Datasheet

LTC4311
11
4311fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
2.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE
M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.38 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.56 ± 0.05
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
1.37 ±0.05
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC6) DFN 1103
0.25 ± 0.05
1.42 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 ±0.05
(2 SIDES)
1.15 ±0.05
0.675 ±0.05
2.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
0.50 BSC
PIN 1
CHAMFER OF
EXPOSED PAD
1.15 – 1.35
(NOTE 4)
1.80 – 2.40
0.15 – 0.30
6 PLCS (NOTE 3)
SC6 SC70 1205 REV B
1.80 – 2.20
(NOTE 4)
0.65 BSC
PIN 1
0.80 – 1.00
1.00 MAX
0.00 – 0.10
REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
8. JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB
2.8 BSC
0.47
MAX
0.65
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.8 REF
1.00 REF
INDEX AREA
(NOTE 6)
0.10 – 0.18
(NOTE 3)
0.26 – 0.46
GAUGE PLANE
0.15 BSC
0.10 – 0.40
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
SC6 Package
6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638 Rev B)