Datasheet
2
LT1769
1769fa
ABSOLUTE MAXIMUM RATINGS
W
WW
U
PACKAGE/ORDER INFORMATION
W
U
U
ORDER PART
NUMBER
*ALL V
CC
PINS SHOULD
BE CONNECTED
TOGETHER CLOSE TO
THE PINS
** ALL GND PINS ARE
FUSED TO INTERNAL DIE
ATTACH PADDLE FOR
HEAT SINKING. CONNECT
THESE PINS TO
EXPANDED PC LANDS
FOR PROPER HEAT
SINKING. 35°C/W
THERMAL RESISTANCE
ASSUMES AN INTERNAL
GROUND PLANE
DOUBLING AS A HEAT
SPREADER
LT1769CGN
LT1769IGN
T
JMAX
= 125°C, θ
JA
= 35°C/ W**
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
GN PACKAGE
28-LEAD PLASTIC SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND**
GND**
GND**
SW
BOOST
UV
GND**
GND**
OVP
CLP
CLN
COMP1
SENSE
GND**
GND**
GND**
GND**
V
CC1
*
V
CC2
*
V
CC3
*
GND**
PROG
V
C
UV
OUT
COMP2
BAT
SPIN
GND**
Supply Voltage
(V
CC
, CLP and CLN Pin Voltage)......................... 30V
BOOST Pin Voltage with Respect to V
CC
................. 25V
I
BAT
(Average)........................................................... 2A
Operating Junction Temperature Range
Commercial ........................................... 0°C to 125°C
Industrial ......................................... –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
(Note 1)
Operating Ambient Temperature
Commercial ............................................ 0°C to 70°C
Industrial ........................................... –40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)..................300°C
ORDER PART
NUMBER
LT1769CFE
LT1769IFE
FE PACKAGE
20-LEAD PLASTIC TSSOP
1
2
3
4
5
6
7
8
9
10
TOP VIEW
20
19
18
17
16
15
14
13
12
11
SW
BOOST
UV
GND
GND
OVP
CLN
CLP
COMP1
SENSE
GND
V
CC1
V
CC2
V
CC3
PROG
V
C
GND
UV
OUT
BAT
SPIN
T
JMAX
= 125°C, θ
JA
= 35°C/W
†
†
THE BOTTOM METAL
PLATE OF THIS PACKAGE
IS FUSED TO INTERNAL
GROUND AND IS FOR
HEAT SINKING. SOLDER
THE BOTTOM METAL
PLATE ONTO PCB
GROUND PLANE FOR
HEAT SINKING.
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
CC
= 16V, V
BAT
= 8V, R
S2
= R
S3
= 200Ω (see Block Diagram),
V
CLN
= V
CC
. No load on any outputs unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Overall
Supply Current V
PROG
= 2.7V, V
CC
≤ 20V ● 4.5 6.8 mA
V
PROG
= 2.7V, 20V < V
CC
≤ 25V ● 4.6 7.0 mA
Sense Amplifier CA1 Gain and Input Offset Voltage 8V ≤ V
CC
≤ 25V , 0V ≤ V
BAT
≤ 20V
(With R
S2
= 200Ω, R
S3
= 200Ω)R
PROG
= 4.93k ● 93 100 107 mV
(Measured across R
S1
)(Note 2) R
PROG
= 49.3k ● 81012 mV
T
A
< 0°C713mV
V
CC
= 28V, V
BAT
= 20V
R
PROG
= 4.93k ● 90 110 mV
R
PROG
= 49.3k ● 713mV
T
A
< 0°C614mV
EXPOSED PAD IS GROUND
(MUST BE SOLDERED TO PCB)
EXPOSED PAD SIZE:
3.0
(.188)
×
4.1
(.162)