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SCOPE

：

This specification applies to the Pb Free high current type SMD inductors

for MSCD-73-SERIES

PRODUCT INDENTIFICATION

MSCD - 73 - 220 M

① ② ③ ④

① Product Code

② Dimensions Code

③ Inductance Code

④ Tolerance Code

(1) SHAPES AND DIMENSIONS

A: 7.8 ± 0.3 mm

B: 7.2 ± 0.3 mm

C: 4.0 Max. mm

D: 2.6 Typ. mm

(2) ELECTRICAL SPECIFICATIONS

SEE TABLE 1

TEST INSTRUMENTS

L : HP 4284A PRECISION LCR METER (or equivalent)

RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3) CHARACTERISTICS

(3)-1 Ambient temperature ……......... ＋60℃ Max.

(3)-2 Operate temperature range ...... －40℃～＋125℃

(Including self temp. rise)

(3)-3 Storage temperature range ...... －40℃～＋125℃

MSCD-73-SERIES Page 1/8

MAG.LAYERS

Summary of content (8 pages)

PAGE 1
SCOPE： This specification applies to the Pb Free high current type SMD inductors for MSCD-73-SERIES PRODUCT INDENTIFICATION MSCD - 73 - 220 M ① ② ③ ④ ① Product Code ② Dimensions Code ③ Inductance Code ④ Tolerance Code (1) SHAPES AND DIMENSIONS A: 7.8 ± 0.3 mm B: 7.2 ± 0.3 mm C: 4.0 Max. mm D: 2.6 Typ.
PAGE 2
TABLE 1 MAGLAYERS Inductance Percent PT/NO. L(μH) Tolerance MSCD-73-1R0□ 1.0 MSCD-73-3R3□ Test Resistance Rated DC Current Frequency RDC(Ω)Max. IDC(A) M,N 100kHz/0.25V 10.0m 4.60 1R0 3.3 M,N 100kHz/0.25V 20.0m 4.00 3R3 MSCD-73-4R7□ 4.7 M,N 100kHz/0.25V 23.4m 3.70 4R7 MSCD-73-6R8□ 6.8 M,N 100kHz/0.25V 36.0m 3.00 6R8 MSCD-73-100□ 10 M,N 100kHz/0.25V 80.3m 1.44 100 MSCD-73-120□ 12 M,N 100kHz/0.25V 89.7m 1.39 120 MSCD-73-150□ 15 M,N 100kHz/0.25V 0.
PAGE 3
(4) RELIABILITY TEST METHOD MECHANICAL TEST ITEM Substrate bending SPECIFICATION △L/Lo≦±5% TEST DETAILS The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
PAGE 4
MECHANICAL TEST ITEM SPECIFICATION There shall be Soldering heat no damage or (reflow soldering) problems. Temperature profile of reflow soldering Sodering temperature (℃) Resistance to soldering (Peak temperature 260±3℃ 10 sec 300 250 200 30 sec Min 150 Pre-heating 100 150 ~ 180℃ (230+0 ℃) Slow cooling (Stored at room temperature) 50 2 min 10 sec. 2 min. or more The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time.
PAGE 5
ENVIROMENT CHARACTERISTICS TEST ITEM High temperature SPECIFICATION △L/Lo≦±5% storage The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2℃ and a normal humidity. Low temperature There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour. △L/Lo≦±5% The sample shall be left for 96±4 hours in an atmosphere with storage a temperature of -25±3℃.
PAGE 6
(5) LAND DIMENSION (Ref.) PCB: GLASS EPOXY t＝1.6mm (5)-1 LAND PATTERN DIMENSIONS (STANDARD PATTERN) Unit:mm 7.5 Land 3.0 8.0 2.0 R1.0 Part of silk screen (5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD MAG.
PAGE 7
(6) PACKAGING (6)-1 CARRIER TAPE DIMENSIONS (mm) (6)-2 TAPING DIMENSIONS (mm) Unreeling Direction MAG.
PAGE 8
(6)-3 REEL DIMENSIONS (mm) Tape width:16 (6)-4 QUANTITY 1000 pcs/Reel The products are packaged so that no damage will be sustained. MAG.