Service manual

3-2 TVN_SN

3. The flat pack-IC on the CBA is affixed with glue, so

be careful not to break or damage the foil of each

pin or the solder lands under the IC when

removing it.

With Soldering Iron:

1. Using desoldering braid, remove the solder from

all pins of the flat pack-IC. When you use solder

flux which is applied to all pins of the flat pack-IC,

you can remove it easily. (Fig. S-1-3)

2. Lift each lead of the flat pack-IC upward one by

one, using a sharp pin or wire to which solder will

not adhere (iron wire). When heating the pins, use

a fine tip soldering iron or a hot air desoldering

machine. (Fig. S-1-4)

3. Bottom of the flat pack-IC is fixed with glue to the

CBA; when removing entire flat pack-IC, first apply

soldering iron to center of the flat pack-IC and heat

up. Then remove (glue will be melted). (Fig. S-1-6)

4. Release the flat pack-IC from the CBA using

tweezers. (Fig. S-1-6)

Hot-air

Flat Pack-IC

Desoldering

Machine

CBA

Flat Pack-IC

Tweezers

Masking

Ta pe

Fig. S-1-2

Flat Pack-IC

Desoldering Braid

Soldering Iron

Fig. S-1-3

Fine Tip

Soldering Iron

Sharp

Fig. S-1-4