Datasheet

11
LTC485
PACKAGE DESCRIPTIO
U
Dimensions in inches (millimeters) unless otherwise noted.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
N8 Package
8-Lead Plastic DIP
N8 0392
0.045 ± 0.015
(1.143 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.020
(0.508)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.125
(3.175)
MIN

12
3
4
876
5
0.250 ± 0.010
(6.350 ± 0.254)


0.400
(10.160)
MAX
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.320
(7.620 – 8.128)
0.325
+0.025
–0.015
+0.635
–0.381
8.255
()
1
2
3
4
0.150 – 0.157
(3.810 – 3.988)
8
7
6
5
0.189 – 0.197
(4.801 – 5.004)
0.228 – 0.244
(5.791 – 6.197)
0.016 – 0.050
0.406 – 1.270
0.010 – 0.020
(0.254 – 0.508)
× 45°
0°– 8° TYP
0.008 – 0.010
(0.203 – 0.254)
SO8 0392
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
BSC
S8 Package
8-Lead Plastic SOIC