User Manual

Low Temperature
Cofired Ceramics Series
CUTTUNG-EDGE TECHNOLOGY OF RF SOLUTION
MAG.LAYERS
BBF Series
1
LTCC 低温共烧陶
Feature 特点
特点特点
特点
Compact Size 体积小
体积小体积小
体积小
Miniaturized SMD packaged in low profile and lightweight.
Low Loss
插入损耗
低插入损耗低插入损耗
低插入损耗
Low insertion loss, high attenuation.
High Soldering Heat Resistance 耐高温表面焊接
耐高温表面焊接耐高温表面焊接
耐高温表面焊接
High quality termination allows both flow and re-flow soldering methods to be applied.
High Performance 特性优良
特性优良特性优良
特性优良
Eliminate noise over a wide frequency range. Idea for high frequency and space limited
designs.
Available in tape and reel packaging for automatic mounting 卷轴包装适用於
卷轴包装适用於卷轴包装适用於
卷轴包装适用於表面贴片技术
表面贴片技术表面贴片技术
表面贴片技术
Product Identification 产品型号
产品型号产品型号
产品型号
B B F 1 6 0 8 # # # x x A 1 -
Product Code
Dimension Code
Series Type (### represents center frequency and xx represents material type)
Design Code
Pattern Code

Summary of content (3 pages)