Datasheet

LTC3112
29
3112fc
For more information www.linear.com/LTC3112
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.00 ±0.10
(2 SIDES)
5.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJGD-2) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
2.44 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
4.34 ±0.10
(2 SIDES)
18
169
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DHD16) DFN REV A 1113
0.25 ±0.05
PIN 1
NOTCH
0.50 BSC
4.34 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.44 ±0.05
(2 SIDES)
3.10 ±0.05
0.50 BSC
0.70 ±0.05
4.50 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
DHD Package
16-Lead Plastic DFN (5mm × 4mm)
(Reference LTC DWG # 05-08-1707 Rev A)