Datasheet

LTC2172-14/
LTC2171-14/LTC2170-14
32
21721014fb
package DescripTion
UKG Package
52-Lead Plastic QFN (7mm × 8mm)
(Reference LTC DWG # 05-08-1729 Rev Ø)
7.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45°C
CHAMFER
0.40 ± 0.10
5251
1
2
BOTTOM VIEW—EXPOSED PAD
TOP VIEW
SIDE VIEW
6.50 REF
(2 SIDES)
8.00 ± 0.10
(2 SIDES)
5.50 REF
(2 SIDES)
0.75 ± 0.05
0.75 ± 0.05
R = 0.115
TYP
R = 0.10
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
6.45 ±0.10
5.41 ±0.10
0.00 – 0.05
(UKG52) QFN REV Ø 0306
5.50 REF
(2 SIDES)
5.41 ±0.05
6.45 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
6.10 ±0.05
7.50 ±0.05
6.50 REF
(2 SIDES)
7.10 ±0.05 8.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE