Datasheet

10
LTC485
TYPICAL APPLICATIO S
U
Typical RS485 Network
R
t
LTC485 • TA03
R
t
PACKAGE DESCRIPTIO
U
Dimensions in inches (millimeters) unless otherwise noted.
J8 Package
8-Lead Ceramic DIP
J8 0293
0.014 – 0.026
(0.360 – 0.660)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.125
3.175
MIN
0.100 ± 0.010
(2.540 ± 0.254)
0.290 – 0.320
(7.366 – 8.128)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.385 ± 0.025
(9.779 ± 0.635)
0.005
(0.127)
MIN
0.405
(10.287)
MAX
0.220 – 0.310
(5.588 – 7.874)
12
3
4
87
65
0.025
(0.635)
RAD TYP
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION 
(4 PLCS)
0.045 – 0.068
(1.143 – 1.727)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.