Instruction Manual

ManualsBrandsMag Layers USA ManualsHardwareMHSC-1608C

(1) SHAPES AND DIMENSIONS

A : 1.65 ± 0.15 mm

B : 1.05 ± 0.15 mm

C : 0.82 ± 0.20 mm

D : 0.45 ± 0.25 mm

E : 0.33 ± 0.10 mm

F : 0.89 ± 0.10 mm

G : 0.90 ± 0.10 mm

(2) ELECTRICAL SPECIFICATIONS

SEE TABLE 1

TEST INSTRUMENTS

L,Q : HP 4291B IMPEDANCE ANALYZER (or equivalent)

SRF : ENA E5071B NETWORK ANALYZER (or equivalent)

RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3) CHARACTERISTICS

(3)-1 Operate temperature range ...... －40℃～＋125℃

(Including self temp. rise)

(3)-2 Storage temperature range ...... －40℃～＋125℃

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MHSC-1608C-SERIES

MAG.LAYERS

Terminal

No Polarity

Equivalent circuit

Terminal wraparound : Approx.

0.18mm both ends

Summary of content (9 pages)

PAGE 1
(1) SHAPES AND DIMENSIONS C B D E F A A : 1.65 ± 0.15 mm B : 1.05 ± 0.15 mm C : 0.82 ± 0.20 mm D : 0.45 ± 0.25 mm E: 0.33 ± 0.10 mm F: 0.89 ± 0.10 mm G: 0.90 ± 0.10 mm E G Terminal Terminal wraparound : Approx. 0.
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TABLE 1 MAGLAYERS Inductance Percent Quality L,Q Freq. SRF DCR IDC PT/NO. L(nH) Tolerance Min. (MHz) (MHz)Min. (Ω) Max. (mA) Max. MHSC-1608C-1N6□ 1.6 J,K 24 250 12500 0.030 700 MHSC-1608C-1N8□ 1.8 J,K 16 250 12500 0.045 700 MHSC-1608C-2N0□ 2.0 J,K 13 250 12500 0.080 700 MHSC-1608C-2N2□ 2.2 J,K 13 250 12500 0.150 700 MHSC-1608C-3N3□ 3.3 J,K 30 250 5900 0.045 700 MHSC-1608C-3N6□ 3.6 J,K 22 250 5900 0.063 700 MHSC-1608C-3N9□ 3.
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TABLE 1 MAGLAYERS Inductance Percent Quality L,Q Freq. SRF DCR IDC PT/NO. L(nH) Tolerance Min. (MHz) (MHz)Min. (Ω) Max. (mA) Max. MHSC-1608C-68N□ 68 G,J,K 37 200 1700 0.340 600 MHSC-1608C-72N□ 72 G,J,K 34 150 1700 0.490 400 MHSC-1608C-75N□ 75 G,J,K 34 150 1700 0.430 400 MHSC-1608C-79N□ 79 G,J,K 34 150 1700 0.500 400 MHSC-1608C-82N□ 82 G,J,K 34 150 1700 0.540 400 MHSC-1608C-91N□ 91 G,J,K 34 150 1500 0.
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(4) RELIABILITY TEST METHOD Item Solderability Specifications Test conditions The metalized area must have 90% Dip pads in flux and dip in solder pot minimum solder coverage. (96.5 Sn/3.5 Ag solder) at 255°C ±5°C. Resistance to There must be no case deformation Inductors shall be reflowed onto a PC board soldering heat or change in dimensions. using 96.5 Sn/3.5 Ag solder paste. Inductance must not change more Solder process shall be at a maximum than the stated tolerance.
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Item Specifications Test conditions Low There must be no case deformation Inductors shall be subjected to temperature temperature or change in dimensions. -40±2℃ for 48±12 hours. storage Inductance must not change more Measure the test items after leaving the than the stated tolerance. inductors at room temperature and humidity for 1 to 2 hours. Resistance to There must be no case deformation, Inductors must withstand 6 minutes of solvent change in dimensions, or alcohol or water.
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(5) RECOMMENDED SOLDERING CONDITIONS (Please use this product by reflow soldering) (5)-1 RECOMMENDED FOOTPRINT Unit: mm 0.64 0.64 0.64 1.02 (5)-2 RECOMMENED REFLOW PATTERN T e m p e r a tu r e ( ℃ ) S o ld in g 260℃ 300 260 200 P r e h e a tin g N a tu r a l C o o lin g 150 100 50 T im e 1 to 4 m in . 10 sec m o r e th a n 2 m in .
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(6) PACKAGING (6)-1 CARRIER TAPE DIMENSIONS (mm) P P1 P0 W W : 8.0 mm P : 4.0 mm P0 : 4.0 mm P1 : 2.0 mm (6)-2 TAPING DIMENSIONS (mm) There shall not continuation more than two vacancies of the product. (360 mm) Blank Leader. Blank Chip (50 pitches) (70 pitches) (6)-3 REEL DIMENSIONS D C B A A : 180 mm B : 60.0 mm C : 13.0 mm D : 12.0 mm E : 8.4 mm E MAG.
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(6)-4 TOP TAPE PEEL STRENGTH The force for tearing off Top tape is 0.1~0.6(N) in the arrow direction at the following conditions: Temperature : 5 ~ 35℃ Humidity : 45 ~ 85% Atmospheric pressure : 860 ~ 1060 hpa 160 ~ 180。 Top cover tape Base tape (6)-5 QUANTITY 4000 pcs/Reel (6)-6 The products are packaged so that no damage will be sustained.
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TYPICAL ELECTRICAL CHARACTERISTICS MAG.