Datasheet

LT1963A Series
26
1963aff
For more information www.linear.com/LT1963A
pacKage DescripTion
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev J)
Exposed Pad Variation BB
FE16 (BB) TSSOP REV J 1012
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.94
(.116)
3.05
(.120)
3.58
(.141)
3.58
(.141)
4.70
(.185)
MILLIMETERS
(INCHES)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
SEE NOTE 4
NOTE 5
NOTE 5
6.40
(.252)
BSC
5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION
IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED
TRACES OR VIAS ON PBC LAYOUT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
DETAIL A
DETAIL A IS THE PART OF THE
LEAD FRAM FEATURE FOR
REFERENCE ONLY
NO MEASUREMENT PUROSE
0.56
(.022)
REF
0.53
(.021)
REF
DETAIL A