Manual

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Ⅰ

. SCOPE

：

This specification applies to the Pb Free high current type SMD Coupled inductors for

MSI-101004PF-SERIES-□

Warn : It is here not to use synchronous rectification curcuit！

PRODUCT INDENTIFICATION

MSI - 101004PF - R20 M -E

① ② ③ ④ ⑤

① Product Code

② Dimensions Code

③ Inductance Code

④ Tolerance Code

⑤ Inner Control Code

(1) SHAPES AND DIMENSIONS

A: 9.7±0.3 mm

B: 9.7±0.3 mm

C: 3.7±0.3 mm

D: 2.5±0.3 mm

E: 1.8±0.3 mm

F: 1.55±0.3 mm

G: 5.3±0.3 mm

(2) ELECTRICAL SPECIFICATIONS

SEE TABLE 1

TEST INSTRUMENTS

L : HP 4284A PRECISION LCR METER (or equivalent)

RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3) CHARACTERISTICS

(3)-1 Ambient temperature ……......... ＋60℃ Max.

(3)-2 Operate temperature range ...... －40℃～＋125℃

(Including self temp. rise)

(3)-3 Storage temperature range ...... －40℃～＋125℃

Page 1/8

MSI-101004PF-SERIES-□

MAG.LAYERS

EPOXY

R24

Summary of content (9 pages)

PAGE 1
Ⅰ. SCOPE： This specification applies to the Pb Free high current type SMD Coupled inductors for MSI-101004PF-SERIES-□ Warn : It is here not to use synchronous rectification curcuit！ PRODUCT INDENTIFICATION MSI - 101004PF - R20 M -E ① ② ③ ④ ⑤ ① Product Code ② Dimensions Code ③ Inductance Code ④ Tolerance Code ⑤ Inner Control Code (1) SHAPES AND DIMENSIONS R24 EPOXY A: 9.7±0.3 mm B: 9.7±0.3 mm C: 3.7±0.3 mm D: 2.5±0.3 mm E: 1.8±0.3 mm F: 1.55±0.3 mm G: 5.3±0.
PAGE 2
TABLE Inductance (μH) MAGLAYERS L(1-2),L(4-3) Coupling Inductance Rated DC Current (Max.) Resistance IDC3(A) Marking RDC(mΩ) IDC1(A ) IDC2(A) 2Lk (nH) (1-4)@2-3 (1-4)@2-3 (1-2,4-3) (1-4@2-3 short) (1-2,4-3) short short MSI-101004PF-R20M-E 0.20±20% 100±20% 0.252±8% 20 55 33 R20 MSI-101004PF-R24M-E 0.24±20% 100±20% 0.252±8% 20 55 33 R24 Test Frequency : 100KHz/0.1V ※ IDC1： Based on inductance change (△L/Lo：drop 20% Typ.) @ ambient temp.
PAGE 3
(4) RELIABILITY TEST METHOD MECHANICAL TEST ITEM Substrate bending SPECIFICATION △L/Lo≦±5% TEST DETAILS The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
PAGE 4
MECHANICAL TEST ITEM SPECIFICATION There shall be Soldering heat no damage or (reflow soldering) problems. Temperature profile of reflow soldering Sodering temperature (℃) Resistance to soldering (Peak temperature 260±3℃ 10 sec 300 250 200 30 sec Min 150 Pre-heating 100 150 ~ 180℃ (230+0 ℃) Slow cooling (Stored at room temperature) 50 2 min 10 sec. 2 min. or more The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time.
PAGE 5
ENVIROMENT CHARACTERISTICS TEST ITEM High temperature SPECIFICATION △L/Lo≦±5% storage The sample shall be left for 96±4 hours in an atmospere with a temperature of 125℃ and a normal humidity. Low temperature There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour. △L/Lo≦±5% The sample shall be left for 96±4 hours in an atmosphere with storage a temperature of -25±3℃.
PAGE 6
(5) LAND DIMENSION (Ref.) PCB: GLASS EPOXY t＝1.6mm (5)-1 LAND PATTERN DIMENSIONS(mm) (STANDARD PATTERN) Unit:mm (5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD MAG.
PAGE 7
(6) PACKAGING (6)-1 CARRIER TAPE DIMENSIONS (mm) (6)-2 TAPING DIMENSIONS (mm) Unreeling Direction MAG.
PAGE 8
(6)-3 REEL DIMENSIONS (mm) (6)-4 QUANTITY 900 pcs/Reel The products are packaged so that no damage will be sustained. MAG.
PAGE 9
TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE vs. DC CURRENT@100kHz/1.0V 【2LK】 Ambient Temperature : 25℃ MSI-101004PF-SERIES-□ 0.14 0.12 Inductance(uH) 0.10 0.08 0.06 0.04 0.02 0.00 0 10 20 30 40 50 60 70 80 DC Current(A) Temperature Rise vs. DC Current 【L1 , L2】 MSI-101004PF-SERIES-□ 60 Temperature(℃ ) 50 40 30 20 10 0 0 10 20 DC Current(A) 30 40 M AG .