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Ⅰ

. SCOPE

：

This specification applies to the Pb Free Ferrite Chip Beads

for SMB-853025

PRODUCT INDENTIFICATION

SMB- 853025

① ②

① Product Code

② Dimensions Code

(1) SHAPES AND DIMENSIONS

A: 8.5±0.3 mm

B: 3.1±0.15 mm

C: 2.54±0.15 mm

D: 1.5 Typ. mm

E: 1.35 Typ. mm

(2) ELECTRICAL SPECIFICATIONS

SEE TABLE 1

TEST INSTRUMENTS

Z : HP 4291B IMPEDANCE ANALYER (or equivalent)

RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3) CHARACTERISTICS

(3)-1 Temperature rise ...................... ＋40℃ Max.

(3)-2 Ambient temperature ................ ＋60℃ Max.

(3)-3 Operate temperature range ...... －40℃～＋85℃

(Including self temp. rise)

(3)-4 Storage temperature range ...... －40℃～＋105℃

SMB-853025 Page 1/7

MAG.LAYERS

Summary of content (8 pages)

PAGE 1
Ⅰ. SCOPE： This specification applies to the Pb Free Ferrite Chip Beads for SMB-853025 PRODUCT INDENTIFICATION SMB- 853025 ① ② ① Product Code ② Dimensions Code (1) SHAPES AND DIMENSIONS A: 8.5±0.3 mm B: 3.1±0.15 mm C: 2.54±0.15 mm D: 1.5 Typ. mm E: 1.35 Typ. mm (2) ELECTRICAL SPECIFICATIONS SEE TABLE 1 TEST INSTRUMENTS Z : HP 4291B IMPEDANCE ANALYER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent) (3) CHARACTERISTICS (3)-1 Temperature rise ...................... ＋40℃ Max.
PAGE 2
TABLE 1 IMPEDANCE (Ω) At 25MHz/0.5V At 100MHz/0.5V DCR(mΩ) Max. 60±25% 90±25% 0.9 MAGLAYERS PT/NO. SMB-853025 IDC (A)Max. 10.0 MAG.
PAGE 3
(4) RELIABILITY TEST METHOD MECHANICAL TEST ITEM SPECIFICATIONS TEST CONDITIONS Solder The product shall be connected to the test Apply cream solder to the printed circuit board . ability circuit board by the fillet (the height Refer to clause 8 for Reflow profile. is 0.2mm). Resistance to There shall be no damage or problems.
PAGE 4
TEST ITEM SPECIFICATIONS TEST CONDITIONS Humidity Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test resistance Insulation resistance and DC resistance on circuit board,the test shall be done. the specification(refer to clause 2-1) Measurement : After placing for 24 hours min. shall be met. Temperature : +60±2℃ , Humidity : 90 to 95 %RH The terminal electrode and the ferrite must Applied voltage : Rated voltage not damaged.
PAGE 5
(5) LAND DIMENSION (Ref.) PCB: GLASS EPOXY t＝1.6mm (5)-1 LAND PATTERN DIMENSIONS (STANDARD PATTERN) Unit: mm (5)-2 FLOW SOLDERING T em p eratu re(℃ ) S o ld in g 260℃ 300 260 200 P reh eatin g N a t u r a l C o o li n g 150 100 50 T im e 1 t o 4 m in . 1 0 sec m o re th an 2 m in . MAG.
PAGE 6
(6) PACKAGING (6)-1 CARRIER TAPE DIMENSIONS (mm) (6)-2 TAPING DIMENSIONS (mm) Unreeling Direction MAG.
PAGE 7
(6)-3 REEL DIMENSIONS (6)-4 QUANTITY 500 pcs/Reel The products are packaged so that no damage will be sustained. MAG.
PAGE 8
TYPICAL ELECTRICAL CHARACTERISTICS Impedance(Ω) 1000 100 10 1 1 10 100 1000 Frequency(MHz) MAG.