Datasheet

DS207 LUXEON 3030 2D Product Datasheet 20150319 ©2015 Lumileds Holding B.V. All rights reserved. 6
Reow Soldering Characteristics
Table 5.
Prole Feature Lead Free Assembly
Preheat/Soak:
Temperature Min ( T
smin
)
Temperature Max ( Ts
max
)
Maximum Time (ts) from Ts
min
to Ts
max
150°C
200°C
120 seconds
Ramp-Up Rate ( T
L
to T
p
) 3°C / second
Liquidous Temperature (T
L
) 217°C
Maximum Time ( t
L
) Maintained T
L
150 seconds
Maximum Peak Package Body Temperature ( T
P
) 260°C
Time ( t
p
) Within 5°C of the Specied Temperature ( T
C
) 10 - 30 seconds
Maximum Ramp-Down Rate ( T
p
to T
L
) 6°C / second
Maximum Time 25°C to Peak Temperature 8 minutes
Note for Table 5:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Figure 1. Temperature Prole for Table 5.