Datasheet

ManualsBrandsLINEAR TECHNOLOGY ManualsPMICsPMIC - DC/DC voltage regulator Holder QFN 24

LT3688

3688f

FE24 (AA) TSSOP 0208 REV Ø

0.09 – 0.20

(.0035 – .0079)

0o – 8o

0.25

REF

RECOMMENDED SOLDER PAD LAYOUT

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

134

8 9 10 11 12

14 13

7.70 – 7.90*

(.303 – .311)

3.25

(.128)

2.74

(.108)

2021222324 19 18 17 16 15

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

2.74

(.108)

0.45 p0.05

0.65 BSC

4.50 p0.10

6.60 p0.10

1.05 p0.10

3.25

(.128)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC

FE Package

24-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1771 Rev Ø)

Variation AA

PACKAGE DESCRIPTION

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

UF Package

24-Lead Plastic QFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1697)

4.00 ± 0.10

(4 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

2423

BOTTOM VIEW—EXPOSED PAD

2.45 ± 0.10

(4-SIDES)

0.75 ± 0.05

R = 0.115

TYP

0.25 ± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UF24) QFN 0105

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 ±0.05

0.25 ±0.05

0.50 BSC

2.45 ± 0.05

(4 SIDES)

3.10 ± 0.05

4.50 ± 0.05

PACKAGE

OUTLINE

PIN 1 NOTCH

R = 0.20 TYP OR

0.35 × 45° CHAMFER