Datasheet

LT8582
35
8582f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DKD Package
24-Lead Plastic DFN (7mm × 4mm)
(Reference LTC DWG # 05-08-1864 Rev Ø)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.25 p 0.05
112
13 24
5.50 REF
6.43 p0.10
2.64 p0.10
4.00 p0.10
0.75 p0.05
0.00 – 0.050.200 REF
7.00 p0.10
(DKD24) QFN 0210 REV Ø
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 s 45o CHAMFER
6.43 p0.05
2.64 p0.05
0.70 p 0.05
0.50 BSC
5.50 REF
3.10 p 0.05
4.50 p 0.05
0.40 p 0.10
0.25 p 0.05
PACKAGE
OUTLINE
R = 0.05
TYP
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.