Datasheet

LTM4644/LTM4644-1
26
Rev. F
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APPLICATIONS INFORMATION
Layout Checklist/Example
The high integration of LTM4644 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid
-
erations are still necessary.
Use large PCB copper areas for high current paths,
including V
IN1
to V
IN4
, GND, V
OUT1
to V
OUT4
. It helps to
minimize the PCB conduction loss and thermal stress.
Place high frequency ceramic input and output capaci
-
tors next to the V
IN
, GND and V
OUT
pins to minimize
high frequency noise.
Place a dedicated power ground layer underneath the
unit.
To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
Do not put via directly on the pad, unless they are
capped or plated over.
Use a separated SGND ground copper area for com
-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
For parallel modules, tie the V
OUT
, V
FB
, and COMP pins
together. Use an internal layer to closely connect these
pins together. The TRACK/SS pin can be tied a common
capacitor for regulator soft-start.
Bring out
test
points on the signal pins for monitoring.
Figure 32 gives a good example of the recommended layout.
Figure 32. Recommended PCB Layout
C
OUT
C
OUT
C
OUT
C
IN
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