Datasheet
Table Of Contents
- 1 Hardware Description
- 1.1 Hardware Overview
- 1.2 Analog Front End (AFE)
- 1.3 Digital Computation Engine (CE)
- 1.4 80515 MPU Core
- 1.4.1 Memory Organization and Addressing
- 1.4.2 Special Function Registers (SFRs)
- 1.4.3 Generic 80515 Special Function Registers
- 1.4.4 Special Function Registers (SFRs) Specific to the 71M6531D/F and 71M6532D/F
- 1.4.5 Instruction Set
- 1.4.6 UARTs
- 1.4.7 Timers and Counters
- 1.4.8 WD Timer (Software Watchdog Timer)
- 1.4.9 Interrupts
- 1.5 On-Chip Resources
- 1.5.1 Oscillator
- 1.5.2 Internal Clocks
- 1.5.3 Real-Time Clock (RTC)
- 1.5.4 Temperature Sensor
- 1.5.5 Physical Memory
- 1.5.6 Optical Interface
- 1.5.7 Digital I/O – 71M6531D/F
- 1.5.8 Digital I/O – 71M6532D/F
- 1.5.9 Digital IO – Common Characteristics for 71M6531D/F and 71M6532D/F
- 1.5.10 LCD Drivers – 71M6531D/F
- 1.5.11 LCD Drivers – 71M6532D/F
- 1.5.12 LCD Drivers – Common Characteristics for 71M6531D/F and 71M6532D/F
- 1.5.13 Battery Monitor
- 1.5.14 EEPROM Interface
- 1.5.15 SPI Slave Port
- 1.5.16 Hardware Watchdog Timer
- 1.5.17 Test Ports (TMUXOUT pin)
- 2 Functional Description
- 3 Application Information
- 3.1 Connection of Sensors
- 3.2 Connecting 5-V Devices
- 3.3 Temperature Measurement
- 3.4 Temperature Compensation
- 3.5 Connecting LCDs
- 3.6 Connecting I2C EEPROMs
- 3.7 Connecting Three-Wire EEPROMs
- 3.8 UART0 (TX/RX)
- 3.9 Optical Interface (UART1)
- 3.10 Connecting the V1 Pin
- 3.11 Connecting the Reset Pin
- 3.12 Connecting the Emulator Port Pins
- 3.13 Connecting a Battery
- 3.14 Flash Programming
- 3.15 MPU Firmware
- 3.16 Crystal Oscillator
- 3.17 Meter Calibration
- 4 Firmware Interface
- 4.1 I/O RAM and SFR Map – Functional Order
- 4.2 I/O RAM Description – Alphabetical Order
- 4.3 CE Interface Description
- 5 Electrical Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 Recommended External Components
- 5.3 Recommended Operating Conditions
- 5.4 Performance Specifications
- 5.4.1 Input Logic Levels
- 5.4.2 Output Logic Levels
- 5.4.3 Power-Fault Comparator
- 5.4.4 Battery Monitor
- 5.4.5 Supply Current
- 5.4.6 V3P3D Switch
- 5.4.7 2.5 V Voltage Regulator
- 5.4.8 Low-Power Voltage Regulator
- 5.4.9 Crystal Oscillator
- 5.4.10 LCD DAC
- 5.4.11 LCD Drivers
- 5.4.12 Optical Interface
- 5.4.13 Temperature Sensor
- 5.4.14 VREF
- 5.4.15 ADC Converter, V3P3A Referenced
- 5.5 Timing Specifications
- 5.6 Typical Performance Data
- 5.7 71M6531D/F Package
- 5.8 71M6532D/F Package
- 5.9 Pin Descriptions
- 6 Ordering Information
- 7 Related Information
- 8 Contact Information
- Appendix A: Acronyms
- Appendix B: Revision History
![](/manual/maxim-integrated/71m6531f-im-f/datasheet-english/images/img-37.png)
FDS 6531/6532 005 Data Sheet 71M6531D/F-71M6532D/F
Rev 2 37
The PLL generates a 2x emulator clock which is controlled by the ECK_DIS bit. Since clock noise from
this feature may disturb the ADC, it is recommended that this option be avoided when possible.
The MPU clock frequency CKMPU is determined by another divider controlled by the I/O RAM field
MPU_DIV[2:0] and can be set to MCK/2
(
MPU_DIV
+2)
Hz where MPU_DIV[2:0] varies from 0 to 6. The circuit
also generates the 2 x CKMPU clock for use by the emulator. The emulator clock is not generated when
ECK_DIS is asserted.
During a power-on reset, [M40MHZ, M26MHZ] defaults to [0,0] and the MCK divider is set to divide by 4.
When [M40MHZ, M26MHZ] = [1,0], the CE clock frequency may be set to ~5 MHz (4.9152 MHz) or ~10
MHz (9.8304 MHz), using the I/O RAM register CE10MHZ. In this mode, the ADC and FIR clock frequen-
cies remain at ~ 5 MHz. When [M40MHZ, M26MHZ] = [0,1], the CE, ADC, FIR and MPU clock frequen-
cies are shifted to ~ 6.6 MHz (6.5536 MHz). This increases the ADC sample rate by 33%.
CE codes are tailored to particular CE clock frequencies. Changing the clock frequency for a
particular CE code may render it unusable.
In SLEEP mode, the M40MHZ and M26MHZ inputs to the clock generator are forced low. In BROWNOUT
mode, the clocks are derived from the crystal oscillator and the clock frequencies are scaled by 7/8.
1.5.3 Real-Time Clock (RTC)
The RTC is driven directly by the crystal oscillator. It is powered by the net RTC_NV (battery-backed up
supply). The RTC consists of a counter chain and output registers. The counter chain consists of registers
for seconds, minutes, hours, day of week, day of month, month and year. The RTC is capable of pro-
cessing leap years. Each counter has its own output register. Whenever the MPU reads the seconds
register, all other output registers are automatically updated. Since the RTC clock (RTCLK) is not coherent
to the MPU clock, the MPU must read the seconds register until two consecutive reads are the same (this
requires either 2 or 3 reads). At this point, all RTC output registers will have the correct time. Regardless
of the MPU clock speed, RTC reads require one wait state.
RTC time is set by writing to the registers RTC_SEC[5:0] through RTC_YR. Each write operation must be
preceded by a write operation to the WE register in I/O RAM. The value written to the WE register is
unimportant.
Time adjustments are written to the RTCA_ADJ[6:0], PREG[16:0] and QREG[1:0] registers. Updates to
PREG[16:0] and QREG[1:0] must occur after the one second interrupt and must be finished before reaching
the next one second boundary. The new values are loaded into the counters at the next one second
boundary.
PREG[16:0] and QREG[1:0] are separate registers in the device hardware, but the bits are 16-bit contiguous
so the MPU firmware can treat them as a single register. A single binary number can be calculated and
then loaded into them at the same time.
The 71M6531D/F and 71M6532D/F have two rate adjustment mechanisms. The first is an analog rate
adjustment, using RTCA_ADJ[6:0], which trims the crystal load capacitance. Setting RTCA_ADJ[6:0] to 00
minimizes the load capacitance, maximizing the oscillator frequency. Setting RTCA_ADJ[6:0] to 0x3F
maximizes the load capacitance, minimizing the oscillator frequency. The adjustable capacitance is
approximately:
pF
ADJRTCA
C
ADJ
5.16
128
_
⋅=
The maximum adjustment range is approximately-12 ppm to +22ppm. The precise amount of adjustment
will depend on the crystal properties. The adjustment may occur at any time and the resulting clock
frequency can be measured over a one-second interval.
The second rate adjustment is a digital rate adjust using PREG[16:0] and QREG[1:0], which can be used
to adjust the clock rate up to ± 988 ppm, with a resolution of 3.8 ppm. Updates must occur after a one
second interrupt and must finish before the next one second boundary. The rate adjustment will be
implemented starting at the next one second boundary. Since the LSB results in an adjustment every
four seconds, the frequency should be measured over an interval that is a multiple of four seconds.