Datasheet

71M6xxx Data Sheet
16
DETAIL A
PARTING
LINE
5
5°
+3°
-5°
0.64
+0.25
-0.23
4.6 Package Outline Drawing
Controlling dimensions are in mm.
Figure 8: SOIC-8 Package Outline
BOTTOM VIEW
SIDE VIEW
SEE
DETAIL A
END VIEW
TOP VIEW
5.99
+0.21
-0.05
1.97
2.465
COO
10
4.93 -0.13
+0.05
4
0.41
+0.08
-0.06
9
1.27 BSC
0.33
±0.08
x 45°
1.63 +0.10 -0.08
0.15
+0.1 -
0.023
SEATING
PLANE
1.47
+0.08
-0.07
3.94
+0.05
-0.13
0.20
+0.05
-0.01
4
8
3
LENGTH OF TERMINAL FOR SOLDERING TO SUBSTRATE
5
FORMED LEADS ARE PLANAR WITH RESPECT TO EACH OTHER
WITHIN 0.735 mm AT SEATING PLANE.
8
10
COUNTRY OF ORIGIN LOCATION ON PACKAGE BOTTOM IS
OPTIONAL AND DEPENDS ON ASSEMBLY LOCATION.
PACKAGE IS COMPLIANT WITH JEDEC STANDARD MS-012.
REFERENCE DATUM
3
LENGTH AND WIDTH ARE REFERENCE DATUMS AND DO NOT
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT INCLUDE MOLD
MISMATCH. MEASURED AT THE MOLD PARTING LINE.
PROTRUSIONS DO NOT EXCEED 0.1524 mm AT END AND 0.254
mm AT WINDOW.
4
9
THE APPEARANCE OF PIN #1 I.D. IS OPTIONAL.
DIMENSIONING AND TOLERANCES PER ANSI Y14.5 M - 1982
NOTES: