User Manual

Reflow Soldering
Natural
cooling
245°C
Time(s)
Temperature(°C)
IR Reflow soldering :
Preheat at 3 per second to 217 and using lead free solder ,
IR at 245 for 30seconds Max.
Rework flow:
Component must withstand two IR reflow cycles with a cool down
between cycles
Temperature is measured at the terminal portion of product
(Using thermocoupler for measurement).
This profile is reference data we recommend. Please check in your
actual process.
For reliable soldering, the thickness of solder paste screen should
be over the terminal co-planality.
The cutted end of terminal has no plating
(out of subject of solder ability).
150°C
53sec TYP.
Pre-heating
60sec MIN.
180sec MAX.
3°C /sec MAX.
6°C /sec MAX.
Soldering
200°C
217°C
60sec MIN.
150sec MAX.