Datasheet
150
RoHS Compliant, ELV Compliant
12
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
Lead material Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand per IEC-STD 68-2-20, TestTb, Method 1A, Condition B, can withstand 10 seconds at 260°C ±5°C
Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature -40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
BBRF
Physical Characteristics
Environmental Specifications
Test Conditions Resistance Change
Passive aging -40°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±10%
Thermal shock 85°C, -40°C (10 times) ±10%
Solvent resistance MIL-STD-202, Method 215F No change
Lead material RXEF005 : Tin-plated nickel-copper alloy, 0.128mm
2
(26AWG), ø0.40mm (0.016in.)
RXEF010 : Tin-plated nickel-copper alloy, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RXEF017 to 040 : Tin-plated copper-clad steel, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RXEF050 to 090 : Tin-plated copper, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RXEF110 to 375 : Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability per ANSI/J-STD-002 Category 3
RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1
Solder heat withstand RXEF005- RXEF025: per IEC-STD 68-2-20, TestTb, Method 1a, condition a;
can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20,Test Tb, Method 1a, condition b;
can withstand 10 seconds at 260°C ±5°C
Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature -40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
RXEF
Physical Characteristics
Environmental Specifications
Lead material RKEF050 to 090 : Tin-plated copper, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RKEF110 to 500 : Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand RKEF050-RKEF185 : per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;
can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20,Test Tb, Method 1a, condition b;
RKEF can withstand 10 seconds at 260°C ±5°C
Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature -40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
RKEF
Physical Characteristics
Table R5
Physical Characteristics and Environmental Specifications for Radial-leaded Devices