Datasheet

19
LTC2847
sn2847 2847fs
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
0.40 ± 0.10
37
1
2
38
BOTTOM VIEW—EXPOSED PAD
5.15 ± 0.10
(2 SIDES)
7.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
(UH) QFN 0303
0.50 BSC
0.200 REF
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
3.15 ± 0.10
(2 SIDES)
0.18
0.18
0.23
0.435
0.00 – 0.05
0.75 ± 0.05
0.70 ± 0.05
0.50 BSC
5.20 ± 0.05 (2 SIDES)
3.20 ± 0.05
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
5.50 ± 0.05
(2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
0.25 ± 0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)