Datasheet

18
LT1794
U
PACKAGE DESCRIPTIO
Dimensions in inches (millimeters) unless otherwise noted.
FE20 (CA) TSSOP 0203
0.09 – 0.20
(.0036 – .0079)
0
° – 8°
RECOMMENDED SOLDER PAD LAYOUT
0.45 – 0.75
(.018 – .030)
4.30 – 4.50*
(.169 – .177)
6.40
BSC
134
5
6
7
8910
111214 13
6.40 – 6.60*
(.252 – .260)
4.95
(.195)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
2
2.74
(.108)
0.45
±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
4.95
(.195)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CA