User`s manual

V1.2 – May-11 User’s Manual Page 25 of 37
7 Mounting
This chapter describes the suggested mounting process for the A2100-A receiver
modules. In a RoHS compliant product with a RoHS compliant process it is
recommended to use chemical tin as the counter-part to the module’s pins. This will
guarantee highest resistance against shocks.
7.1 Proposed Footprint for Soldering
Following soldering footprint parameters are recommended:
• Copper and solder paste footprint are identical
• Pad-shape / -size, inner pads: 1.5 mm x 1.5 mm
• Pad-shape / -size, outer pads: 1.0 mm x 0.8 mm
• Stencil thickness of 120 – 150 µm
7.2 Recommended Profile for Reflow Soldering
Typical values for reflow soldering of the module in convection or IR/convection
ovens are as follows (according to IPC/JEDEC J-STD-020D):
Parameter Value
Peak temperature (RoHS compliant process) 245°C
Average ramp up rate to peak (217°C to Peak) 3°C / second max.
Preheat temperature min=150°C; max=200°C
Ramp up time from min. to max. preheat temperature 60 … 120 seconds
Temperature maintained above 217°C 60 … 150 seconds
Time within 5°C of actual peak temperature 30 seconds
Ramp down rate 6°C / second max.
Time 25°C to peak temperature 8 minutes max.
Table 11: Reflow soldering profile A2100-A/B
The solder pads hold solder of a thickness of about 150 µm for improved solder
process results.
As results of soldering may vary among different soldering systems and types of
solder and depend on additional factors like density and types of components on
board, the values above should be considered as a starting point for further
optimization.