Datasheet

LT1634
11
1634fe
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 0307 REV F
0.53
p
0.152
(.021
p
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
p
0.0508
(.004
p
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
p
0.152
(.193
p
.006)
8
7
6
5
3.00
p
0.102
(.118
p
.004)
(NOTE 3)
3.00
p
0.102
(.118
p
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
Z Package
3-Lead Plastic TO-92 (Similar to TO-226)
(Reference LTC DWG # 05-08-1410)
.050
(1.27)
BSC
.060 ± .005
(1.524± 0.127)
DIA
.90
(2.286)
NOM
.
180
±
.
005
(4.572 ± 0.127)
.180 ± .005
(4.572 ± 0.127)
.500
(12.70)
MIN
.050
(1.270)
MAX
UNCONTROLLED
LEAD DIMENSION
.016 ± .003
(0.406 ± 0.076)
5°
NOM
.015 ± .002
(0.381 ± 0.051)
.060 ± .010
(1.524 ± 0.254)
10° NOM
.140 ± .010
(3.556 ± 0.127)
Z3 (TO-92) 0801
321
.098 +.016/–.04
(2.5 +0.4/–0.1)
2 PLCS
TO-92 TAPE AND REEL
REFER TO TAPE AND REEL SECTION OF
LTC DATA BOOK FOR ADDITIONAL INFORMATIO