Users Manual Part 1
Page 16 of 21
Chapter5Productionguidance
5.1Productionguide
It is recommended to use SMT machine patch, and the patch should completed within
24 hours after unpacking, otherwise it is necessary to re-vacuate the package to avoid the
bad condition caused by moisture.。
If the package contains a humidity indicator card, it is recommended to judge whether
the module needs to be baked according to the humidity card indication. The conditions for
baking are as follows:
Baking temperature：125° C±5° C;
Set alarm temperature to 130° C;
After cooling <36 ° C under natural conditions, the SMT patch can be performed;
If the unpacking time is more than 3 months, special attention should be paid to
whether the product is damp or not. Because the PCB immersion gold process may cause
the pad to oxidize for more than 3 months, it may cause problems such as rosin joint and
dry joint.
In order to ensure the reflow soldering pass rate, it is recommended to extract 10% of
the products for visual inspection and AOI testing for the first time to ensure the
correctness of furnace temperature control, device adsorption mode and placement method.
Operators at all stations in the entire production process must wear electrostatic
gloves.
5.2Modulerequirementsforfloorposition
It is recommended that the green oil thickness of the bottom plate module position is
less than 0.02mm, to avoid excessive thickness, and the high height module cannot
effectively contact the solder paste to affect the welding quality.
In addition, the module needs to reserve 2mm space around to ensure the maintenance
of it.