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SCOPE

：

This specification applies to the Pb Free high current type SMD inductors for

MNR-3015-SERIES

PRODUCT INDENTIFICATION

MNR - 3015 - 1R5 N

① ② ③ ④

① Product Code

② Dimensions Code

③ Inductance Code

④ Tolerance Code

(1) SHAPES AND DIMENSIONS

A: 3.0±0.2 mm

B: 3.0±0.2 mm

C: 1.5±0.1 mm

D: 1.2Typ. mm

E: 0.9Typ. mm

(2) ELECTRICAL SPECIFICATIONS

SEE TABLE 1

TEST INSTRUMENTS

L : HP 4284A PRECISION LCR METER (or equivalent)

SRF : HP 4291B IMPEDANCE ANALYZER (or equivalent)

RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3) CHARACTERISTICS

(3)-1 Ambient temperature ……......... ＋60℃ Max.

(3)-2 Operate temperature range ...... －40℃～＋125℃

(Including self temp. rise)

(3)-3 Storage temperature range ...... －40℃～＋125℃

Page 1/8

MNR-3015-SERIES

MAG.LAYERS

Summary of content (8 pages)

PAGE 1
SCOPE： This specification applies to the Pb Free high current type SMD inductors for MNR-3015-SERIES PRODUCT INDENTIFICATION MNR - 3015 - 1R5 N ① ② ③ ④ ① Product Code ② Dimensions Code ③ Inductance Code ④ Tolerance Code (1) SHAPES AND DIMENSIONS A: 3.0±0.2 mm B: 3.0±0.2 mm C: 1.5±0.1 mm D: 1.2Typ. mm E: 0.9Typ.
PAGE 2
TABLE 1 MAGLAYERS Inductance Percent PT/NO. L(μH) Tolerance MNR-3015-1R0□ 1.0 MNR-3015-1R5□ L Test Rated DC Current SRF(MHz) Resistance Frequency Min. RDC(Ω)±20% IDC1(A) IDC2(A) N 100kHz/0.25V 100 30m 2.10 2.10 1.5 N 100kHz/0.25V 87 40m 1.80 1.82 MNR-3015-2R2□ 2.2 M,N 100kHz/0.25V 64 60m 1.48 1.50 MNR-3015-3R3□ 3.3 M,N 100kHz/0.25V 49 80m 1.21 1.23 MNR-3015-4R3□ 4.3 M,N 100kHz/0.25V 40 0.12 1.02 1.04 MNR-3015-4R7□ 4.7 M,N 100kHz/0.25V 40 0.12 1.
PAGE 3
(4) RELIABILITY TEST METHOD MECHANICAL TEST ITEM Substrate bending SPECIFICATION △L/Lo≦±5% TEST DETAILS The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
PAGE 4
MECHANICAL TEST ITEM SPECIFICATION There shall be Soldering heat no damage or (reflow soldering) problems. Temperature profile of reflow soldering Sodering temperature (℃) Resistance to soldering (Peak temperature 260±3℃ 10 sec 300 250 200 30 sec Min 150 Pre-heating 100 150 ~ 180℃ (230+0 ℃) Slow cooling (Stored at room temperature) 50 2 min 10 sec. 2 min. or more The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time.
PAGE 5
ENVIROMENT CHARACTERISTICS TEST ITEM High temperature SPECIFICATION △L/Lo≦±5% storage The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2℃ and a normal humidity. Low temperature There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour. △L/Lo≦±5% The sample shall be left for 96±4 hours in an atmosphere with storage a temperature of -25±3℃.
PAGE 6
(5) LAND DIMENSION (Ref.) PCB: GLASS EPOXY t＝1.6mm (5)-1 LAND PATTERN DIMENSIONS (STANDARD PATTERN) unit：mm (5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD MAG.
PAGE 7
(6) PACKAGING (6)-1 CARRIER TAPE DIMENSIONS (mm) (6)-2 TAPING DIMENSIONS (mm) Unreeling Direction MAG.
PAGE 8
(6)-3 REEL DIMENSIONS (mm) (6)-4 QUANTITY 1000pcs/Reel The products are packaged so that no damage will be sustained. MAG.