Datasheet

LTC1992 Family
40
1992fb
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 p 0.0508
(.004 p .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90 p 0.152
(.193 p .006)
8
7
6
5
3.00 p 0.102
(.118 p .004)
(NOTE 3)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC