 U801 VREG_RF_2.7V 12 C819 S_D VDD FIL_OUT 5 4 C821 GPS_IN 3n L807 DNI TP2 LGE Internal Use Only - 60 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING Set the phone GPS is ON Check TP1 About 2.7V? No Check power LRC filter soldering Yes Check TP2 About 2.6V? No Check SW and NV item Yes Change the board 4.9.2 WLAN/BT/FM Block 1 3 2 1 3 LGE Internal Use Only - 61 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING Module part 2400 to 2500MHz,1572 to 1578MHz FL800 ANT800 6 C800 1 5 4 100p HJ-BCT-02Y C801 C802 0.75p 100n 1 P2 GND3 P3 GND2 GPS_ANT 2 GND1 3 P1 BT_WLAN_ANT ANT801 1 HJ-BCT-02Y C823 BT_WLAN_ANT 47p L809 L808 DNI DNI L810 WLAN_RF_RX 3.
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22p 36 47 40 57 BT_UART_TX BT_UART_RX BT_UART_RTS BT_UART_CTS BT _RF I O BT _ACT I V E B T _ P R I OR I T Y WL A N _ A C T I V E 30 BT _ACT I V E 35 BT _ST AT US 34 T X _ C ONF I R M 52 20 17 F M_ L O _ L F M_ L O _ R B T _ P C M_ O U T B T _ P C M_ S Y N C BT _CL K_RE Q 27 26 25 F M_ R D S _ I N T 3 19 VDD_BT_PA +3V_WLAN_WCN 13 12 15 5 VDD_BT_1P3_1 VDD_BT_1P3_2 VDD_BT_1P3_3 VDD_BT_1P3_4 BT_UART_RXD BT_UART_TXD BT_UART_CTS BT_UART_RTS R806 21 32 VDD_DIG_1P3 VDD_FM_DAC BT_PCM_IN BT_PCM_
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4. TROUBLE SHOOTING [Figure] Schematic of WiFi/BT module TP3 TP1 TP2 Test point Description Test point Net name TP1 +3V_WLAN_WCN Power for BT/WiFi BB core and WiFi power Amp. (V Batt) TP2 VREG_MSME_1.8V Power for BT power Amp. (1.8V) TP3 VREG_MSME_1.8V Power for host interface (1.8V) LGE Internal Use Only Description - 65 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING START TP1, 2, 3 is OK? No Check the power block Yes SDIO ok? UART ok? Yes Module Check No Board Change LGE Internal Use Only - 66 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.10 Power ON Trouble Shooting Power On sequence of P705 is : Power key press -> KPD_PWR_N go to low -> PM8029 Power Up -> VREG_MSMC1_1.1V (L500), VREG_MSMC2_1.1V (L501), VREG_MSME_1.8V (L502), VREG_P3_2.85V (C541), VREG_MSMA1_2.6V (C536), VREG_MSMA2_1.2V (C532) VREG_TCXO_2.85V (C537) power ON -> Phone booting and PS_HOLD(D502) go to High START Battery voltage higher than 3.
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4. TROUBLE SHOOTING TP503 51 PMIC_TCXO BT_FM_CLK_REQ_WCN BT_FM_CLK_WCN SLEEP_CLK R510 51 D502 PS_HOLD TP507 JTAG_PS_HOLD KPD_PWR_N R514 TP503 N5 N7 E5 K9 K13 K11 M10 TCXO_OUT_D0 TCXO_D1_EN TCXO_OUT_D1 SLEEP_CLK0 PS_HOLD CBLPWR_N KPD_PWR_N RESIN_N 51K K15 TP504 C11 PMIC_SSBI H8 H10 TP505 nPON_RST PM_INT_N R515 3 .
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4. TROUBLE SHOOTING PS_HOLD VREG_MSMC1_1.1V VREG_MSMA2_1.2V VREG_P3_2.85V VREG_TCXO_2.85V VREG_MSMA1_2.6V VREG_MSMC2_1.1V VREG_MSME_1.8V L500 VREG_MSMC1_1.1V 2.2u VSNS_MSMC1_1.1V L501 VREG_MSMC2_1.1V 2.2u VSNS_MSMC2_1.
PAGE 71
4. TROUBLE SHOOTING TP2 VREG_TCXO_2.85V C215 C214 1n X200 KT2520F19200DCW28RAK Clesed to TCXO 1 R203 2 TRK_LO_ADJ VCONTROL VCC NC1 NC2 GND OUT 6 0.1u TP2 5 100 C222 10n LGE Internal Use Only 3 19.2MHZ - 71 - 4 C223 27p C224 1n TCXO_PM_19.2MHZ TCXO_RTR_19.2MHZ Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.11 Charging Trouble Shooting MICRO USB IO FL800 IN uUSB_POWER OUT TA (5.1V / 705mA) GND1 GND2 C809 ZD800 1n CN801 10 8 P6 FL801 1 2 6 3 4 11 P2 P4 P1 P3 USB_ID 5 MAX_DM MAX_DP P5 7 9 C807 D802 D803 D804 22p Mini ABB_NS Battery C 567 MAX_DP E1 USB_ID D1 VCHG_VBUS TP400 D3 C 565 1u B5 D2 C566 BATT1 BATT2 DD+ DN DP ID U1 U2 U506 RES AUD1 AUD2 DSS EXPDET CAP MIC C5 D5 A2 A3 USBH_DM USBH_DP A5 A4 UART_RX UART_TX B1 C1 VREG_MSME_1.
PAGE 73
4. TROUBLE SHOOTING START Check the pin and battery connect terminals of I/O connector No Connection OK? Change I/O connector Yes Is the u-USB Cable voltage 4.8V (for 5.0V) No Change TA (or u-USB cable) Yes Is it changing properly After turning on? Yes END No Check MiniABB (U506) SMT status by X-ray. Exchange MiniABB or change the Main board and reset. Charger Troubleshoot Flow LGE Internal Use Only - 73 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.12 5M Camera Trouble Shooting 5M camera control signals are generated by MSM7227A. START Check the camera Conn.
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4. TROUBLE SHOOTING G19 E23 C25 D24 G25 E25 G23 AT32 AM16 AN17 AR15 AR33 AN35 AP36 AJ15 AN25 AM24 AR25 AJ25 AT26 AM26 MSM7227A VT_RESET_N VT_PWDN TOUCH_I2C_SCL TOUCH_I2C_SDA NFC_MODE NFC_VEN SENSOR_I2C_SCL TOUCH_3.0V_EN 1 R204 CAM_MCLK 10 PROX_I2C_SCL PROX_OUT BATT_ID eMMC_DATA[7] eMMC_DATA[6] eMMC_DATA[5] PA_ON1 CAM_AF_2.8V_EN PM_INT_N PS_HOLD FLASH_I2C_SDA FLASH_I2C_SCL MINIABB_INT C225 C226 7.
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4. TROUBLE SHOOTING 54 CN602 1 EAR_MIC_3.5PI 53 2 52 3 51 4 50 5 49 6 48 7 47 8 46 9 45 10 44 11 43 12 42 13 41 14 40 15 UPPER FPCB conn. RCV_P RCV_N FM_ANT VREG_CAM_AVDD_2.8V VREG_CAM_IOVDD_1.8V VT_PWDN VREG_CAM_DVDD_1.8V C606 C608 4.7u DNI 5 DNI C 609 4 DNI C 605 C 604 6 4 .7 u VREG_CAM_AF_2.8V VT_RESET_N Upper FPCB 1 2 3 2 FL900 Upper FPCB 4 6 5 LGE Internal Use Only FL906 FL902 - 77 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.13 VGA Camera Trouble Shooting VGA camera control signals are generated by MSM7227A.
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4. TROUBLE SHOOTING GPIO_8 GPIO_9 GPIO_10 GPIO_11 GPIO_12 GPIO_13 GPIO_14 GPIO_15 GPIO_16 GPIO_17 GPIO_18 GPIO_19 GPIO_20 GPIO_21 GPIO_22 GPIO_23 GPIO_24 GPIO_25 GPIO_26 GPIO_27 GPIO_28 G19 E23 C25 D24 G25 E25 G23 AT32 AM16 AN17 AR15 AR33 AN35 AP36 AJ15 AN25 AM24 AR25 AJ25 AT26 AM26 FL901 MSM7227A 1 P1 2 P2 3 P3 4 P4 5 P5 6 P6 7 P7 8 P8 9 G1 10 G2 VT_CSI_DP0 VT_CSI_DN0 VT_CSI_CLKP VT_CSI_CLKN VT_RESET_N VT_PWDN TOUCH_I2C_SCL TOUCH_I2C_SDA NFC_MODE NFC_VEN SENSOR_I2C_SCL TOUCH_3.
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4. TROUBLE SHOOTING 4.14 Main LCD trouble Main LCD control signals are generated by MSM7227A. Those signal’s path are : MSM7227A-> LCD Module START Press PWR key turn the power ON Is the circuit powered? No Follow the Power ON trouble-shooting Yes Disconnect and reconnect LCD connector LCD display OK? No Yes Change the LCD module Check Power VREG_LCD_2.8V VREG_LCD_1.8V Yes No Yes Change the Main Board The LCD works END LGE Internal Use Only - 81 - Copyright © 2012 LG Electronics. Inc.
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4. TROUBLE SHOOTING 4.3" WVGA MIPI 2Lane FL600 5 P5 6 P6 7 P7 8 P8 P3 3 P2 P4 5 6 FL601 LED_C LED_A 22 3 21 4 20 5 19 6 18 7 17 8 16 9 15 10 14 11 13 12 VREG_LCD_2.8V 2 VREG_LCD_1.
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4. TROUBLE SHOOTING 4.15 Proximity Sensor on/off Trouble Shooting Proximity Sensor is worked as below : Call connected -> Object moved at the sensor -> Control the screen’s on/off operation automatically START Call Connect & Object moved at the Proximity Sensor Yes LCD off? No Check PROX_I2C_SDA / SCL Output & Prox_out (TP1,2,3) No Change the Proximity Sensor (U900) Yes Work well? No Chang the main board Yes END Measurement VREG_MSME_1.8V VREG_P3_2.
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4. TROUBLE SHOOTING Proximity Sensor TP2 TP1 U900 R908 VREG_P3_2.85V 1 LEDA SCL 8 PROX_I2C_SCL 4.7 2 R909 3 LEDC SDA VCC VIO 7 PROX_I2C_SDA 6 VREG_MSME_1.8V 10 1u 0 .1 u GND 5 2 1 C 919 TP3 C 918 4 .7 u PROX_OUT VOUT C 916 4 TP3 TP2 TP1 LGE Internal Use Only - 84 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.16 Motion Sensor on/off Trouble Shooting Motion Sensor is worked as below : Accelerometer Sensor function On → Tilt the phone (90˚) → The screen is had rotated automatic START Accelerometer Sensor function On Tilt the phone Yes The Screen is rotated? No Check Motion_I2C_SDA/SCL output No Change the Motion Sensor U800 Yes No Check Motion_INT output Change the Motion Sensor U800 Yes No Work well? Change the Main board Yes END Measurement VREG_MSME_1.
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4. TROUBLE SHOOTING Digital Compass + Accelerometer sensor VREG_MSME_1.8V TP2 TP1 C805 C806 0.1u 0.1u SENSOR_I2C_SCL SENSOR_I2C_SDA 12 13 VDD 15 14 V D D IO G ND3 SDO G ND1 TP3 10 9 COMPASS_DRDY 8 7 5 11 G ND2 DRDY C SB2 PS2 4 TP1 SDI U800 PS1 IN T 3 3 INT2 6 2 C SB1 1 SCK IN T 1 16 MOTION_INT1 TP2 TP3 LGE Internal Use Only - 86 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.17 Compass Sensor on/off Trouble Shooting Compass Sensor is worked as below : Compass Sensor function On START Compass Sensor function On Chang the position of the phone Yes The direction is correct? No No Check Motion_I2C_SDA/SCL output(TP2,TP3) Change the Motion Sensor U800 Yes No Check COMPASS_DRDY output(TP1) Change the Motion Sensor U800 Yes No Work well? Change the Main board Yes END Measurement VREG_MSME_1.
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4. TROUBLE SHOOTING Digital Compass + Accelerometer sensor VREG_MSME_1.8V TP2 C805 C806 0.1u 0.1u SENSOR_I2C_SCL SENSOR_I2C_SDA 12 13 VDD 15 14 V D D IO G ND3 SDI U800 PS1 SDO G ND1 10 9 COMPASS_DRDY 8 7 4 5 TP3 11 G ND2 DRDY C SB2 PS2 IN T 3 3 INT2 6 2 C SB1 1 SCK IN T 1 16 MOTION_INT1 TP1 TP2 TP3 TP1 LGE Internal Use Only - 88 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.18 DC Motor Trouble Shooting Vibrator is worked as below START Vibrator is not working well TP1 is same voltage as VBAT? No Change the Main board Yes Votage is almost 3V Between TP1 and TP2 No Change the PMIC Yes Change Motor, working well ? No Change the Main board Yes END Measurement VBAT VIB_DRV_N LGE Internal Use Only - 89 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING MOTOR TP1 VBAT VBAT|VIB_P VIB_DRV_N|VIB_N VIB_P C726 D700 TP2 VIB_N 1u VIB_DRV_N TP2 TP1 LGE Internal Use Only - 90 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.19 Audio Troble 4.19.1 Receiver Path MSM7227A-1-AA RCV_N / RCV_P -> CN900 (TP1) (RCV pad) START Connect the phone to network equipment and set-up call. Set-up 1KHz tone out. Can you hear the 1KHz TONE? Yes END No The sine wave appears at CN900 (TP1) ? Yes Re-solder or test the new RCV. (If it’s OK, Change the RCV.) No Re-contact or test the new Upper FPCB. Yes Change the FPCB No Change the U200 (MSM7227A-1-AA) or Change the main PCB.
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4. TROUBLE SHOOTING 4.19.2 Headset path MSM7227A-1-AA HPH_ L / HPH_R -> C706, C707(TP2) -> IC705 (TPA2055D3:Audio Subsystem) -> R710, R711 -> FB903, FB904(TP1) -> J900 (3.5pi Ear-jack) START Connect the phone to network equipment and set-up call. Set-up 1KHz tone out. Can you hear the 1KHz TONE? Yes END No The sine wave appears at FB903, FB904(TP1)? Yes Re-Solder & Change J900. No Re-contact or test the new Upper FPCB. Yes Change the FPCB.
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4. TROUBLE SHOOTING 3.5pi Ear Jack Connector TP1 4 M5-MIC M4-L 1800 FB904 1800 1n C 913 FB903 C 912 EAR_SENSE_3.5PI EAR_R J900 5 C 911 EAR_MIC_3.5PI EAR_L 1n 1n 4D M4-DETECT 1 M1-R 6 M6-GND FM_ANT 1 ZD901 ZD902 ZD903 ZD904 C920 L900 DNI 100n 2 LGE InternalUse UseOnly Only LGE Internal - 94 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING Audio Sub System VREG_MSME_1.8V VBAT C701 A4 C713 33n B4 B2 AUDIO_I2C_SDA AUDIO_I2C_SCL HPVDD IN1+ HPL IC700 IN1- HPR IN2+ IN2- CP SDA CN SCL 2 .2 u 2 .2 u 2 .2 u C 716 C 717 VREG_MSME_1.8V C 715 A2 4 .7 K 4 .7 K R 713 R 712 B IA S C2 OUT- E3 FB702 600 E4 FB703 600 B1 SPK_P SPK_N EAR_L A1 EAR_R C708 C709 1n 1n D1 E1 C714 2.2u G ND B3 33n OUT+ D3 0.47u 0.
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4. TROUBLE SHOOTING 4.19.3 Speaker/Speaker Phone path MSM7227A-1-AA LINE_OP, LINE_ON -> C711, C713(TP3) -> IC705 (TPA2055D3: Audio Subsystem) -> FB702, FB703(TP2) -> CN803(TP1)(SPK pad) START Connect the phone to network equipment and set-up call. Set-up 1KHz tone out. Can you hear the 1KHz TONE? Yes END No The Sine wave appears at CN803 (TP1) Yes Re-contact or change the SPK. No The Sine wave appears at FB703(TP2)? Yes Re-contact or test the new lower FPCB.
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4. TROUBLE SHOOTING SPEAKER TP1 CN803 SPK_P SPK_N D800 D801 Audio Sub System VREG_MSME_1.8V VBAT C701 33n A4 C713 33n B4 B2 AUDIO_I2C_SDA AUDIO_I2C_SCL LGE Internal Use Only LGE Internal Use Only D4 IN2+ IN2- CP SDA CN SCL 2 .2 u C 716 A2 2 .2 u C 715 4 .7 K 4 .7 K R 713 R 712 VREG_MSME_1.8V SPVDD HPR B IA S C2 HPL IC700 IN1- E3 FB702 600 E4 FB703 600 B1 SPK_P SPK_N EAR_L A1 EAR_R C708 C709 1n 1n D1 E1 C714 2.2u G ND C711 IN1+ CPVSS B3 OUT+ D3 A3 0.
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4. TROUBLE SHOOTING 4.19.4 Main Microphone MIC Signal: MIC800 -> FB800, FB802(TP2) -> C211(TP3) MIC_1P of MSM7227A-1-AA MIC Bias: MSM7227A-1-AA MIC_BIAS -> MIC800 START Make a call C202, C201, C200(TP1) is about 1.8bV? No Change the U200(MSM7227A-1-AA) or change the Main PCB. Yes Make some sound or voice to MIC Some sound signal appears at FB800, FB802(TP2)? Yes Change the MIC No Some sound signal appears at C210, C211(TP3)? Yes Re-contact or test the new lower FPCB.
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2 .2 K - 100 - R 200 33p TP3 P M I C _T C X O S L E E P _C L K E A R _M I C R C V _N R C V _P L I N E _O N L I N E _O P R 202 10K MIC_1N A N1 D2 2 A D8 AA3 0 .1 u 0 .1 u C 213 nR E S E T O U T 0 .1 u C 212 0 .1 u 0 .1 u C 211 0 .1 u C 208 C 210 C 209 H P H _L H P H _R F M_ R F M_ L TP3 D 200 n J T A G _R E S O U T n P ON_ R S T C202 22u SL P _CL K US BP HY _ S Y S CL K RSV D T CX O 0 1u C205 0.1u AK30 AL 31 C 231 R 218 0 .1 u 1u 0 .
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4. TROUBLE SHOOTING MAIN MIC TP2 MIC_1P MIC_1N MIC800 FB800 1800 OUT FB802 1800 G1 G2 MIC_BIAS VDD G3 C800 1u G4 R804 DNI FB800 TP2 LGE Internal Use Only FB802 - 101 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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4. TROUBLE SHOOTING 4.19.5 2nd Microphone MIC Signal: MIC900 -> FB900, FB802(TP2) -> C209(TP3) MIC_2P(AUXIP) of MSM7227A-1-AA MIC Bias: PM8029 HSED_BIAS2 -> MIC900 START Make a call C559(TP1) is about 1.8V? No Change the U501(PM8029) or Change the Main PCB. Yes Make some sound or voice to MIC Some sound signal appears at FB900(TP2)? Yes Change the MIC No Some sound signal appears at C209(TP3)? Yes Re-contact or test the new Upper FPCB.
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4. TROUBLE SHOOTING M14 M16 HSED_BIAS2 TP1 C559 1u E19 E21 F14 H14 F16 HSED_BIAS1 HSED_BIAS2 U501 EXT_IN_LP EXT_IN_RM TP1 HPA_IN_LP HPA_IN_RM HPA_GNDREF •C559 2nd MIC MIC_2N|GND FB900 P G1 18002 G2 1 O C909 1u Z D 907 MIC_2P MIC900 TP2 Z D 906 HSED_BIAS2 GND GND LGE Internal Use Only LGE Internal Use Only - 103 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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•C209 LGE Internal Use Only - 104 - 0 .1 u 0 .1 u 0 .1 u 0 .1 u C 210 C 211 C 212 C 213 2 .2 K R 200 33p P M I C _T C X O S L E E P _C L K E A R _M I C R C V _N R C V _P L I N E _O N L I N E _O P R 202 H P H _L H P H _R F M_ R F M_ L 10K MIC_1N A N1 D2 2 A D8 AA3 0 .1 u 0 .1 u C 208 C 209 nR E S E T O U T 1u TP3 D 200 n J T A G _R E S O U T n P ON_ R S T C202 22u SL P _CL K US BP HY _ S Y S CL K RSV D T CX O 1u 0 .1 u C205 0.1u AK30 AL 31 0 R 218 C 231 0 .
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4. TROUBLE SHOOTING 4.19.6 Headset micr ophone MIC Signal: 3.5 pi Headset (J900) → FB710(TP4) → C213(TP4) EAR_MIC(MIC2P) of MSM7227A-1-AA MIC Bias : VREG_MSME_1.8V → R722 (TP1) (DET) → R723(TP3)(RES) -> Headset MIC HS Detect IC Bias: VREG_P3_2.85V START Make a call R722(TP1) is about 1.8V & C751(TP2) is about 2.85V? No Change the Main PCB. No Change the U705(MAX14579E) or change the Main PCB. Yes Change the Headset or Re-solder/ change the J900. Yes Re-contact or test the new Upper FPCB.
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4. TROUBLE SHOOTING HEADSET_DETECT VREG_P3_2.85V VREG_MSME_1.8V TP2 TP1 R722 1M 1M 1u 3.5PI_KEY_POLE_DET VCC MODE CAP RES 5 R723 1 2.2K 3 4 SWD DET U700 MIC DET_IN 8 EAR_MIC_3.5PI R724 7 10K EAR_SENSE_3.5PI 9 EAR_SENSE 2 PG ND MIC_MODE SWD L H TP3 6 R721 DET L L 3 Pole 4 Pole C751 C752 220n FB710 1800 EAR_MIC TP4 LGE Internal Use Only LGE Internal Use Only - 106 - C753 39p Copyright © 2012 LG Electronics. Inc. All right reserved.
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•C213 LGE Internal Use Only 0 .1 u 0 .1 u 0 .1 u 0 .1 u C 210 C 211 C 212 C 213 2 .2 K - 107 - R 200 33p P M I C _T C X O S L E E P _C L K E A R _M I C R C V _N R C V _P L I N E _O N L I N E _O P R 202 H P H _L H P H _R F M_ R F M_ L 10K MIC_1N A N1 D2 2 A D8 AA3 0 .1 u 0 .1 u C 208 C 209 TP5 nR E S E T O U T 1u D 200 n J T A G _R E S O U T n P ON_ R S T C202 22u SL P _CL K US BP HY _ S Y S CL K RSV D T CX O 1u 0 .1 u C205 0.1u AK30 AL 31 0 R 218 C 231 0 .
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5. DOWNLOAD 5. DOWNLOAD TOOL INFORMATION TOOL VERSION [LGFlashToolV1350] DLL NAME USB DRIVER [LGFlashToolV1350]LGP705_120413_ LG United Mobile Driver Version 3.6 Package Release Download 2011.11.01 Please check the final version to “B2B” H/W Name D/L Cable LGE Internal Use Only Part No. Micro 5P (56-open-910K) USB DLC RAD32167835 - 108 - Copyright © 2012 LG Electronics. Inc. All right reserved.
PAGE 110
5. DOWNLOAD MS695 P705 [LGFlashTool1.3.77.21]LGMS695_20120208_Download [LGFlashToolV1350]LGP705_120413_Download P705 [LGFlashToolV1350] LGE Internal Use Only - 110 - Copyright © 2012 LG Electronics. Inc. All right reserved.
PAGE 121
5. DOWNLOAD [LGFlashToolV1350]LGP705_120413_Download [LGFlashTool1.3.77.21]LGMS695_20120208_Download LGP705_20120413.dll LGMS695_20120208.dll LGP705_120413 LGMS695_20120208 LGP705 MS695 [LGFlashTool1.3.77.21]LGMS695_20120208_Download [LGFlashToolV1350]LGP705_120413_Download LGP705 MS695 LGP705 MS695 LGE Internal Use Only - 121 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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6. BLOCK DIAGRAM Block Diagram _ AUDIO 3.
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6. BLOCK DIAGRAM Block Diagram _ BTWIFIFM ANT GPIO_62 WLAN_CLK WLAN_CMD WLAN RST N WLAN_RST_N SDIO_CLK SDIO_CMD WLAN_SDIO[0:3] LINE_L_IP GPIO_45 GPIO_44 FM_R FM_L FM RDS INT FM_RDS_INT FM_LO_R 19.2MHz 32.
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7. CIRCUIT DIAGRAM 7.
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7. CIRCUIT DIAGRAM C201 47p 0.1u C202 22u nJTAG_RESOUT C200 wvuyz{ MIC_BIAS D200 ARM9&ARM11 JTAG 0001 : Native, ARM9 + ARM11 on PJTAG MODE[3:0] 0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG VREG_MSME_1.
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7.
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7. CIRCUIT DIAGRAM MCP (4GB eMMC +4Gb LPDDR1) C13 DQ5 VSSd1 DQ7 VDD2 DM0 VSSQd4 DQ9 NC6 DQ10 DNU3 VDDQ6 NC18 NC8 DQ30 A3 DQ28 VSSQd1 DQ26 DQ0 DQ24 DQ2 DQS3 DQ4 DQ23 DQ6 VDDQ7 DQS0 NC7 DQ8 VSSd5 VDDQ8 A4 NC9 DQS1 DNU2 DQ31 NC10 DQ29 VDDQ4 DQ27 VSSQd6 DQ25 VDD3 DM3 VSSQd3 DQ22 NC11 DQ21 DNU1 D1 C14 zkyhthkkyX[ J5 G10 H5 K6 K7 K10 G12 SDRAM_DCLK0 G13 VREG_MSME_1.8V G14 0.1u 2.2u C407 H13 0.
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7.
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7. CIRCUIT DIAGRAM MAIN-TO-SUB CONNECTOR MAIN-TO-lowerFPCB CONNECTOR Z[GWU[GSGWU`{GuG{ Y[GWU[GSGWU`{GuG{ 1 CN600 24 }piu }ylntztlXU_} 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 }piw VREG_SDCARD_2.85V tpjyvzkkl{ VREG_SDCARD_2.
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7. CIRCUIT DIAGRAM Audio Sub System HEADSET_DETECT MOTOR }ylntztlXU_} VBAT }ylnwZYU_\} }ylntztlXU_} C701 C741 C700 10u 0.1u R722 1M 1M kl{ s s ZGw [Gw C751 R721 1u z~k s o }ih{ }ih{£}piw }piky}u£}piu C711 39n h[ C713 39n i[ iY h|kpvpYjzkh h|kpvpYjzjs IN2- CP SDA CN SCL 600 iX zwrw zwru ZU\wprlwvslkl{ lhyzluzl CAP RES R723 1 }piw 2.2K 3 4 SWD DET lhys U700 PGND 600 FB703 VCC k[ HPR IN2+ hY 4.7K 4.
PAGE 138
nwzhu{ 22p [X YZ 1M i{ymxj{ i{hj{p}l i{wypvyp{ ~shuhj{p}l i{ympv {jvumpyt ZW i{hj{p}l Z\ i{z{h{|z Z[ i{jsrylx Z 10p R806 RZ}~shu~ju XZ XY X\ \ C813 C814 C815 C809 C805 C806 4.7u 4.7u C810 C811 10n 10n C812 C807 C808 1u 10n 0.1u 4 4.7n 2 3 5 uG{Gsuh C817 C818 DNI DNI L806 R807 3.3n C820 18p 3 12 2 GND RF_IN R808 0.1u 1 U801 X\^\U[YGto¡ GPS_MODE VREG_RF_2.
PAGE 139
7. CIRCUIT DIAGRAM MAIN KEY LED Home KEY VBAT COL[1] 1 R800 KEY_ROW[2] KEY_COL[2] LD800 HOME 2 VOL_UP ROW[1] VOL_DOWN 3 KB800 470 R801 ROW[0] CN803 MIC_1P MIC_1N SPK_N 470 ROW[2] VA 800 470 1800 OUT FB802 1800 G1 HOME MIC_BIAS VDD G3 D801 C800 1u VA 801 R803 FB800 G2 D800 470 MIC800 SPK_P 4 LD801 R802 MAIN MIC SPEAKER COL[2] G4 R804 DNI KEY_LED_EN MAIN ANT PAD LINEAR MOTOR G1 2 .
PAGE 140
7. CIRCUIT DIAGRAM micro-SD SOCKET (Push-Pull Type w/ detect) USIM (6pin Normal) VOLUME KEY }ylnumjZUW} VREG_USIM_3.0V nMICROSD_DET CN100 KB100 SW113 VREG_SDCARD_2.85V 11 9 1 C1 VCC C2 RST C3 4 5 6 MMC_DATA[0] MMC_DATA[1] 7 USIM_RST CLK USIM_CLK 0 C5 umjz~w 12 14 C100 C101 C102 C103 33p 33p 0.1u 22p GND3 GND4 ] X 470 C104 DNI VA100 [ \ Z ] X Y [ \ Y 470 C105 C106 D100 0.
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7. CIRCUIT DIAGRAM VGA_MIPI(FPCB) RECEIVER P5 5 5M AF MIPI I/F 1 2 P1 P3 P2 P4 CN900 3 1 RCV_P 4 P6 5M_CSI_CLKP 6 Timing : DVDD-->IOVDD-->AVDD(SIMULTANEOUSLY) DVDD : TBD (1.2V or 1.8V) IOVDD : 1.7V - 3.0V AVDD : 2.6V - 2.9V 2 P1 P3 P4 P2 3 CN901 4 5 P5 6 P6 7 P7 8 P8 9 G1 10 G2 CN902 VREG_CAM_AVDD_2.8V P5 5 VREG_CAM_DVDD_1.8V 1 2 VREG_CAM_AVDD_2.8V P1 P3 P2 P4 3 VREG_CAM_IOVDD_1.
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8. BGA PIN MAP 8. BGA Pin Map 8.-U400 BGA- Memory PIN MAP MCP (Top View) U400 - Memory MCP (Top View) LGE Internal Use Only LGE Internal Use Only - 142 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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8. BGA PIN MAP - U200 - MSM7227A(bottom view) U200 - MSM7227A(bottom view) USE NOT IN USE LGE Internal Use Only LGE Internal Use Only - 143 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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8. BGA PIN MAP U1000 - RTR6285A (Top View) - U1000 - RTR6285A (Top View) USE NOT IN USE LGE Internal Use Only LGE Internal Use Only - 145 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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8. BGA PIN MAP U800 – WCN2243 (BT/FM) (Top View) -U800 – WCN2243 (BT/FM) (Top View) WCN2243 IC pin assignments, top view LGE Internal Use Only LGE Internal Use Only - 146 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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8. BGA PIN MAP U802– WCN1314 (WiFi) (Top View) - U802– WCN1314 (WiFi) (Top View) WCN1314 IC pin assignments (top view) USE NOT IN USE LGE Internal Use Only LGE Internal Use Only - 147 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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9. PCB LAYOUT 9.
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9. PCB LAYOUT CN601 : Sub FPCB conn. - no SIM - no T-flash memory - no Flash LED - no NFC U1003 : RF Amplifier - no Service CN500 : Battery Conn. CN600 : Lower FPCB conn. - no charging -no main Mic - no speaker -no vibrator TP702 SW1001 : RF S/W R619 CN500 R604 CN600 R620 R600 R602 R608 R607 C552 C609 R724 C1029 C1055 C1036 C1038 C604 R616 C551 R615 R610 R618 CN602 : Upper FPCB conn.
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9. PCB LAYOUT J100 : SIM Socket - no SIM CN100 : MicroSD Socket - no MicorSD LD100 LD100 : Flash LED TP1 C102 C103 U100 : Flash LED D-IC - no Flash K B 10 0 3 U100 1 C110 C108 E D A B C L101 CN100 C101 J100 D102 R102 C104 C806 U800 C100 C805 U800 : Compass/Accelerometer Sensor - no compass/accelerometer L100 D100 L103 C109 C105 C106 D101 L102 C107 VA101 VA100 R103 R104 VA102 R101 TP2 KB101 LG-P705_F_SUB-1.
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LD800 CN801 FB802 FB800 R 8 0 4 D804 ZD800 FL800 D802 C807 C800 ZD801 D803 FL801 ZD802 ANT802 C802 R802 C809 SW800 KB800 C803 ANT803 C804 C808 VA800 VA801 R803 R801 LD801 R800 9. PCB LAYOUT CN803 : Speaker connector D800 C564 R526 D801 CN803 BAT500 BAT500 :Backup Capacitor VB800 : Vibrator conn. VB800 12 CN801 : uUSB connector CN802 24 13 LG-P705_F_LOWER-1.0-BOT LGE Internal Use Only - 153 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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9. PCB LAYOUT MIC900 : Sub Mic ZD907 ZD906 U900 U900 : proximity sensor - no proximity sensor MIC 900 J900 : Ear-Jack conn. KB900 10 12 C909 FB900 R908 R909 C919 C918 FL900 13 24 FB904 11 20 C911 ZD903 C912 FB903 C915 ZD904 C913 C920 C916 ZD901 VA900 L900 VA901 6 VA902 R910 J900 CN902 FL901 10 5 CN903 CN903 : Touch Conn. CN901 ZD902 CN902 : VGA Camera Conn. CN901 : 5M Camera Conn. 28 FL902 27 FL906 54 CN904 LG-P705_F_UPPER_EAX64667901-1.
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10. CALIBRATION 10. CALIBRATION CAL INFORMATION S/W VERSION [TachyonV36]LGP705_20120316_Calibration Please check the final version to “B2B” H/W PIF Name Part No. PIF200(All Type) BJAY0024021 USB Cable USB Cable RAD32247898 Power Cable DC Power Cable RAD32247878 I/O Cable 5P E-SATA_DC_Plug RAD32167861 RF Cable_Main MS-156C BJAY0024004 Power Supply_PIF Power Supply 5.3V Power Supply_Phone Power Supply 5.
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10. CALIBRATION P705 MS695 [TachyonV36]LGP705_20120316_Calibration [Tachyon36]LGMS695_20120213_Calibration LGE Internal Use Only - 157 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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11. HIDDEN MENU 11. HIDDEN MENU Hidden Menu Start Start shortcut keys: 3845#*705# Hidden Menu Start the desired menu: Menu, click Version Info Classified Information representation -> Hidden Menu -> Settings -> Version Info LGE Internal Use Only - 176 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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11. HIDDEN MENU Factory Reset Format SD Card : SD Card Data reset Factory Reset : Reset as default Factory Settings Delete Userdata : Disabled -> Hidden menu -> WCDMA-Only -> Factory Reset AAT Device Test Allauto Test : -> You can test all functions automatically Auto All Test Result -> You can check Test Results LGE Internal Use Only - 177 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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11.
PAGE 179
11. HIDDEN MENU Camera Test - Camcoding Camera is recoding for 5 seconds VT Camera Test Show the VT Camera image 2D LCD Display Test Check Black & White Color LGE Internal Use Only - 179 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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11. HIDDEN MENU Sound Test Touch the “Play” icon Vibrator Test Touch the “Start” icon Touch Drawing Test Draw a guide line LGE Internal Use Only - 180 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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11. HIDDEN MENU Motion Sensor Test Check 3 positions -> Position horizontally -> Position Vertically -> Position side GPS BT Wifi Test GPS(RF) test : CNO is some value : OK Bluetooth Scanning is PASS : OK WiFi Scanning is PASS : OK Sound Loopback Test “Look Back On” is test mode on “Look Back OFF” is test mode off LGE Internal Use Only - 181 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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12. EXPLODED VIEW & REPLACEMENT PART LIST 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.
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12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 ReplacementParts Level LocationNo. 1 AGQ000000 Phone Assembly AGQ86787201 LGP705.ACISWH WH:WHITE WHITE - 2 MEZ002100 Label,Approval MLAA0062319 COMPLEX GU280 OREBK ZZ:Without Color COMPLEX, (empty), , , , , 2 ACQ100400 Cover Assembly,EMS ACQ86034301 LGP705.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 MCQ000000 5 ABM01 6 Description PartNumber Spec Damper MCQ67069001 COMPLEX LGP700.AFRAWH ZZ:Without Color - Can Assembly,Shield ABM73816101 LGP700.AFRAWH ZZ:Without Color - MJN000000 Tape MJN68138801 COMPLEX LGP700.AFRAWH ZZ:Without Color - 6 MCQ000002 Damper MCQ67068901 COMPLEX LGP700.AFRAWH ZZ:Without Color - 6 MCQ000001 Damper MCQ67068801 COMPLEX LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 5 MJN089300 Tape,Window MJN68114401 COMPLEX LGP700.AFRAWH ZZ:Without Color - 5 MKC009400 Window,Camera MKC64340201 CUTTING ACRYL LGP700.AFRAWH ZZ:Without Color - 5 MEZ000900 Label,After Service MLAB0001102 COMPLEX C2000 CGRSV WA:White C2000 USASV DIA 4.0 PRINTING, 5 MHK000001 Sheet MHK63751401 COMPLEX LGP700.AFRAWH BK:Black - 5 MHK000000 Sheet MHK63792701 COMPLEX LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 3 GMEY00 3 ACQ003400 7 PartNumber Spec Screw,Machine GMEY0011201 GMEY0011201 BH + 1.4mM 3mM MSWR FZB N N LG ELECTRONICS INC. Cover Assembly,Bar ACQ85950405 LGP700.AFRAWH WH:WHITE WHITE - ANT802 ANT803 Contact MCE62253601 COMPLEX LGLS685.ASPRZY ZZ:Without Color - 4 MBG00 Button MBG64528101 COMPLEX LGP700.AFRAWH WH:WHITE WHITE - 4 ACQ00 Cover Assembly,Front ACQ85922101 LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 MBG071300 Button,Side MBG64528301 5 MBG01 Button,Side (Volume) MBG64584901 MOLD PC LGP700.AFRAWH WH:WHITE WHITE - 5 MCK032700 Cover,Front MCK67131801 MOLD PC LGP700.AFRAWH WH:WHITE WHITE - 6 MET099500 INSERT,NUT MICE0016903 MECH_COMMON ZY,ZZ,PRESS, STS, , , , , 6 MET099501 INSERT,NUT MICE0016905 MECH_COMMON ZY,ZZ,PRESS, STS, , , , , 5 MCQ074200 Damper,Speaker MCQ66970001 COMPLEX LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 4 MJN01 Tape MJN68123501 COMPLEX LGP700.AFRAWH ZZ:Without Color - 4 MJN00 Tape MJN68227201 COMPLEX LGP700.AFRAWH ZZ:Without Color - 4 MEZ000000 Label MLAZ0038303 COMPLEX LG-LC3200 WA:White PRINTING, PPRI PRINTING 4 MAZ00 Bracket MAZ63410101 MOLD PA LGP700.AFRAWH ZZ:Without Color - 4 MBL00 Cap MBL65280101 MOLD PC LGP700.AFRAWH BK:Black - 4 MCQ00 Damper,Speaker MCQ66917201 COMPLEX LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber 1 AAD000000 Addition Assembly AAD86056501 LGP705.ACISWH WH:WHITE WHITE - 2 MEZ002101 Label,Approval MEZ64570001 CUTTING LAMI LGP940.ACISBK WA:White - 2 MEZ002100 Label,Approval MEZ64188201 COMPLEX LGA190.ACISBK ZZ:Without Color - 2 AFN053800 Manual Assembly Operation AFN75754701 LGP705.ACISBK ZZ:Without Color Manual assy for LGP705 CIS 2 ACQ02 Cover Assembly,Battery ACQ86009201 LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 3 MGA000000 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE - 2 MEZ084100 Label,Unit Box PRINTING GS200 CISBK ZZ:Without Color Unit MLAQ0018301 Box Label(CIS USE-LGE-Peel-90*40) CIS only_China_Peel_unit box label_90x40 2 MEZ047200 Label,Master Box MLAJ0004402 PRINTING CG300 CGR DG ZZ:Without Color LABEL MASTER BOX(for CGR TDR 2VER. mbox_label) GSM standard_master box label 2 MAY047100 Box,Master MBEE0061004 COMPLEX LGE730.
PAGE 191
12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 ReplacementParts
Level LocationNo. 3 EBR02 PCB Assembly,Main EBR75418001 LGP705.ACISWH 1.0 Main 4 EBR071800 PCB Assembly Main,SMT EBR75440701 LGP705.ANGRBK 1.0 Main 5 SAD010000 Software,Mobile SAD33443301 Base V09i - EUROPE QCT - 5 EBR071700 PCB Assembly Main,SMT Top EBR75440901 LGP705.ANGRBK 1.0 Main 6 R212 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber 6 C511 Capacitor,TA,Confo rmal ECTH0002703 TCTAL1A107M8R-V2 100uF 20% 10V 50UA 55TO+125C 2.5OHM 3.2X1.6X1.1MM NONE SMD R/TP 1.2T max. ROHM CO.,LTD. 6 R710 R711 R712 R713 Resistor,Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP - ROHM.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 U502 IC,DC,DC Converter EAN62186901 LM3530TMX-40 NOPB 2.7 to 5.5V adj 0W CSP R/TP 12P - NATIONAL SEMICONDUCOTR CORPORATION. 6 U506 IC,Mini ABB EAN62339701 LP8727- B MUIC with Charger IC CSP R/TP 25P TEXAS INSTRUMENTS KOREA LTD, HONGKONG BRANCH. 6 U200 IC,Digital Baseband Processor,3G EAN62408201 MSM7227A-1-AA 576NSP,ARMv7(1GHz),HSPA7.2Mbps,FWVGA30f ps,8M,MIPI CSI_DSI NSP R/TP 576P QUALCOMM INCORPORATED.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C215 C229 C328 C513 C514 C515 C516 C517 C518 C519 C521 C700 Capacitor Ceramic,Chip GRM155R61A104K 0.1uF 10% 10V X5R ECCH0000182 55TO+85C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. 6 C203 C402 C407 C408 C412 C417 C418 C532 C533 C535 C701 C714 C715 C716 C717 Capacitor Ceramic,Chip CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.
PAGE 195
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C201 C208 C209 C210 C211 C212 C213 C220 C221 Capacitor Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION 6 C222 Capacitor Ceramic,Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R 55TO+125C 0603 R/TP - TDK CORPORATION 6 C207 Capacitor Ceramic,Chip GRM033R71C222K 2.2nF 10% 16V X7R ECCH0009107 55TO+125C 0603 R/TP - KOREA MURATA ELECTRONICS CO. LTD.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C503 C508 C520 C530 C531 C536 C537 C538 C539 C540 C541 C542 C543 C544 C545 C546 C547 C548 C559 C565 C566 C567 C726 LGE Internal Use Only Description Capacitor Ceramic,Chip PartNumber ECZH0001215 Spec Remark C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA COOPERATION - 196 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C302 C303 C304 C305 C306 C307 C308 C309 C314 C315 C316 C317 C318 C319 C320 C321 C322 C323 C324 C325 C326 C327 C329 C332 C333 C334 C336 C338 C339 C340 C343 C345 C346 Capacitor Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R 25TO+70C 1005 BK-DUP - MURATA MANUFACTURING CO.,LTD. 6 C711 C713 Capacitor Ceramic,Chip ECZH0003126 GRM155R71A393K 39nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.
PAGE 198
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 D503 6 Description PartNumber Spec Diode,Switching EDSY0018601 SDS511Q 1.2V 85V 100mA 2A 4NSEC 150mW SOD523 R/TP 2P 1 AUK CORP ZD600 Diode,TVS EDTY0012101 PESD5V0F1BL 5.5V 6V min 11V 2.5A - SOD-882 R/TP 2P 1 STC CORP. 6 D501 D504 Diode,TVS EDTY0012102 PESD5V0V1BL 5V 5.8V min. 12.5V 4.8A 45W SOD-882 R/TP 2P 1 STC CORP. 6 L200 Inductor Multilayer,Chip ELCH0010401 LK1005 2R2K-T 2.2UH 10% - 20mA - - 1.
PAGE 199
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 R208 Resistor,Chip ERHY0042409 RC0201FR-0749R9L 49.9OHM 1% 1/20W 0603 R/TP - YAGEO CORPORATION 6 R524 Resistor,Chip ERHZ0000201 MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP - ROHM. 6 R544 Resistor,Chip ERHZ0000203 MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP - ROHM. 6 R501 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM. 6 R204 Resistor,Chip ERHZ0000206 MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP - ROHM.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 FB800 Filter,Bead EAM62471001 BLM03AX241SN1D 240 ohm 0.6X0.3X0.33 25% 0.38 ohm 0.35A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD. 6 U800 IC,Bluetooth EAN61966101 WCN-2243-0-58BWLNSP-S/TR-05 17VTO2.7V,2.2VTO3V,1.7VTO1.9V 120mW 58P WLCSP R/TP-T 58P QUALCOMM INCORPORATED. 6 U700 IC,Comparator EAN62065901 MAX14579E 2.5~5.
PAGE 201
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C1104 C811 C815 Capacitor Ceramic,Chip MCH153CN103KK 10nF 10% 16V X7R ECCH0000155 55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 C1095 C1096 C1099 Capacitor Ceramic,Chip GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 ECCH0000175 55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. 6 C1012 C1014 C1103 Capacitor Ceramic,Chip GRM1555C1H3R3C 3.3pF 0.25PF 50V NP0 ECCH0000180 55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.
PAGE 202
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo.
PAGE 203
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C1017 C1029 C1036 C1038 C1041 C1048 C1055 C604 C606 C805 C806 C827 Capacitor Ceramic,Chip CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C835 Capacitor Ceramic,Chip GRM033R60J224M 0.00000022F 20% 6.3V X5R ECCH0032801 55TO+85C 0603 R/TP 0.3MM MURATA MANUFACTURING CO.,LTD.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 C752 Capacitor Ceramic,Chip ECZH0001216 C1005X5R1A224KT000E 220nF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C302 C303 C304 C305 C306 C307 C308 C309 C314 C315 C316 C317 C318 C319 C320 C321 C322 C323 C324 C325 C326 C327 C329 C332 C333 C334 C336 C338 C339 C340 C343 C345 C346 Capacitor Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R 25TO+70C 1005 BK-DUP - MURATA MANUFACTURING CO.,LTD.
PAGE 205
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 L803 Inductor Multilayer,Chip ELCH0001035 HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD 6 L810 Inductor Multilayer,Chip ELCH0001040 HK1005 3N9S-T 3.9NH 0.3NH - 300mA 0.21OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD 6 L1007 L1037 Inductor Multilayer,Chip ELCH0001048 1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM 2.5GHZ 8 SHIELD NONE 1.0X0.5X0.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 L1003 L801 L802 Inductor Multilayer,Chip ELCH0001425 LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC. 6 C1106 C841 Inductor Multilayer,Chip ELCH0003815 LQG15HS2N7S02D 2.7NH 0.3NH - 300mA 0.15OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATA MANUFACTURING CO.,LTD. 6 C1072 L1010 Inductor Multilayer,Chip ELCH0003819 LQG15HS12NJ02D 12NH 5% - 300mA - - 0.28OHM 3GHZ 8 SHIELD NONE 1.0X0.5X0.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 L1029 Inductor Multilayer,Chip ELCH0004710 1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L1033 Inductor Multilayer,Chip ELCH0004716 1005GC2T39NJLF 39NH 5% - 200mA 1.2OHM 1.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L1008 Inductor Multilayer,Chip ELCH0004718 1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM 3.2GHZ 8 SHIELD NONE 1.0X0.5X0.
PAGE 208
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Connector,BtoB ENBY0057501 24-5804-034-000-829+ 34,0.4 mm,STRAIGHT,gold,34,0.40MM,STRAIGHT,FEMA LE,SMD,0.9T, KYOCERA ELCO KOREA SALES CO.,LTD. 20279-001E-01 NONE STRAIGHT SOCKET SMD R/TP AU 50OHM 400mDB I-PEX CO., LTD 6 CN601 6 SW1000 Connector,RF ENWY0005501 6 SW1001 Connector,RF MS-156C NONE STRAIGHT SOCKET SMD ENWY0008701 T/REEL AU 50OHM 400mDB HIROSE KOREA CO.
PAGE 209
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 R807 R808 6 PartNumber Spec Resistor,Chip ERHZ0000348 MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP - ROHM. R1014 R621 Resistor,Chip ERHZ0000401 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP ROHM. 6 R1013 Resistor,Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP ROHM. 6 R408 R528 Resistor,Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM.
PAGE 210
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 FL1005 Filter,Duplexer,IMT B7697 2140000000 2112.4 to 2167.6 1950000000 SDMY0003001 1922.4 to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD R/TP - EPCOS PTE LTD. 6 FL1002 Filter,Duplexer,IMT B7675 942500000 925 to 960 897500000 880 to SDMY0003701 915 3.5 3.1 2.5*2.0*0.68 DUAL SMD R/TP EPCOS PTE LTD. 6 FL800 Filter,Separator SFAY0012401 LFD181G57DPFC087 0.6 22 - 2400 to 2500,1572 to 1578,0.6 dB,0.
PAGE 211
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 FL801 Filter,Saw SFSY0038901 SAFEB1G57KB0F00 SAFEB1G57KB0F00 SAFEB1G57KB0F00,1575.42 MHz,1.4*1.1*0.6 ,SMD ,1574.22M~1576.62M, IL 0.8, 5pin, U-U, 5050, GPS LOW LOSS MURATA MANUFACTURING CO.,LTD. MURATA MANUFACTURING CO.,LTD. 6 U1002 IC,Power Amplifier SMPY0020001 SKY77195 SKY77195,28 dBm,%,A,dBc,dB,4x5,SMD,3G Dual PAM Band 1+8. CPL integrated SKYWORKS SOLUTIONS INC.
PAGE 212
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 8 C1006 C1010 C1032 Capacitor Ceramic,Chip ECCH0009104 C0603C0G1H330JT00NN 33pF 5% 50V C0G 55TO+125C 0603 R/TP - TDK CORPORATION 8 R101 R103 R104 Resistor,Chip ERHZ0000285 MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP - ROHM. 8 VA100 VA101 VA102 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY 8 CN100 Socket,Card EAG62830201 104031-0811 SD 8P ANGLE SMD R/TP 11.95x11.40x1.
PAGE 213
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 8 C201 C208 C209 C210 C211 C212 C213 C220 C221 Capacitor Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION 8 R102 Resistor,Chip ERHY0042402 RC0201JR-0715KL 15KOHM 5% 1/20W 0603 R/TP - YAGEO CORPORATION 8 L100 Resistor,Chip ERHY0009501 MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP ROHM. 8 U100 IC,DC,DC Converter EAN62410701 AS3647 2.7 to 4.
PAGE 214
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 5 EBR070400 PCB Assembly Flexible,SMT EBR75099901 LGP700.AFRABK 1.0 Flexible 6 EAX010700 PCB,Flexible EAX64658101 LGP700.AFRABK 1.0 POLYI SBL 4 0.3 Flexible 6 EBR070300 PCB Assembly Flexible,SMT Top EBR75100001 LGP700.AFRABK 1.0 Flexible 7 SUMY00 Microphone Condenser SUMY0010616 SUMY0010616 FPCB,dB,1.1TO10V, KNOWLES ACOUSTICS 6 EBR070200 PCB Assembly Flexible,SMT Bottom EBR75035701 LGP700.AFRABK 1.
PAGE 215
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 7 ZD801 ZD802 7 Description PartNumber Spec Diode,TVS EDTY0012501 UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A SLP1006P2T R/TP 2P 1 SEMTECH CORPORATION C803 Inductor Multilayer,Chip ELCH0001052 1005GC2T18NJLF 18NH 5% - 200mA 0.65OHM 1.6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 7 R802 R803 Resistor,Chip ERHY0008207 RC1005F470CS 47OHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.
PAGE 216
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 7 C503 C508 C520 C530 C531 C536 C537 C538 C539 C540 C541 C542 C543 C544 C545 C546 C547 C548 C559 C565 C566 C567 C726 7 Description PartNumber Spec Capacitor Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA COOPERATION CN802 Connector,BtoB ENBY0056801 14-5804-024-000-829+ 24P 0.40MM STRAIGHT MALE SMD R/TP 900mM - KYOCERA ELCO KOREA SALES CO.,LTD.
PAGE 217
12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 EAX010700 PCB,Flexible EAX64667901 LGP700.AFRABK 1.1 FR-4 SBL 4 0.4 Flexible 6 EBR070300 PCB Assembly Flexible,SMT Top EBR75099601 LGP700.AFRABK 1.0 Flexible 7 ZD600 Diode,TVS EDTY0012101 PESD5V0F1BL 5.5V 6V min 11V 2.5A - SOD-882 R/TP 2P 1 STC CORP. 7 D800 D801 D802 Diode,TVS EDTY0008606 PRSB6.8C 4.7V 5.7 11.5V 1A 10W DFN-2 R/TP 2P 1 PROTEK DEVICES INC. 6 EBR070200 PCB Assembly Flexible,SMT Bottom EBR75099701 LGP700.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 7 J900 7 Description PartNumber Spec Jack,Phone EAG63070601 KJA-PH-4-0176 5P 2P ANGLE R/TP 3.5M BLACK 5P - KSD CO., LTD VA100 VA101 VA102 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY 7 C1017 C1029 C1036 C1038 C1041 C1048 C1055 C604 C606 C805 C806 C827 Capacitor Ceramic,Chip CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 7 CN904 7 Description PartNumber Spec Connector,BtoB ENBY0042601 GB042-54P-H10 54P 0.40MM STRAIGHT MALE SMD R/TP 1M - LS Mtron Ltd. R908 Resistor,Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP ROHM. 7 L900 Inductor Multilayer,Chip ELCH0001444 0402AF-101XJEW 100NH 5% - 900mA 0.16OHM 1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM R/TP COILCRAFT SINGAPORE PTE LTD.
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12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 4 EAD00 LGE Internal Use Only Description Cable,Assembly PartNumber EAD62064601 Spec Remark 80421-202B-92L-01 UFL-LP-066 UFL-LP-066 0.09M 2 BLACK N N I-PEX CO., LTD - 220 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Level LocationNo. 2 EAC00 2 Note: This Chapterisused for reference,Part order is ordered by SBOM standard onGCSC Description PartNumber Spec Rechargeable Battery Lithium Ion EAC61839001 BL-44JH_LGC_UPPER PRISMATIC 3.8V 1.65AH 330mAH 61.0x44.0x4.4 65.0x44.0x4.8Max BLACK Top cap Assembly - LG Chem,LTD. MFL053800 Manual,Operation MFL67528301 PRINTING LGP705.