Datasheet

Intel
®
E8870 Scalable Node Controller (SNC) Datasheet 10-1
Ballout and Package Information 10
10.1 1357-ball OLGA2b Package Information
The 1357-ball OLGA2b package has an exposed die mounted on a package substrate. The
package’s coplanarity has a mean of approximately 8 mils and a tolerance at 4-sigma of
approximately 4 mils. A heatsink, with appropriate interface material and retention capabilities, is
required for proper operation.
Figure 10-1. 1357-ball OLGA2b Package Dimensions – Top View
SNC
Die
49.50mm
0.614in.
0.914in.
27.50mm.
39.50mm
0.679in.0.879in. 39.50mm27.50mm. 49.50mm
Handling Exclusion Area Die Keepout Area
0.100in.
0.100in.
0.200in.0.100in.