Datasheet

LT1129/LT1129-3.3/LT1129-5
14
112935ff
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
Q(DD5) 0502
.028 – .038
(0.711 – 0.965)
TYP
.143
+.012
–.020
()
3.632
+0.305
–0.508
.067
(1.702)
BSC
.013 – .023
(0.330 – 0.584)
.095 – .115
(2.413 – 2.921)
.004
+.008
–.004
()
0.102
+0.203
–0.102
.050 ± .012
(1.270 ± 0.305)
.059
(1.499)
TYP
.045 – .055
(1.143 – 1.397)
.165 – .180
(4.191 – 4.572)
.330 – .370
(8.382 – 9.398)
.060
(1.524)
TYP
.390 – .415
(9.906 – 10.541)
15° TYP
.420
.350
.565
.090
.042
.067
RECOMMENDED SOLDER PAD LAYOUT
.325
.205
.080
.565
.090
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
.042
.067
.420
.276
.320
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.300
(7.620)
.075
(1.905)
.183
(4.648)
.060
(1.524)
.060
(1.524)
.256
(6.502)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
Q Package
5-Lead Plastic DD Pak
(LTC DWG # 05-08-1461)