Datasheet

9
LTC2051/LTC2052
20512fd
–
+
1/2 LTC2051
–
+
A1
–
+
1/2 LTC2051
6
3
2
5
R4
R5
R3
20512 F01
R2
5V
R1
+
–
C2
C1
7
1
6
8
1
3
2
OUT
OUT
Obtaining Ultralow V
OS
Drift and Low Noise
A1 R1 R2 R3 R4 R5 C1 C2 e
IN
(DC – 1Hz) e
IN
(DC – 10Hz)
LT1677 2.49k 3.01k 340k 10k 100k 0.01μF 0.001μF 0.15μV
P-P
0.2μV
P-P
LT1012 750Ω 57Ω 250k 10k 100k 0.01μF 0.001μF 0.3μV
P-P
0.4μV
P-P
TYPICAL APPLICATIO
U
U
PACKAGE DESCRIPTIO
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)