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HSDL-3220

IrDA

Data Compliant Low Power 4.0 Mbit/s

Infrared Transceiver

Data Sheet

Description

The HSDL-3220 is a new generation low profile high

speed infrared transceiver module that provides inter-

face between logic and IR signals for through-air, serial,

half-duplex IR data-link. The module is fully compliant

to IrDA Physical Layer specification version 1.4 low

power from 9.6kbit/s to 4.0 Mbit/s (FIR) and is IEC825-

Class 1 Eye Safe.

The HSDL-3220 can be shutdown completely to achieve

very low power consumption. In the shutdown mode,

the PIN diode will be inactive and thus producing very

little photocurrent even under very bright ambient

light. It is also designed to interface to input/output

logic circuits as low as 1.8V. These features are ideal for

mobile devices that require low power consumption.

Features

•

Fully compliant to IrDA 1.4 physical layer low power

specication from 9.6 kbit/s to 4.0 Mbit/s (FIR)

• Miniature package

– Height: 2.5 mm

– Width: 8.0 mm

– Depth: 3.0 mm

• Typical link distance > 50 cm

•

Guaranteed temperature performance, -25

to 70

•

Critical parameters are guaranteed over temperature

and supply voltage

• Low power consumption

–

Low shutdown current

– Complete shutdown of TXD, RXD and PIN diode

• Excellent EMI performance

• Vcc supply 2.7 to 3.6 Volts

• Interfacing with I/O logic circuits as low as 1.8 V

• Lead-free package

• LED stuck-high protection

• Designed to accommodate light loss with cosmetic

windows

• IEC 825-class 1 eye safe

Applications

• Mobile telecom

– Mobile phones

– Smart phones

– Pagers

• Data communication

– Pocket PC handheld products

– Personal digital assistants

– Portable printers

• Digital imaging

– Digital cameras

– Photo-imaging printers

• Electronic wallet

• Small industrial & medical instrumentation

– General data collection devices

– Patient & pharmaceutical data collection devices

Figure 1. Functional block diagram of HSDL-3220.

Figure 2. Rear view diagram with pinout.

12345678

TRANSMITTER

HSDL-3220

CX1

CX2

CX4

SD (5)

RXD (4)

(6)

IOV

(7)

GND (8)

led

CX3

TXD (3)

LED C (2)

LED A (1)

RECEIVER

SHIELD

Summary of content (18 pages)

PAGE 1
HSDL-3220 IrDA® Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver Data Sheet Features Description The HSDL-3220 is a new generation low profile high speed infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data-link. The module is fully compliant to IrDA Physical Layer specification version 1.4 low power from 9.6kbit/s to 4.0 Mbit/s (FIR) and is IEC825Class 1 Eye Safe.
PAGE 2
Application Support Information The Application Engineering Group is available to assist you with the application design associated with the HSDL-3220 infrared transceiver module. You can contact them through your local sales representatives for additional details.
PAGE 3
Bandwidth Selection Timing The transceiver is in default SIR/ MIR mode when powered on. User needs to apply the following programming sequence to both the SD and TXD inputs to enable the transceiver to operate at FIR mode. VIH VIH 50% SD/MODE 50% SD/MODE VIL VIL tS tS tH tH VIH TXD 50% TXD 50% 50% 50% VIL VIL Figure 3. Bandwidth selection timing at SIR/MIR mode. Figure 4. Bandwidth selection timing at FIR mode. Setting the transceiver to SIR/MIR Mode (9.6 kbit/s to 1.
PAGE 4
Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤50°C/W. Parameter Symbol Min. Max. Units Conditions Storage Temperature TS -40 +100 °C Operating Temperature TA -25 +70 °C LED Anode Voltage VLEDA 0 6.5 V Supply Voltage VCC 0 6.5 V Input Voltage: TXD, SD/Mode VI 0 6.5 V Output Voltage: RXD VO 0 DC LED Transmit Current ILED (DC) 6.
PAGE 5
Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V and IOVcc set to 1.8V unless otherwise noted. Parameter Symbol Min. Typ. Max. Viewing Angle 2θ 30 Peak Sensitivity Wavelength λp Units Conditions Receiver RXD Output Voltage Logic High VOH 880 ° nm IOVCC – 0.
PAGE 6
tpw VOH tpw 90% LED ON 90% 50% 50% 10% VOL LED OFF tf 10% tr tr tf Figure 6. LED optical waveform. Figure 5. RxD output waveform. SD TXD RX LIGHT RXD LED tpw (MAX.) tRW Figure 7. TxD “Stuck On” protection waveform. Figure 8. Receiver wakeup time waveform. 2.4 100 2.2 80 VLEDA (V) RADIANT INTENSITY (mW/sr) 120 60 40 0.15 0.20 0.25 0.30 ILEDA (A) Figure 9. Radiant Intensity vs ILEDA. 1.8 1.6 20 0 0.10 2.0 0.35 1.4 0.10 0.15 0.20 0.25 ILEDA (A) Figure 10.
PAGE 7
HSDL-3220 Package Dimensions
PAGE 8
HSDL-3220 Tape and Reel Dimensions 4.0 ± 0.1 Unit: mm 1.75 ± 0.1 1.5 ± 0.1 Ø1.5 +0.10 POLARITY Pin 8: VLED 7.5 ± 0.1 16.0 ± 0.2 Pin 1: GND 0.4 ± 0.05 8.4 ± 0.1 3.4 ± 0.1 2.8 ± 0.1 8.0 ± 0.1 Progressive Direction Empty Parts Mounted Leader (400 mm min) (40 mm min) Empty (40 mm min) Option # "B" "C" Quantity 001 178 60 500 021 330 80 2500 Unit: mm Detail A 2.0 ± 0.5 B C 13.0 ± 0.5 R1.0 LABEL 21 ± 0.8 Detail A 16.4 +2 0 2.0 ± 0.
PAGE 9
Moisture Proof Packaging All HSDL-3220 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In reels In bulk 60°C ≥ 48 hours 100°C ≥ 4 hours 125°C ≥ 2 hours 150°C ≥ 1 hour Baking should only be done once.
PAGE 10
Recommended Reflow Profile MAX. 260 C T – TEMPERATURE – ( C) 255 R3 230 220 200 180 R2 60 sec. MAX. ABOVE 220 C 160 R1 120 R4 R5 80 25 0 50 100 150 200 250 300 t-TIME (SECONDS) P2 SOLDER PASTE DRY P3 SOLDER REFLOW Process Zone Symbol ∆T Maximum ∆T/∆time Heat Up P1, R1 25°C to 160°C 4°C/s Solder Paste Dry P2, R2 160°C to 200°C 0.
PAGE 11
Appendix A: SMT Assembly Application Note Solder Pad, Mask and Metal Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCB Figure 12. Stencil and PCBA. Recommended Land Pattern SHIELD SOLDER PAD CL 1.35 MOUNTING CENTER 1.25 2.05 0.10 0.775 1.75 FIDUCIAL 0.60 0.475 1.425 UNIT: mm 2.375 3.325 Figure 13. Stencil and PCBA.
PAGE 12
Recommended Metal Solder Stencil Aperture APERTURES AS PER LAND DIMENSIONS It is recommended that only a 0.152 mm (0.006 inches) or a 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See the table below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. t w Aperture opening for shield pad is 2.7 mm x 1.25 mm as per land pattern. l Figure 14.
PAGE 13
Appendix B: PCB Layout Suggestion The following PCB layout guidelines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: tion. CX1 is generally a ceramic capacitor of low inductance providing a wide frequency response while CX2 and CX3 are tantalum capacitors of big volume and fast frequency response. The use of a tantalum capacitor is more critical on the Vled line, which carries a high current.
PAGE 14
Appendix C: General Application Guide for the HSDL-3220 Description The HSDL-3220, a low-cost and small form factor infrared transceiver, is designed to address the mobile computing market such as PDAs, as well as small-embedded mobile products such as digital cameras and cellular phones. It is fully compliant to IrDA 1.4 low power specification from 9.6 kbit/s to 4.0 Mbit/s, and supports HP‑SIR and TV Remote modes.
PAGE 15
LCD Panel ROM IR RAM CPU for embedded application Touch Panel PCMCIA Controller RS232C Driver COM Port PDA Platform Figure 18. PDA platform. The link distance testing was done using typical HSDL3220 units with SMC’s FDC37C669 and FDC37N769 Super I/O controllers. An IR link distance of up to 50 cm was demonstrated for SIR and FIR speeds.
PAGE 16
Appendix D: Window Designs for HSDL-3220 Optical port dimensions for HSDL‑3220 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30° and the maximum size corresponds to a cone angle of 60°.
PAGE 17
Module Depth (z) mm Aperture Width (x, mm) Max. Min. 0 8.76 6.80 3.66 1.70 1 9.92 7.33 4.82 2.33 2 11.07 7.87 5.97 2.77 3 12.22 8.41 7.12 3.31 4 13.38 8.94 8.28 3.84 5 14.53 9.48 9.43 4.38 6 15.69 10.01 10.59 4.91 7 16.84 10.55 11.74 5.45 8 18.00 11.09 12.90 5.99 9 19.15 11.62 14.05 6.52 APERTURE WIDTH (X) vs. MODULE DEPTH APERTURE HEIGHT (Y) vs. MODULE DEPTH 25 16 14 15 10 X MAX. X MIN.
PAGE 18
Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects.