Data Sheet

Technical Data Sheet
LOCTITE
®
4850™
January-2008
PRODUCT DESCRIPTION
LOCTITE
®
4850™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl / butyl cyanoacrylate
Appearance (uncured) Clear colorless liquid
LMS
Components One part - requires no mixing
Viscosity Medium
Cure Humidity
Application Bonding
Key Substrates Leather, Fabric and Paper
LOCTITE
®
4850™ is designed for the assembly of difficult to
bond materials and is specifically formulated to provide flexible
bondlines. The product provides rapid bonding of a wide range
of materials, including metals, plastics and elastomers. When
used to bond rubbers, for example, this product maintains the
full compressibility of the joint. LOCTITE
®
4850™ is
particularly suited for bonding porous or absorbent materials
such as paper, leather and fabrics.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1
Flash Point - See SDS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 100 s
-1
250 to 500
LMS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Paper ≤15
LMS
Steel (grit blasted) 5 to 15
Aluminum (grit blasted) 5 to 20
Steel (degreased) 5 to 30
Aluminum (degreased) 5 to 15
Zinc dichromate 5 to 20
Rubber, nitrile 5 to 15
ABS 3 to 5
PVC 3 to 10
Polycarbonate 3 to 10
Epoxy FR4 <3
Leather 5 to 20
Wood (teak) 30 to 75
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K
-1
100×10
-6
Glass Transition Temperature, ASTM E 228,
°C
60
Shore Hardness, ISO 868, Durometer A 80 to 90
Tensile Modulus, ISO 527-3 N/mm² 515 to 675
(psi) (74,695 to 97,900)
Electrical Properties:
Volume Resistivity, IEC 60093, Ω·cm 332×10
12
Surface Resistivity, IEC 60093, Ω >1×10
15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
Dielectric Constant / Dissipation Factor, IEC 60250:
0.1-kHz 1.09 / <0.05
100-kHz 1.03 / <0.05
1,000-kHz 0.1 / <0.05
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 30 seconds @ 22 °C
Tensile Strength, ISO 6922:
Buna-N N/mm² ≥7
(psi) (≥1,015)
Cured for 7 days @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 11 to 15
(psi) (1,595 to 2,175)
Aluminum (grit blasted) N/mm² 10 to 14
(psi) (1,450 to 2,030)
Zinc dichromate N/mm² 6 to 12
(psi) (870 to 1,740)
ABS N/mm² 7 to 9
(psi) (1,015 to 1,305)
PVC N/mm² 3 to 7
(psi) (435 to 1,015)