Datasheet

152
RoHS Compliant, ELV Compliant
12
Test Conditions Resistance Change
Passive aging -40°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
Lead material RGEF250: Tin-plated copper-clad steel, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
RGEF300 to RGEF1100 : Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm/0.032in.
RGEF1200 to RGEF1400 : Tin-plated copper, 0.82mm
2
(18AWG), ø1.0mm/0.04in.
Soldering characteristics Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand RGEF250 and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a;
can withstand 5 seconds at 260°C ±5°C
RGEF500 to RGEF1400: per IEC 68-2-20,Test Tb, Method 1a, condition b;
can withstand 10 seconds at 260°C ±5°C
Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature -40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
RGEF
Physical Characteristics
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal shock 125°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
Lead material RHEF050 to RHEF200 : Tin-plated copper clad steel, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
RHEF300 to RHEF1100 : Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm/0.032in.
RHEF1300 to RHEF1500 :Tin-plated copper, 0.82mm
2
(18AWG), ø1.0mm/0.04in.
Soldering characteristics Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ±5°C
Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature -40°C~125°C
Note: Devices are not designed to be placed through a reflow process.
RHEF
Physical Characteristics
Environmental Specifications
Storage Conditions for Radial-leaded Devices
Storage conditions 40°C max., 70% RH max.; devices should remain in original sealed bags prior to use.
Devices may not meet specificed values if these storage conditions are exceeded.
Note: For the TR devices series, see the telecommunications and networking devices section.
Table R5
Physical Characteristics and Environmental Specifications for Radial-leaded Devices Cont’d