Datasheet

LTC2945
32
2945fa
For more information www.linear.com/LTC2945
UD Package
12-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1855 Rev Ø)
package DescripTion
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
11 12
2
0.50 BSC
0.200 REF
2.10 ± 0.05
3.50
± 0.05
0.70 ±0.05
0.00 – 0.05
(UD12) QFN 0709 REV Ø
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE