Datasheet
Table Of Contents
- 1 Hardware Description
- 1.1 Hardware Overview
- 1.2 Analog Front End (AFE)
- 1.3 Digital Computation Engine (CE)
- 1.4 80515 MPU Core
- 1.4.1 Memory Organization and Addressing
- 1.4.2 Special Function Registers (SFRs)
- 1.4.3 Generic 80515 Special Function Registers
- 1.4.4 Special Function Registers (SFRs) Specific to the 71M6531D/F and 71M6532D/F
- 1.4.5 Instruction Set
- 1.4.6 UARTs
- 1.4.7 Timers and Counters
- 1.4.8 WD Timer (Software Watchdog Timer)
- 1.4.9 Interrupts
- 1.5 On-Chip Resources
- 1.5.1 Oscillator
- 1.5.2 Internal Clocks
- 1.5.3 Real-Time Clock (RTC)
- 1.5.4 Temperature Sensor
- 1.5.5 Physical Memory
- 1.5.6 Optical Interface
- 1.5.7 Digital I/O – 71M6531D/F
- 1.5.8 Digital I/O – 71M6532D/F
- 1.5.9 Digital IO – Common Characteristics for 71M6531D/F and 71M6532D/F
- 1.5.10 LCD Drivers – 71M6531D/F
- 1.5.11 LCD Drivers – 71M6532D/F
- 1.5.12 LCD Drivers – Common Characteristics for 71M6531D/F and 71M6532D/F
- 1.5.13 Battery Monitor
- 1.5.14 EEPROM Interface
- 1.5.15 SPI Slave Port
- 1.5.16 Hardware Watchdog Timer
- 1.5.17 Test Ports (TMUXOUT pin)
- 2 Functional Description
- 3 Application Information
- 3.1 Connection of Sensors
- 3.2 Connecting 5-V Devices
- 3.3 Temperature Measurement
- 3.4 Temperature Compensation
- 3.5 Connecting LCDs
- 3.6 Connecting I2C EEPROMs
- 3.7 Connecting Three-Wire EEPROMs
- 3.8 UART0 (TX/RX)
- 3.9 Optical Interface (UART1)
- 3.10 Connecting the V1 Pin
- 3.11 Connecting the Reset Pin
- 3.12 Connecting the Emulator Port Pins
- 3.13 Connecting a Battery
- 3.14 Flash Programming
- 3.15 MPU Firmware
- 3.16 Crystal Oscillator
- 3.17 Meter Calibration
- 4 Firmware Interface
- 4.1 I/O RAM and SFR Map – Functional Order
- 4.2 I/O RAM Description – Alphabetical Order
- 4.3 CE Interface Description
- 5 Electrical Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 Recommended External Components
- 5.3 Recommended Operating Conditions
- 5.4 Performance Specifications
- 5.4.1 Input Logic Levels
- 5.4.2 Output Logic Levels
- 5.4.3 Power-Fault Comparator
- 5.4.4 Battery Monitor
- 5.4.5 Supply Current
- 5.4.6 V3P3D Switch
- 5.4.7 2.5 V Voltage Regulator
- 5.4.8 Low-Power Voltage Regulator
- 5.4.9 Crystal Oscillator
- 5.4.10 LCD DAC
- 5.4.11 LCD Drivers
- 5.4.12 Optical Interface
- 5.4.13 Temperature Sensor
- 5.4.14 VREF
- 5.4.15 ADC Converter, V3P3A Referenced
- 5.5 Timing Specifications
- 5.6 Typical Performance Data
- 5.7 71M6531D/F Package
- 5.8 71M6532D/F Package
- 5.9 Pin Descriptions
- 6 Ordering Information
- 7 Related Information
- 8 Contact Information
- Appendix A: Acronyms
- Appendix B: Revision History
![](/manual/maxim-integrated/71m6531f-im-f/datasheet-english/images/img-77.png)
FDS 6531/6532 005 Data Sheet 71M6531D/F-71M6532D/F
Rev 2 77
4.2 I/O RAM Description – Alphabetical Order
The following conventions apply to the descriptions in this table:
• Bits with a W (write) direction are written by the MPU into configuration RAM. Typically, they are initially stored in flash memory and copied to
the configuration RAM by the MPU. Some of the more frequently programmed bits are mapped to the MPU SFR memory space. The remaining
bits are mapped to 2xxx.
• Bits with a R (read) direction can be read by the MPU.
• Columns labeled Reset and Wake describe the bit values upon reset and wake, respectively. “NV” in the Wake column means the bit is powered
by the nonvolatile supply and is not initialized. LCD-related registers labeled “L” retain data upon transition from LCD mode to BROWNOUT
mode and vice versa, but do not retain data in SLEEP mode. “–“ means that the value is undefined.
• Write-only bits will return zero when they are read.
Table 55: I/O RAM Description - Alphabetical
Name
Location
Reset
Wake
Dir
Description
ADC_E
2005[3]
0
0
R/W
Enables ADC and VREF. When disabled, removes bias current.
BME
2020[6] 0 – R/W
Battery Measure Enable. When set, a load current is immediately applied to the battery
and it is connected to the ADC to be measured on Alternative Mux Cycles. See the
MUX_ALT bit.
BOOT_SIZE[7:0]
20A7[7:0] 01 01 R/W
End of space reserved for boot program. The ending address of the boot region is
1024*BOOT_SIZE.
CE10MHZ
2000[3] 0 0 R/W
CE clock select. When set, the CE is clocked at 10 MHz. Otherwise, the CE clock
frequency is 5 MHz.
CE_E
2000[4]
0
0
R/W
CE enable.
CE_LCTN[7:0]
20A8[4:0]
31
31
R/W
CE program location. The starting address for the CE program is 1024*CE_LCTN.
CHOP_E[1:0]
2002[5:4] 0 0 R/W
Chop enable for the reference bandgap circuit. The value of CHOP will change on the
rising edge of MUXSYNC according to the value in CHOP_E[1:0]:
00 = toggle, except at the mux sync edge at the end of SUMCYCLE, an alternative
MUX frame is automatically inserted at the end of each accumulation interval.
01 = positive.
10 = reversed.
11 = toggle, no alternative MUX frame is inserted
CHOP_IA
20AC[0] 0 0
R/W
This bit enables chop mode for the IA current channel (71M6532D/F only). CHOP_I_E
must be set also.
CHOP_IB
20AC[4] 0 0
R/W
This bit enables chop mode for the IB current channel (71M6532D/F only). CHOP_I_E
must be set also.
CHOP_I_E
20AB[0]
0
0
R/W
This bit must be set to enable chop mode for the current channels (71M6532D/F only).