Datasheet

7
LTC1382
1382fa
N18 0502
.020
(0.508)
MIN
.125
(3.175)
MIN
.130 ± .005
(3.302 ± 0.127)
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.018 ± .003
(0.457 ± 0.076)
.005
(0.127)
MIN
.100
(2.54)
BSC
.255 ± .015*
(6.477 ± 0.381)
.900*
(22.860)
MAX
18
12
3
4
56
7
8
9
1011
121314
16
1517
.009 – .015
(0.229 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
SW Package
18-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
N Package
18-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
S18 (WIDE) 0502
NOTE 3
.447 – .463
(11.354 – 11.760)
NOTE 4
15
14 13
12
11
10
16
9
N/2
1
23
4
5
6
78
.394 – .419
(10.007 – 10.643)
1718
N
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
.420
MIN
.325 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
N
123 N/2
.050 BSC
.030 ±.005
TYP
.005
(0.127)
RAD MIN
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
U
PACKAGE DESCRIPTIO